Patents by Inventor Chih-Yu Hsu

Chih-Yu Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200105897
    Abstract: A negative capacitance semiconductor device includes a substrate. A dielectric layer is disposed over a portion of the substrate. A ferroelectric structure disposed over the dielectric layer. Within the ferroelectric structure: a material composition of the ferroelectric structure varies as a function of a height within the ferroelectric structure. A gate electrode is disposed over the ferroelectric structure.
    Type: Application
    Filed: September 16, 2019
    Publication date: April 2, 2020
    Inventors: Chi-Hsing Hsu, Sai-Hooi Yeong, Chih-Yu Chang, Ching-Wei Tsai, Kuan-Lun Cheng
  • Publication number: 20200103958
    Abstract: A power management system and a power management method are provided. The power management system includes a host manager and at least one server. The server communicates with the host manager. The server includes at least one processor, at least one voltage regulator, and a voltage regulator controller. The voltage regulator provides an actual power to the corresponding processor. The voltage regulator controller adjusts the actual power provided by the voltage regulator. The host manager controls the voltage regulator controller in the server and uses the voltage regulator controller to adjust the actual power provided by the voltage regulator for managing a power of the processor.
    Type: Application
    Filed: December 4, 2018
    Publication date: April 2, 2020
    Applicant: Wiwynn Corporation
    Inventors: Kui-Yeh Chen, Yi-Chen Luo, Chih-Yuan Hsu, Wei-Yu Chiang, Heng-I Chi
  • Publication number: 20200103633
    Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Inventors: Chih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan, Jen-Hui Lai
  • Publication number: 20200089627
    Abstract: A method for performing adaptive locking range management, an associated data storage device and a controller thereof are provided. The method may include: receiving a security command from outside of the data storage device, wherein the security command is related to changing an old locking range into a new locking range; obtaining a start Logical Block Address (LBA) and a length value of the new locking range according to the security command; determining whether the start LBA of the new locking range is less than an end LBA of the old locking range, and determining whether an end LBA of the new locking range is greater than a start LBA of the old locking range; and in response to both determination results being true, performing data trimming on any respective non-overlapped portions of the new locking range and the old locking range.
    Type: Application
    Filed: July 4, 2019
    Publication date: March 19, 2020
    Inventors: Chih-Yu Lin, Hung-Ting Pan, Sung-Ling Hsu
  • Publication number: 20200081861
    Abstract: A high speed interface connection method used in a high speed interface connection apparatus configured to electrically couple a host terminal having a first connection interface and a device terminal having a second connection interface is provided that includes the steps outlined below. A maximum supported supply power is requested from the host terminal. A dissipated power required by the device terminal in operation is estimated. A host terminal transmission format of the host terminal and a device terminal transmission format of the device terminal in actual operation are respectively determined according to the maximum supported supply power and the dissipated power such that a device dissipated power of the device terminal under actual operation is not larger than a host supply power of the host terminal under actual operation. Communication is performed according to the host terminal transmission format and the device terminal transmission format.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 12, 2020
    Inventors: Chih-Yu HSU, Sung-Kao LIU, Cheng-Yuan HSIAO, Yi-Ting CHIEN, Wei-Hung CHUANG
  • Publication number: 20200064900
    Abstract: A USB interface system capable of automatically adjusting connection speed and power consumption capability and a method thereof are provided. The method includes configuring a slave device to perform a first handshake procedure with a main device, and communicate with the main device by using a first connection specification; detecting a first power-off event by using a slave power detection module; when the first power-off event occurs, recording first power-off information by the memory unit. If the slave device is re-connected to the main device, the slave power detection module is configured to perform a second handshake process with the main device, and determine to re-communicate with the main device in a second connection specification different from the first connection specification according to the first power-off information.
    Type: Application
    Filed: July 1, 2019
    Publication date: February 27, 2020
    Inventors: YI-TING CHIEN, SUNG-KAO LIU, CHENG-YUAN HSIAO, WEI-HUNG CHUANG, CHIH-YU HSU
  • Publication number: 20200054157
    Abstract: A paper straw has an inner tube, an outer tube, and a pattern portion. The inner tube and the outer tube are both tubular bodies formed by spirally winding paper sheets. The pattern portion is disposed between the inner tube and the outer tube. The paper sheets that are used to wind the inner tube and the outer tube have light-transmissive properties. Then the pattern portion can be externally displayed through the outer tube or the inner tube, and this can avoid the pattern portion directly contacting food or human body.
    Type: Application
    Filed: July 23, 2019
    Publication date: February 20, 2020
    Inventors: Chia Lun Wu, Szu I Wu, Po Tsun Wu, Yi Fan Hsu, Chih Chia Liu, Tsai Yu Wu
  • Publication number: 20200050102
    Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Inventors: Peter Yu, Chih-Tung Hsu, Kevin Wang, Chih-Chia Hu, Roger Chen
  • Patent number: 10551905
    Abstract: A data-transmission-format conversion circuit has a first data transmission interface, a second data transmission interface, and a control circuit. The control circuit is coupled to the first data transmission interface and the second data transmission interface for processing data-format conversions between the first data transmission interface and the second data transmission interface. The control circuit is further used to control the second data transmission interface to switch from a first corresponding power mode to a second corresponding power mode when the first data transmission interface is switched from a first power mode to a second power mode. The control circuit is further used to control the second data transmission interface to switch from the first corresponding power mode to a third corresponding power mode when the first data transmission interface is switched from the first power mode to a third power mode.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: February 4, 2020
    Assignee: Realtek Semiconductor Corp.
    Inventors: Cheng-Yuan Hsiao, Sung-Kao Liu, Yi-Ting Chien, Wei-Hung Chuang, Chih-Yu Hsu
  • Patent number: 10553747
    Abstract: A semiconductor device comprises a substrate, a first semiconductor unit on the substrate, and an first adhesion structure between the substrate and the first semiconductor unit, and directly contacting the first semiconductor unit and the substrate, wherein the first adhesion structure comprises an adhesion layer and a sacrificial layer, and the adhesion layer and the sacrificial layer are made of different materials, and wherein an adhesion between the first semiconductor unit and the adhesion layer is different from that between the first semiconductor unit and the sacrificial layer.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: February 4, 2020
    Assignee: Epistar Corporation
    Inventors: Chih-Chiang Lu, Yi-Ming Chen, Chun-Yu Lin, Ching-Pei Lin, Chung-Hsun Chien, Chien-Fu Huang, Hao-Min Ku, Min-Hsun Hsieh, Tzu-Chieh Hsu
  • Publication number: 20200028070
    Abstract: Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of magnetic random access memory (MRAM) cells with a minimum dimension below the lower resolution limit of some optical lithography techniques. A copolymer solution comprising first and second polymer species is spin-coated over a heterostructure which resides over a surface of a substrate. The heterostructure comprises first and second ferromagnetic layers which are separated by an insulating layer. The copolymer solution is subjected to self-assembly into a phase-separated material comprising a pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The first polymer species is then removed, leaving a pattern of micro-domains of the second polymer species. A pattern of magnetic memory cells within the heterostructure is formed by etching through the heterostructure while utilizing the pattern of micro-domains as a hardmask.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Inventors: Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chung-Yi Yu, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 10532925
    Abstract: The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Chih-Yu Wang, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu
  • Patent number: 10529581
    Abstract: Methods for isotropic etching at least a portion of a silicon-containing layer on a sidewall of high-aspect-ratio (HAR) apertures formed on a substrate in a reaction chamber are disclosed. The HAR aperture formed by plasma etching a stack of alternating layers of a first silicon-containing layer and a second silicon-containing layer, the second silicon-containing layer is different from the first silicon-containing layer. The method comprising the steps of: a) introducing a fluorine containing etching gas selected from the group consisting of nitrosyl fluoride (FNO), trifluoroamine oxide (F3NO), nitryl fluoride (FNO2) and combinations thereof into the reaction chamber; and b) removing at least a portion of the second silicon-containing layers by selectively etching the second silicon-containing layers versus the first silicon-containing layers with the fluorine containing etching gas to produce recesses between the first silicon-containing layers on the sidewall of the HAR aperture.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: January 7, 2020
    Assignees: L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude, Air Liquide Electronics U.S. LP
    Inventors: Chih-Yu Hsu, Peng Shen, Takashi Teramoto, Nathan Stafford, Jiro Yokota
  • Publication number: 20190388230
    Abstract: An artificial joint includes a first joint assembly and a second joint assembly. The first joint assembly is adapted to be connected to a first bone and has a first contacting surface, wherein the first contacting surface includes a first convex arc surface, a second convex arc surface, and a third convex arc surface. The second joint assembly is adapted to be connected to a second bone and has a second contacting surface, wherein the second contacting surface is in contact with the first contacting surface and includes a first concave arc surface, a second concave arc surface, and a third concave arc surface, and the first concave arc surface, the second concave arc surface, and the third concave arc surface respectively correspond to the first convex arc surface, the second convex arc surface, and the third convex arc surface.
    Type: Application
    Filed: December 19, 2018
    Publication date: December 26, 2019
    Applicants: Industrial Technology Research Institute, National Taiwan University Hospital
    Inventors: Pei-I Tsai, Hsin-Hsin Shen, Kuo-Yi Yang, De-Yau Lin, Yi-Hung Wen, Chih-Chieh Huang, Wei-Luan Fan, Pei-Yu Chen, Ching-Chi Hsu
  • Patent number: 10515949
    Abstract: An integrated circuit includes a stacked MIM capacitor and a thin film resistor and methods of fabricating the same are disclosed. A capacitor bottom metal in one capacitor of the stacked MIM capacitor and the thin film resistor are substantially at the same layer of the integrated circuit, and the capacitor bottom metal and the thin film resistor are also made of substantially the same materials. The integrated circuit with both of a stacked MIM capacitor and a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shao-Yu Chen, Chih-Ping Chao, Chun-Hung Chen, Chung-Long Chang, Kuan-Chi Tsai, Wei-Kung Tsai, Hsiang-Chi Chen, Ching-Chung Hsu, Cheng-Chang Hsu, Yi-Sin Wang
  • Publication number: 20190379429
    Abstract: A MIMO antenna system and a controlling method thereof are provided. The MIMO antenna system includes a first beam configuration device, a second beam configuration device and a controlling device. The first beam configuration device is used for performing an antenna selection procedure on a plurality of antennas to adjust a beam direction. The second beam configuration device is connected to the first beam configuration device. The second beam configuration device is used for performing a phase shifting procedure to adjust a beam coverage. The controlling device is used for controlling the first beam configuration device and the second beam configuration device.
    Type: Application
    Filed: November 2, 2018
    Publication date: December 12, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsien-Wen CHANG, Chih-Yu CHEN, Shih-Hao FANG, Jen-Yuan HSU
  • Publication number: 20190372634
    Abstract: A communication system and operating method thereof are provided. The communication system includes an intelligent antenna unit which includes a plurality of antennas, an antenna selecting unit, one or more signal processing units and a control unit. The control unit is configured to: set one or more antenna-sectors from the antennas, each of the antenna-sectors includes one or more antennas selected from the antennas. And set a plurality of antenna-sector configurations, each of the antenna-sector configurations includes one or more sectors configured to the signal processing units, wherein the sectors are selected from the antenna-sectors. The control unit selects one of the antenna-sector configurations to operate communication transmission of a user equipment, and each signal processing unit configured to each sector of the selected antenna-sector configuration operating beam sweeping based on a number of antenna beam deployed to the configured each sector.
    Type: Application
    Filed: November 9, 2018
    Publication date: December 5, 2019
    Inventors: Shih-Hao FANG, Jen-Yuan HSU, Chih-Yu CHEN, Hsien-Wen CHANG
  • Patent number: 10497860
    Abstract: Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of magnetic random access memory (MRAM) cells with a minimum dimension below the lower resolution limit of some optical lithography techniques. A copolymer solution comprising first and second polymer species is spin-coated over a heterostructure which resides over a surface of a substrate. The heterostructure comprises first and second ferromagnetic layers which are separated by an insulating layer. The copolymer solution is subjected to self-assembly into a phase-separated material comprising a pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The first polymer species is then removed, leaving a pattern of micro-domains of the second polymer species. A pattern of magnetic memory cells within the heterostructure is formed by etching through the heterostructure while utilizing the pattern of micro-domains as a hardmask.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: December 3, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chung-Yi Yu, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 10491278
    Abstract: A wireless communication device with hybrid beamforming and a control method thereof are provided. The wireless communication device includes a plurality of antennas, a beamforming digital circuit, a plurality of radio frequency (RF) chains, a beamforming analog circuit, a controller and a storage. The RF chains receive signals processed by the beamforming digital circuit to generate antenna signals. The RF chains are connected to a part or all of the antennas through the beamforming analog circuit to transmit the antenna signal to the corresponding antennas. The number of the RF chains is smaller than the number of the antennas. The storage stores a plurality of candidate analog codebooks. The controller selects one of the candidate analog codebooks as a selected analog codebook according to scenario or environmental information, and adjusts the beamforming analog circuit according to the selected analog codebook.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: November 26, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Yu Chen, Hsien-Wen Chang, Jen-Yuan Hsu, Jan-Shin Ho
  • Publication number: 20190326126
    Abstract: Methods for minimizing sidewall damage during low k etch processes are disclosed. The methods etch the low k layers f using the plasma activated vapor of an organofluorine compound having a formula selected from the group consisting of N?C—R; (N@C—)—(R)—(—C?N); Rx[-C?N(Rz)]y; and R(3-a)-N—Ha, wherein a=1-2, x=1-2, y=1-2, z=0-1, x+z=1-3, and each R independently has the formula HaFbCc with a=0-11, b=0-11, and c=0-5.
    Type: Application
    Filed: December 29, 2017
    Publication date: October 24, 2019
    Inventors: Chih-Yu HSU, Peng SHEN, Nathan STAFFORD