Abstract: A memory device may comprise a substrate, a plurality of memory cells, and a header device. The substrate may have a first side and a second side opposite to each other. The plurality of memory cells may be formed on the first side of the substrate. The header device may be formed on the first side of the substrate. The header device can be configured to selectively couple a supply voltage through a first combination of power delivery paths or a second combination of power delivery paths to the plurality of memory cells based on a control signal.

Abstract: A memory array is disclosed. The memory array includes a plurality of memory cells disposed over a substrate. Each of the memory cells is coupled to a corresponding one of a plurality of word lines and a corresponding one of a plurality of bit line pairs. First four of the memory cells that are coupled to four consecutive ones of the word lines and to a first one of the bit line pairs are abutted to one another on the substrate along a single lateral direction.

Abstract: A device includes first and second gate electrodes, a word line and a first metal island. The first gate electrode corresponds to transistors of a memory cell. The second gate electrode is separated from the first gate electrode and corresponds to the transistors. The word line is coupled to the memory cell and located between the first and the second gate electrodes. The first metal island is configured to couple a first power supply to the memory cell. A first boundary of the first metal island is located between first and second boundaries of the first gate electrode and is located between first and second boundaries of the word line, and each of the first boundary of the first gate electrode and the first boundary of the word line is located between first and second boundaries of the first metal island.

Abstract: A method (of manufacturing a memory device) includes forming active regions extending in a first direction; over the active regions, doing as follows including, forming gate structures extending in a second direction perpendicular to the first direction, and forming contact-to-source/drain structures (MD structures) which extend in the second direction and are interspersed among corresponding ones of the gate structures; forming via-to-gate/MD (VGD) structures over corresponding ones of the gate structures and the MD structures; in a first metallization layer over the VGD structures, forming first front-side segments extending in the first direction and including one or more front-side routing (FRTE) segments; under the active regions, forming buried segment-to-source/drain structures (BVD structures); and in a first buried metallization layer under the BVD structures, forming first back-side segments extending in the first direction and including one or more first back-side power grid (BPG) segments.

Abstract: A memory device includes a first word line and a second word line. A first portion of the first word line is formed in a first metal layer, a second portion of the first word line is formed in a second metal layer above the first metal layer, and a third portion of the first word line is formed in a third metal layer below the second metal layer. A first portion of the second word line is formed in the first metal layer. A second portion of the second word line is formed in the second metal layer. The first portion, the second portion, and the third portion of the first word line have sizes that are different from each other, and the first portion and the second portion of the second word line have sizes that are different from each other.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: The present application provides a proximity detection circuit and a proximity detection method with compensation. The proximity detection circuit comprises a detection circuit, a baseline processing circuit and a proximity sensing circuit. The detection circuit generates a detection data and a reference data. The proximity sensing circuit generates a proximity signal according to a proximity threshold, the detection data and a baseline data generated from the baseline processing circuit, and the proximity detection circuit and the proximity detection method compensate the baseline data or the proximity threshold according to the reference data. The condition of misjudgment may be avoided under the influence of environmental factors.

Abstract: A memory device includes a first memory array comprising first memory cells; a second memory array comprising second memory cells; a third memory array comprising third memory cells, the second memory array interposed between the first memory array and the third memory array along a lateral direction; a first bit line segment extending along the lateral direction and coupled to each of the first memory cells; a second bit line segment extending along the lateral direction and coupled to each of the second memory cells; and a third bit line segment extending along the lateral direction and coupled to each of the third memory cells. The first bit line segment is formed in a first metallization layer, the second bit line segment is formed in a second metallization layer, and the third bit line segment is formed in a third metallization layer.

Abstract: A static random access memory includes a first and second memory cell array, a first word line, a bit line, a bit line bar, a primary driver circuit, and a first and second supplementary driver circuit. The first supplementary driver circuit is configured to pull a voltage of a first signal of the bit line or a second signal of the bit line bar to a first voltage level during a write operation in response to a supplementary driver circuit enable signal. The second supplementary driver circuit is configured to sense the voltage of the first or second signal. The second supplementary driver circuit includes a first pass-gate transistor. A first terminal of the first pass-gate transistor is coupled to a reference voltage supply. A second terminal of the first pass-gate transistor is electrically floating. A third terminal of the first pass-gate transistor is coupled to a first node.

Abstract: A semiconductor device includes a first memory cell, a second memory cell, a third memory cell, and a fourth memory cell operatively arranged along a first one of a plurality of columns, and operatively arranged in a first one, a second one, a third one, and a fourth one of a plurality of rows, respectively. The first column operatively corresponds to a first pair of bit lines and a second pair of bit lines. The first to fourth rows operatively correspond to a first word line, a second word line, a third word line, and a fourth word line, respectively. The first pair of bit lines are operatively coupled to the first and second memory cells. The second pair of bit lines are operatively coupled to the third and fourth memory cells.

Abstract: A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.

Abstract: A semiconductor device includes a first memory cell in a 4CPP architecture; a second memory cell formed in the 4CPP architecture and physically disposed next to the first memory cell along a first lateral direction; a first word line extending along the first lateral direction and operatively coupled to the first memory cell; a second word line extending along the first lateral direction and operatively coupled to the first memory cell; a third word line extending along the first lateral direction and operatively coupled to the second memory cell; a fourth word line extending along the first lateral direction and operatively coupled to the second memory cell; a first bit line extending along a second lateral direction perpendicular to the first lateral direction and operatively coupled to the first memory cell; and a second bit line extending along the second lateral direction and operatively coupled to the second memory cell.

Abstract: A memory device includes active regions and gate structures, each of the gate structures is electrically coupled to a first portion of a corresponding active region of the active regions. The memory device includes contact-to-transistor-component structures (MD structures), each of the MD structures is over a second portion of a corresponding active region, and a first MD structure is between adjacent gate structures. The memory device includes via-to-gate/MD (VGD) structures, each of the VGD structures is over to a corresponding gate electrode and MD structure. The memory device includes conductive segments, each of the conductive segments is over and electrically coupled to a corresponding VGD structure. The memory device includes buried contact-to-transistor-component structures (BVD) structures, each of the BVD structures is under a third portion of a corresponding active region.

Abstract: A memory array includes a first memory cell configured to store data, a second memory cell configured to store data and a bit line extending along the first direction, and being over the first memory cell and the second memory cell. The first memory cell and the second memory cell are arranged along a first direction in a first column of memory cells. The bit line includes a first conductor extending in the first direction and being in a first conductive layer, and a second conductor extending in the first direction and being in a second conductive layer different from the first conductive layer.

Abstract: A memory circuit includes a first pull down transistor, a first pass gate transistor coupled to the first pull down transistor, a second pull down transistor, a second pass gate transistor and a first metal contact. The second pull down transistor has a first active region located on a first level. The second pass gate transistor has a second active region located on the first level, and being coupled to the second pull down transistor. The first metal contact extends from the first active region to the second active region, being located on a second level, and electrically coupling a drain of the second pull down transistor to a drain of the second pass gate transistor. The first pass gate transistor, the second pass gate transistor, the first pull down transistor and the second pull down transistor are part of a four transistor (4T) memory cell.

Abstract: A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: A memory array includes a first memory cell configured to store data, a second memory cell configured to store data and a bit line extending along the first direction, and being over the first memory cell and the second memory cell. The first memory cell and the second memory cell are arranged along a first direction in a first column of memory cells. The bit line includes a first conductor extending in the first direction and being in a first conductive layer, and a second conductor extending in the first direction and being in a second conductive layer different from the first conductive layer.

Abstract: A method of forming a memory circuit includes generating a layout design of the memory circuit, and manufacturing the memory circuit based on the layout design. The generating of the layout design includes generating a first active region layout pattern corresponding to fabricating a first active region of a first pull down transistor, generating a second active region layout pattern corresponding to fabricating a second active region of a first pass gate transistor, and generating a first metal contact layout pattern corresponding to fabricating a first metal contact. The first metal contact layout pattern overlaps the cell boundary of the memory circuit and the first active region layout pattern. The first metal contact electrically coupled to a source of the first pull down transistor. The memory circuit being a four transistor (4T) memory cell including a first and second pass gate transistor, and a first and second pull down transistor.

Abstract: A memory device and a method for operating the memory device are provided. The memory device includes a memory cell and a bit line connected to the memory cell. A negative voltage generator is connected to the bit line. The negative voltage generator, when enabled, is operative to provide a first write path for the bit line. A control circuit is connected to the negative voltage generator and the bit line. The control circuit is operative to provide a second write path for the bit line when the negative voltage generator is not enabled.