Patents by Inventor Chih Yu
Chih Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240150316Abstract: Compounds, compositions and methods are provided for modulating the activity of EP2 and EP4 receptors, and for the treatment, prevention and amelioration of one or more symptoms of diseases or disorders related to the activity of EP2 and EP4 receptors. In certain embodiments, the compounds are antagonists of both the EP2 and EP4 receptors.Type: ApplicationFiled: September 14, 2023Publication date: May 9, 2024Inventors: Yalda BRAVO, Austin Chih-Yu CHEN, Jinyue DING, Robert GOMEZ, Heather LAM, Joe Fred NAGAMIZO, Renata Marcella OBALLA, David Andrew POWELL, Tao SHENG
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Patent number: 11978810Abstract: Various embodiments of the present disclosure are directed towards a method for forming a varactor comprising a reduced surface field (RESURF) region. The method includes forming a drift region having a first doping type within a substrate. A RESURF region having a second doping type is formed within the substrate such that the RESURF region is below the drift region. A gate structure is formed on the substrate. A pair of contact regions is formed within the substrate on opposing sides of the gate structure. The contact regions respectively abut the drift region and have the first doping type, and wherein the first doping type is opposite the second doping type.Type: GrantFiled: May 19, 2021Date of Patent: May 7, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Liang-Yu Su, Chih-Wen Yao, Hsiao-Chin Tuan, Ming-Ta Lei
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Patent number: 11978669Abstract: The present disclosure provides a semiconductor structure. The structure includes a semiconductor substrate, a gate stack over a first portion of a top surface of the semiconductor substrate; and a laminated dielectric layer over at least a portion of a top surface of the gate stack. The laminated dielectric layer includes at least a first sublayer and a second sublayer. The first sublayer is formed of a material having a dielectric constant lower than a dielectric constant of a material used to form the second sublayer and the material used to form the second sublayer has an etch selectivity higher than an etch selectivity of the material used to form the first sublayer.Type: GrantFiled: January 4, 2022Date of Patent: May 7, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Lin Chuang, Chia-Hao Chang, Sheng-Tsung Wang, Lin-Yu Huang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
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Patent number: 11978809Abstract: A transient voltage suppression device includes at least one P-type lightly-doped structure and at least one electrostatic discharge structure. The electrostatic discharge structure includes an N-type lightly-doped well, an N-type well, a first P-type heavily-doped area, and a first N-type heavily-doped area. The N-type lightly-doped well is formed in the P-type lightly-doped structure. The N-type well is formed in the N-type lightly-doped well. The doping concentration of the N-type lightly-doped well is less than that of the N-type well. The first P-type heavily-doped area is formed in the N-type well. The first N-type heavily-doped area is formed in the P-type lightly-doped structure.Type: GrantFiled: June 27, 2022Date of Patent: May 7, 2024Assignee: AMAZING MICROELECTRONIC CORP.Inventors: Chih-Wei Chen, Kuan-Yu Lin, Kun-Hsien Lin
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Publication number: 20240142749Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is configured to connect a first optical element, and the first movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly in a first dimension.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Inventors: Chao-Chang HU, Chen-Hsien FAN, Chih-Wen CHIANG, Chien-Yu KAO
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Publication number: 20240147639Abstract: An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.Type: ApplicationFiled: October 4, 2023Publication date: May 2, 2024Applicant: AUO CorporationInventors: Chih-Wen Lu, Fan-Yu Chen, Chun-Yueh Hou, Hsi-Hung Chen
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Publication number: 20240145385Abstract: A memory device includes a plurality of memory cells disposed over a substrate and formed as an array that has a plurality of rows and a plurality of columns. Each of the plurality of memory cells includes a plurality of transistors. A first subset of the plurality of memory cells, that are disposed in first neighboring ones of the plurality of rows, are physically coupled to a corresponding one of a plurality of second interconnect structures that carries a supply voltage through a corresponding one of a plurality of first interconnect structures. The plurality of first interconnect structures extend along a first lateral direction in parallel with a lengthwise direction of a channel of each of the transistors of the memory cells, and the plurality of second interconnect structures, disposed above the plurality of first interconnect structures, extend along a second lateral direction perpendicular to the first lateral direction.Type: ApplicationFiled: February 16, 2023Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsin Nien, Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen
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Patent number: 11973055Abstract: In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second interconnect structure, the sidewall of the first substrate being laterally offset from a sidewall of the second substrate and a sidewall of the second interconnect structure.Type: GrantFiled: July 21, 2022Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu
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Patent number: 11974441Abstract: A 3D memory array in which epitaxial source/drain regions which are horizontally merged and vertically unmerged are used as source lines and bit lines and methods of forming the same are disclosed. In an embodiment, a memory array includes a first channel region over a semiconductor substrate; a first epitaxial region electrically coupled to the first channel region; a second epitaxial region directly over the first epitaxial region in a direction perpendicular to a major surface of the semiconductor substrate; a dielectric material between the first epitaxial region and the second epitaxial region, the second epitaxial region being isolated from the first epitaxial region by the dielectric material; a gate dielectric surrounding the first channel region; and a gate electrode surrounding the gate dielectric.Type: GrantFiled: December 30, 2020Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Feng Young, Sai-Hooi Yeong, Chih-Yu Chang, Chi On Chui, Yu-Ming Lin
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Patent number: 11972537Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.Type: GrantFiled: August 19, 2022Date of Patent: April 30, 2024Assignee: YU JUNG CHANG TECHNOLOGY CO., LTD.Inventors: Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long Chern, Yu-Kai Lin
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Patent number: 11973077Abstract: A device includes a transistor, a backside via, and a pair of sidewall spacers. The transistor includes a gate structure, a channel layer surrounded by the gate structure, and a first source/drain structure and a second source/drain structure connected to the channel layer. The backside via is under and connected to the first source/drain structure and includes a first portion, a second portion between the first portion and the first source/drain structure, and a third portion tapering from the first portion to the second portion in a cross-sectional view. The pair of sidewall spacers are on opposite sidewalls of the second portion of the backside via but not on opposite sidewalls of the first portion of the backside via.Type: GrantFiled: April 21, 2023Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wang-Chun Huang, Hou-Yu Chen, Kuan-Lun Cheng, Chih-Hao Wang
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Publication number: 20240136251Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.Type: ApplicationFiled: January 4, 2024Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
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Publication number: 20240135999Abstract: The present disclosure discloses a memory access interface device. A clock generation circuit generates reference clock signals. Each of access signal transmission circuits each includes a duty cycle adjusting circuit, a duty cycle detection circuit, a frequency division circuit and an asynchronous first-in-first-out circuit. The duty cycle adjusting circuit performs duty cycle adjustment on one of the reference clock signals according to a duty cycle detection signal to generate an output clock signal having a duty cycle. The duty cycle detection circuit detects a variation of the duty cycle to generate the duty cycle detection signal. The frequency division circuit divides a frequency of the output clock signal to generate a read clock signal. The asynchronous first-in-first-out circuit receives an access signal from a memory access controller and outputs an output access signal according to the read clock signal to access the memory device accordingly.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Inventors: FU-CHIN TSAI, GER-CHIH CHOU, CHUN-CHI YU, CHIH-WEI CHANG
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Publication number: 20240134410Abstract: The present disclosure discloses a memory access interface device. A clock generation circuit generates reference signals. A transmitter transmits an output command and address signal to a memory device according to the reference signals. A signal training circuit executes a training process in a training mode that includes steps outlined below. A training signal is generated such that the training signal is transmitted as the output command and address signal. The training signal and the data signal generated by the memory device are compared to generate a comparison result indicating whether the data signal matches the training signal. The comparison result is stored. The clock generation circuit is controlled to modify a phase of at least one of the reference signals to be one of a plurality of under-test phases to execute a new loop of the training process until all the under-test phases are trained.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Inventors: FU-CHIN TSAI, GER-CHIH CHOU, CHUN-CHI YU, CHIH-WEI CHANG, MIN-HAN TSAI
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Publication number: 20240137533Abstract: A method of decoding video data performed by an electronic device is provided. The method receives the video data and determines a block unit from a current frame included in the video data. The method further determines a plurality of luma reconstructed samples in a luma block of the block unit based on the video data and determines a prediction model filter of a prediction model mode for a chroma block of the block unit based on the video data. The method then determines a prediction model filter of a prediction model mode for a chroma block of the block unit based on the video data and reconstruct the chroma block of the block unit by applying the plurality of luma square values and the plurality of luma gradient values to the prediction model filter.Type: ApplicationFiled: September 28, 2023Publication date: April 25, 2024Inventors: CHIH-YU TENG, YU-CHIAO YANG
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Patent number: 11967898Abstract: A soft-switching power converter includes a main switch, an energy-releasing switch, and an inductive coupled unit. The main switch is a controllable switch. The energy-releasing switch is coupled to the main switch. The inductive coupled unit is coupled to the main switch and the energy-releasing switch. The inductive coupled unit includes a first inductance, a second inductance coupled to the first inductance, and an auxiliary switch unit. The auxiliary switch unit is coupled to the second inductance to form a closed loop. The main switch and the energy-releasing switch are alternately turned on and turned off. The auxiliary switch unit is controlled to start turning on before the main switch is turned on so as to provide at least one current path.Type: GrantFiled: January 6, 2022Date of Patent: April 23, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Hung-Chieh Lin, Yi-Ping Hsieh, Jin-Zhong Huang, Hung-Yu Huang, Chih-Hsien Li, Ciao-Yin Pan
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Publication number: 20240128759Abstract: A power conversion device includes a conversion device having includes a first, a second, a third and a fourth converter, and a control unit. The first converter has a first input terminal and a first output terminal; the second converter has a second input terminal and a second output terminal; the first and the second input terminal are electrically connected to a power supply. The third converter has a third input terminal and a third output terminal, the third input terminal is coupled to the first output terminal; the fourth converter has a fourth input terminal and a fourth output terminal; the fourth input terminal is coupled to the second output terminal, and the third output terminal is electrically connected to the fourth output terminal. The control unit is coupled to the conversion device, receives a power request from a load, and controls an output power of the conversion device.Type: ApplicationFiled: October 6, 2023Publication date: April 18, 2024Applicant: LITE-ON Technology CorporationInventors: Lam VU, Yi-Chao FAN, Chih-Yu KUO
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Publication number: 20240128531Abstract: The present disclosure discloses a method for recycling all types of lithium batteries. First, the lithium battery waste is acid-leached to obtain a solution containing most of metal ions. After filtering, the solution is separated from the remaining solids, and then the obtained solution is subjected to separate precipitation many times. After separately adjusting the pH value of the solution many times, adding precipitants with a high selectivity ratio, and matching with filtration and separation reaction, all ions in the lithium battery waste are sequentially precipitated in forms of iron phosphate (FePO4), aluminum hydroxide (Al(OH)3), manganese oxide (MnO2), dicobalt trioxide (cobalt oxide, Co2O3), nickel hydroxide (Ni(OH)2), and lithium carbonate (Li2CO3).Type: ApplicationFiled: September 24, 2023Publication date: April 18, 2024Applicant: Cleanaway Company LimitedInventors: CHIH-HUANG LAI, HSIN-FANG CHANG, TZU-MIN CHENG, YUNG-FA YANG, TSUNG-TIEN CHEN, ZHENG-YU CHENG, CHI-YUNG CHANG
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Publication number: 20240128324Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.Type: ApplicationFiled: November 21, 2022Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
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Publication number: 20240128760Abstract: A power conversion device used in electric vehicles includes a transmission assembly and a power converter. The transmission assembly is detachably connected to the electric vehicle and receives a first power from the battery pack of the electric vehicle. The power converter is electrically connected to the transmission assembly and converts the first power into a second power or a third power. The power converter is configured outside the electric vehicle.Type: ApplicationFiled: October 6, 2023Publication date: April 18, 2024Applicant: LITE-ON Technology CorporationInventors: Lam VU, Yi-Chao FAN, Chih-Yu KUO