Patents by Inventor Chikao Ikenaga
Chikao Ikenaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939658Abstract: A deposition mask according to an embodiment of the present disclosure includes a first surface, a second surface that is located opposite the first surface, and two or more through-holes. Each of the through-holes includes a first recess that is located at the first surface and a second recess that is located at the second surface. The deposition mask has a first mask region having a first surface remaining ratio that represents a remaining area ratio of the second surface and a second mask region having a second surface remaining ratio that represents a remaining area ratio of the second surface and that is higher than the first surface remaining ratio.Type: GrantFiled: April 6, 2022Date of Patent: March 26, 2024Assignee: Dai Nippon Printing Co., Ltd.Inventors: Isao Miyatani, Chikao Ikenaga, Yoko Nakamura, Isao Inoue
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Publication number: 20240060168Abstract: A mask may include a first portion including at least one first through-hole group, and a second portion including at least one second through-hole group located next to the first through-hole group in a first direction. A method of manufacturing the mask may include: a step of preparing a laminated body that includes an original base material and a resist layer; a first exposure process of exposing the resist layer corresponding to the first portion by using a first exposure mask; a second exposure process of exposing the resist layer corresponding to the second portion by using a second exposure mask; a process of developing the resist layer corresponding to the first portion and the resist layer corresponding to the second portion; and a process of etching the original base material through the resist layer corresponding to the first portion and the resist layer corresponding to the second portion.Type: ApplicationFiled: June 22, 2023Publication date: February 22, 2024Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Hideyuki OKAMOTO, Chikao IKENAGA
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Patent number: 11859274Abstract: A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.Type: GrantFiled: February 28, 2023Date of Patent: January 2, 2024Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yasuhiro Uchida, Sachiyo Matsuura, Chikao Ikenaga
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Patent number: 11814719Abstract: A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.Type: GrantFiled: March 18, 2022Date of Patent: November 14, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Chikao Ikenaga, Takanori Maruoka, Sachiyo Matsuura
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Patent number: 11788181Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.Type: GrantFiled: January 31, 2023Date of Patent: October 17, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
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Patent number: 11793014Abstract: A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.Type: GrantFiled: June 2, 2021Date of Patent: October 17, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Chikao Ikenaga, Isao Inoue, Yoko Nakamura
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Publication number: 20230329077Abstract: A method of quality determination of a deposition mask according to the present disclosure includes: a measuring step that measures a dimension X1 from a P1 point to a Q1 point, and a dimension X2 from a P2 point to a Q2 point; and a determining step that determines a quality of a deposition mask, based on the dimension X1 and the dimension X2 measured in the measuring step.Type: ApplicationFiled: June 5, 2023Publication date: October 12, 2023Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Chikao IKENAGA
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Publication number: 20230272517Abstract: A deposition mask includes a metal plate including first and second surfaces located opposite each other, through holes bored through the metal plate from the first surface to the second surface, and a flat region located between two through holes adjacent to each other in a case where the deposition mask is seen from the second surface side. The through holes are arrayed in a staggered arrangement in first and second directions in planar view. The flat region includes first and second flat regions located at first and second sides, respectively, of a first center line. The first center line passes through center points of two through holes adjacent to each other in the first direction. The first and second flat regions include portions in which dimensions of the first and second flat regions in the first direction increase away from the first center line, respectively.Type: ApplicationFiled: February 3, 2023Publication date: August 31, 2023Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yuji ANZAI, Chikao IKENAGA, Isao INOUE
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Patent number: 11739412Abstract: A wall surface of an opening of a deposition mask includes a first wall surface that extends from a first end toward a second surface, a second wall surface that extends from a second end toward a first surface, and a connection at which the first wall surface is connected to the second wall surface. When the opening is viewed from the first surface side along a normal direction of the first surface, the first end of the opening includes a first portion that extends in a first direction and has a first dimension and a second portion that extends in a second direction intersecting the first direction and a second dimension shorter than the first dimension. The first wall surface includes a first wall surface section that extends from the first portion toward the connection and a second wall surface section that extends from the second portion toward the connection. A height of the first wall surface section is lower than a height of the second wall surface section.Type: GrantFiled: March 24, 2020Date of Patent: August 29, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Chikao Ikenaga, Daigo Aoki
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Patent number: 11732347Abstract: A standard mask apparatus includes at least one standard mask including at least one through-hole. The standard mask apparatus may include standard regions each including the at least one through-hole. The standard regions may be arranged in a first direction and in a second direction that intersects with the first direction. A ratio of a dimension of each standard region in the first direction to a dimension of an interval between two of the standard regions in the first direction may be higher than or equal to 0.1. A ratio of a dimension of each standard region in the second direction to a dimension of an interval between the two standard regions in the second direction may be higher than or equal to 0.1.Type: GrantFiled: March 8, 2021Date of Patent: August 22, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hideyuki Okamoto, Chikao Ikenaga, Yoshihiro Baba, Daigo Aoki
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Patent number: 11733607Abstract: A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.Type: GrantFiled: September 24, 2019Date of Patent: August 22, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura
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Patent number: 11732361Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.Type: GrantFiled: October 14, 2020Date of Patent: August 22, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroki Oka, Chikao Ikenaga, Sachiyo Matsuura, Shogo Endo, Chiaki Hatsuta, Asako Narita
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Publication number: 20230203638Abstract: A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.Type: ApplicationFiled: February 28, 2023Publication date: June 29, 2023Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yasuhiro UCHIDA, Sachiyo MATSUURA, Chikao IKENAGA
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Patent number: 11667983Abstract: A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 ?m or more is 50 or more and 3000 or less per 1 mm3 in the sample, and (2) The number of the particles having an equivalent circle diameter of 3 ?m or more is 50 or less per 1 mm3 in the sample.Type: GrantFiled: July 28, 2020Date of Patent: June 6, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroki Oka, Chikao Ikenaga, Sachiyo Matsuura, Shogo Endo, Chiaki Hatsuta, Asako Narita
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Publication number: 20230167539Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.Type: ApplicationFiled: January 31, 2023Publication date: June 1, 2023Applicant: Dai Nippon Printing Co., Ltd.Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
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Patent number: 11649540Abstract: A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.Type: GrantFiled: July 14, 2021Date of Patent: May 16, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yasuhiro Uchida, Sachiyo Matsuura, Chikao Ikenaga
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Patent number: 11608554Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.Type: GrantFiled: February 2, 2022Date of Patent: March 21, 2023Assignee: Dai Nippon Printing Co., Ltd.Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
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Publication number: 20220406853Abstract: An organic device may include a substrate, first electrodes located on top of the substrate, organic layers located on top of the first electrodes, and a second electrode located on top of the organic layers. When seen along a direction normal to the substrate, the organic device may include a display area including a first display area and a second display area. The first display area may include the organic layers distributed at a first density. The second display area may include the organic layers distributed at a second density that is lower than the first density. The second electrode may include a wide-area electrode spreading in a gapless manner in the first display area and two or more electrode lines overlapping the organic layers in the second display area. Each of the electrode lines includes an end connected to the wide-area electrode.Type: ApplicationFiled: June 17, 2022Publication date: December 22, 2022Applicant: Dai Nippon Printing Co., Ltd.Inventors: Isao MIYATANI, Chikao IKENAGA, Yoko NAKAMURA, Isao INOUE
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Patent number: 11501992Abstract: A vapor deposition mask includes a mask main body and a support joined to the mask main body. The mask main body has a first alignment mark whereas the support has a second alignment mark. The first alignment mark and the second alignment are provided at such positions as to overlap with each other in plan view, and either one of the alignment marks is larger than the other of the alignment marks.Type: GrantFiled: January 23, 2020Date of Patent: November 15, 2022Assignee: Dai Nippon Printing Co., Ltd.Inventor: Chikao Ikenaga
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Patent number: 11486031Abstract: The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than ?10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.Type: GrantFiled: July 16, 2021Date of Patent: November 1, 2022Assignee: Dai Nippon Printing Co., Ltd.Inventors: Chikao Ikenaga, Isao Miyatani