Patents by Inventor Chin-an Cheng

Chin-an Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220384728
    Abstract: A polymer, a quantum dot composition, and a light-emitting device employing the same are provided. The polymer includes a first repeat unit that has a structure represented by Formula (I): wherein the definitions of R1, R2, A1, A2, A3, and Z1 and n are as defined in the specification.
    Type: Application
    Filed: April 29, 2022
    Publication date: December 1, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin-Cheng WENG, Po-Jung HSU, Han-Cheng YEH, Yong-Jay LEE, Tzu-Hsing YANG, Jia-Lun LIOU, Chin-Hui CHOU, Chun-Neng KU
  • Publication number: 20220384310
    Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, a conductive structure and at least one via structure. The conductive structure is disposed on an upper surface of the semiconductor substrate. The at least one via structure is disposed in the semiconductor substrate. A portion of the at least one via structure extends beyond the conductive structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chin-Cheng KUO
  • Publication number: 20220382107
    Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Inventors: Wen-Cheng HUANG, Ting-Sheng CHEN, Chia-Chun YANG, Chin-Cheng KUO
  • Patent number: 11515288
    Abstract: A method includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: November 29, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Chuan Chang, Tsei-Chung Fu, Jing-Cheng Lin
  • Patent number: 11514707
    Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: November 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: You-Cheng Jhang, Han-Zong Pan, Wei-Ding Wu, Jui-Chun Weng, Hsin-Yu Chen, Cheng-San Chou, Chin-Min Lin
  • Publication number: 20220372211
    Abstract: A polymer and a light-emitting device employing the same are provided. The polymer includes a first repeat unit with a structure represented by Formula (I): wherein the definitions of R1, R2, A1, A2, A3, and Z1 and n are as defined in the specification. At least one of A1, A2, and A3 is not hydrogen.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 24, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin-Hui CHOU, Han-Cheng YEH, Jia-Lun LIOU, Mei-Rurng TSENG
  • Publication number: 20220376377
    Abstract: In one example in accordance with the present disclosure, an electronic device is described. An example electronic device includes an antenna. The example antenna includes a feed point and a first radiator coupled to the feed point. The example antenna also includes a switch coupled to the first radiator and a second radiator coupled to the switch. The example switch (1) disconnects the first radiator from the second radiator when the electronic device is in a first mode; and (2) connects the first radiator to the second radiator when the electronic device is in a second mode.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Pai-Cheng Huang, Chin-Hung Ma, Po Chao Chen
  • Patent number: 11504690
    Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
  • Patent number: 11508904
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first liner on the MTJ; forming a second liner on the first liner; forming an inter-metal dielectric (IMD) layer on the MTJ, and forming a metal interconnection in the IMD layer, the second liner, and the first liner to electrically connect the MTJ. Preferably, the first liner and the second liner are made of different materials.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: November 22, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11507485
    Abstract: Disclosed is a universal profiling device operable to simulate a performance monitoring unit for a heterogeneous system. The universal profiling device includes a main circuit and a storage circuit. The main circuit is configured to execute at least one of multiple steps including an active data collection step and a passive data collection step. The active data collection step registers a callback function for an event of a designated object according to predetermined setting or user setting, and actively calls the callback function to obtain information of the event. The passive data collection step registers the event of the designated object according to the predetermined setting or user setting and thereby receives the information of the event without requesting the designated object, wherein the information of the event is stored in the storage circuit.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: November 22, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Sheng-Kai Hung, Tsai-Chin Cheng, Yi-Kuan Wu, Ping-Hsiung Chiu
  • Patent number: 11509278
    Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: November 22, 2022
    Assignee: Empass Technology Inc.
    Inventors: Yang-Chih Huang, Ying-Cheng Tseng, Chin-Yi Lin
  • Publication number: 20220367201
    Abstract: A method of reducing corner rounding during patterning of a substrate to form a prescribed pattern comprising a corner includes dividing the pattern into a first pattern and a second pattern, the first pattern forming a first edge of the corner and the second pattern forming a second edge of the corner. At least a portion of the second pattern overlaps the first pattern such that the first edge intersects with the second edge to form a corner of the prescribed pattern. The method further includes forming the first pattern in a first mask layer disposed on a substrate to expose the substrate and forming the second pattern in the first mask layer to expose the substrate. The substrate exposed through the first mask layer is then etched to obtain the pattern.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 17, 2022
    Inventors: Chin-Yuan TSENG, Yu-Tien SHEN, Wei-Liang LIN, Chih-Ming LAI, Kuo-Cheng CHING, Shi-Ning JU, Li-Te LIN, Ru-Gun LIU
  • Publication number: 20220365421
    Abstract: A method for preparing a pellicle assembly includes reducing the thickness of one or more initial membrane(s) to obtain a pellicle membrane. The pellicle membrane is then affixed to a mounting frame to obtain the pellicle assembly. Compressive pressure can be applied to reduce the thickness of the initial membrane(s). Alternatively, the thickness can be reduced by stretching the initial membrane(s) to obtain an extended membrane. A mounting frame is then affixed to a portion of the extended membrane. The mounting frame and the portion of the extended membrane are then separated from the remainder of the extended membrane to obtain the pellicle assembly. The resulting pellicle assemblies include a pellicle membrane that is attached to a mounting frame. The pellicle membrane can be formed from nanotubes and has a combination of high transmittance, low deflection, and small pore size.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 17, 2022
    Inventors: Hsin-Chang Lee, Pei-Cheng Hsu, Ta-Cheng Lien, Li-Jui Chen, Tsai-Sheng Gau, Chin-Hsiang Lin
  • Publication number: 20220365724
    Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.
    Type: Application
    Filed: April 19, 2022
    Publication date: November 17, 2022
    Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
  • Publication number: 20220365420
    Abstract: A pellicle assembly includes a pellicle membrane and a conformal coating on an outer surface of the pellicle membrane. The pellicle membrane can be formed with multiple layers and has a combination of high transmittance, low deflection, and small pore size. The conformal coating is intended to protect the pellicle membrane from damage that can occur due to heat and hydrogen plasma created during EUV exposure.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 17, 2022
    Inventors: Pei-Cheng Hsu, Ta-Cheng Lien, Hsin-Chang Lee, Tsai-Sheng Gau, Chin-Hsiang Lin
  • Patent number: 11498044
    Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing circuits. Each sensing circuit is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements, in a same silicon layer as the rows of heating elements and the columns of heating elements, and configured to generate a bio-sensing signal and a temperature-sensing signal.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
  • Publication number: 20220359010
    Abstract: A method of operating a memory circuit includes generating a first voltage by a first amplifier circuit of a first driver circuit coupled to a first column of memory cells, and generating a first current in response to the first voltage. The first current includes a first set of leakage currents and a first write current. The method further includes generating, by a tracking circuit, a second set of leakage currents configured to track the first set of leakage currents of the first column of memory cells, and mirroring the first current in a first path with a second current in a second path by a first current mirror. The second current includes the second set of leakage currents and a second write current. The first write current corresponds to the second write current. The first set of leakage currents corresponds to the second set of leakage currents.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Chin-I SU, Chung-Cheng CHOU, Yu-Der CHIH, Zheng-Jun LIN
  • Publication number: 20220361377
    Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 10, 2022
    Applicant: Wiwynn Corporation
    Inventors: Yu-Cheng Chu, Chin-Hao Hsu, Tsung-Han Li, Ting-Yu Pai
  • Publication number: 20220361358
    Abstract: An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a liquid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 10, 2022
    Applicant: Wiwynn Corporation
    Inventors: Tsung-Han Li, Chin-Han Chan, Yi Cheng, Ting-Yu Pai
  • Publication number: 20220356571
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Peng-Cheng HONG, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee