Patents by Inventor Chin-an Cheng

Chin-an Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220237360
    Abstract: A method is disclosed herein. The method includes: connecting a first number of elements in an integrated circuit (IC); parameterizing, by a processor, the first number into first parameters; generating, by the processor, second parameters of the IC based on the first parameters; and adjusting the IC based on the second parameters.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsun-Yu YANG, Ren-Hong FU, Chin-Cheng KUO, Jui-Feng KUAN
  • Publication number: 20220213897
    Abstract: The disclosed embodiment is related to a manufacturing method of a die-formed 3-dimensional plastic impeller of a centrifugal pump and the impeller manufactured thereby, including a mold for twisted blade and a mold for impeller outlet, the mold for twisted blade is configured to form a twisted blade portion of each blade of the impeller, the mold for impeller outlet is configured to form a rear portion of each blade, a hub rim part of the impeller, and a shroud rim part of the impeller so that the hub rim part, the shroud rim part, and the blades are formed in a single piece at the same molding process.
    Type: Application
    Filed: September 25, 2019
    Publication date: July 7, 2022
    Inventors: Chih-Hsien SHIH, Chih-Kuan SHIH, Huan-Jan CHIEN, Shu-Yen CHIEN, Chin-Cheng WANG, Yuan Hung Lin, PENG-HSIANG CHEN
  • Publication number: 20220155640
    Abstract: A frame assembly includes a carrier and a frame. The carrier includes a bottom wall, and inner and outer side walls. The bottom wall is formed with an opening. The inner side wall is located in the opening. The inner and outer side walls extend from the bottom wall along an upright direction. The inner and outer side walls respectively include first inner and outer engaging structures. The outer side wall is spaced from the inner side wall. The frame includes a frame body, and inner and outer lateral walls. The inner and outer lateral walls extend from the frame body and respectively include second inner and outer engaging structures. The outer lateral wall is spaced from the inner lateral wall. The first and second inner engaging structures are engaged with each other, and the first and second outer engaging structures are engaged with each other.
    Type: Application
    Filed: December 9, 2021
    Publication date: May 19, 2022
    Inventors: Teng-Yi HUANG, Chih-Chan CHEN, Tsung-Chen TUNG, Che-Chia HSU, Chin-Cheng HSIEH, Yung-Chieh CHAO, Chih-Hung CHUNG
  • Publication number: 20220155963
    Abstract: A file reading method includes following operations: determining, by a processor, whether a file in a SIM card is stored in a non-volatile memory; performing, by the processor, a reading process to read the file from the SIM card if the file is not stored in the non-volatile memory; and storing, by the processor, the file into the non-volatile memory.
    Type: Application
    Filed: March 25, 2021
    Publication date: May 19, 2022
    Inventors: Chin CHENG, Yi-Xin Huang, Xiao-Lu Ma
  • Patent number: 11326975
    Abstract: A method of sensing leaking gas includes controlling the height of a gas injection port in the liquid away from the liquid surface to guide the leaking gas into the liquid through the gas injection port to generate bubbles, and detecting the flow rate of the bubbles generated in the liquid to improve the sensing accuracy of leaking gas.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: May 10, 2022
    Assignee: MAS AUTOMATION CORP.
    Inventors: Chin-Cheng Lu, Cheng-Min Li, Pei-Chih Lin
  • Patent number: 11314914
    Abstract: A method is disclosed herein. The method includes: adjusting first parameters associated with parameterized cells in a netlist of an integrated circuit (IC) to generate second parameters associated with the parameterized cells in the netlist of the IC; updating the netlist of the IC according to the second parameters; and performing a simulation according to the netlist.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 26, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsun-Yu Yang, Ren-Hong Fu, Chin-Cheng Kuo, Jui-Feng Kuan
  • Publication number: 20220118631
    Abstract: A head of chip picker is disclosed. The head has a clipping seat and an elastic block. The clipping seat has a body and two arms. The arms are respectively and downwardly extended from two opposite sides of an inner top surface of the body, so a cavity with a wide-top and narrow-bottom shape is constituted among the inner top surface and the arms. The elastic block matches the cavity and is laterally inserted into the cavity. The elastic block is not deformed after inserting into the cavity and provides a flat bottom surface.
    Type: Application
    Filed: February 24, 2021
    Publication date: April 21, 2022
    Applicant: Powertech Technology Inc.
    Inventors: Wu-Yi CHOU, Kun-Chi HSU, Chin-Ta WU, Yung-Chin SHIH, Chin Cheng LIU, Jentung TSENG
  • Publication number: 20220112137
    Abstract: The present invention utilizes a high-speed intensive mixer in a fluidizing-type, solid-phase, neutralization reactor to blend solid-state alkali hydroxide with any humic acid sources. The final product is a dry humic acid salt. The purpose of this innovative method is to eliminate a series of complicated unit operations commonly employed by the traditional process. These removed steps may include dissolving caustic soda, mixing in a paste-like formation, extrusion, granulation, drying, and grinding, etc. The invention contributes to a simplified flowsheet, resulting in sharply reduced equipment investment, plant space, and labor and energy costs. All of these factors coupled with increased productivity will drastically lower the overall production cost. Also, the reduction of dust pollution will greatly minimize the impact in environmental protection and safety issues.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventor: James Chin Cheng YANG
  • Patent number: 11303378
    Abstract: An optical forwarding device includes a specific optical connector and an optical forwarding module. The optical forwarding module includes first and second optical connectors, first and second wavelength division multiplexers (WDM), and an optical circulator. The first WDM receives and forwards a first optical signal from the first optical connector. The optical circulator includes first, second, and third ports. The first port forwards the first optical signal from the first WDM. The second port forwards the first optical signal from the first port to the optical cable through the specific optical connector, and receives and forwards a second optical signal from the optical cable. The first and second optical signals have a first wavelength. The third port receives and forwards the second optical signal from the second port. The second WDM receives the second optical signal from the third port and sends the same to the second optical connector.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: April 12, 2022
    Assignee: Chunghwa Telecom Co., Ltd.
    Inventors: Hung-Huei Liao, Chin-Cheng Hu
  • Patent number: 11271024
    Abstract: A semiconductor device includes a substrate and a light collimator layer. The substrate has a plurality of pixels. The light collimator layer is disposed on the substrate. The light collimator layer includes a light shielding layer disposed on the substrate, a plurality of transparent pillars disposed in the light shielding layer, and a plurality of optical microlenses disposed on the pixels.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 8, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Hsueh-Jung Lin, Chin-Cheng Li
  • Publication number: 20220046292
    Abstract: A networked system for real-time computer-aided augmentation of a live input video stream includes an endpoint system configured and operative to handle the live input video stream and a live augmented video stream and to provide service access to a video augmentation service for the computer-aided augmentation of the live input video stream. The system further includes a backend system providing service orchestration to orchestrate use and operation of the video augmentation service, and an edge inference system coupled to the endpoint system and to the backend system, the edge inference system being configured and co-operative with the endpoint system to provide the video augmentation service on the live input video stream and thereby generate the live augmented video stream, based on the service orchestration by the backend system.
    Type: Application
    Filed: August 4, 2021
    Publication date: February 10, 2022
    Inventors: Raj Nair, Prabhudev Navali, Sudhir Halbhavi, Chin-Cheng Wu
  • Publication number: 20220046084
    Abstract: Techniques manage cluster resources within an application environment. The techniques involve identifying a group of cluster resources from a plurality of cluster resources of the application environment, the plurality of cluster resources being constructed and arranged to provide a plurality of services. The techniques further involve forming an application slice having the group of cluster resources. The techniques further involve deploying the application slice to provide services. Certain techniques provide a platform that allows operators to build application slices (or application overlays) that are a way of grouping application pods (or containers) based on one or more organizing principles such as velocity of deployment, security, governance, etc.
    Type: Application
    Filed: August 5, 2021
    Publication date: February 10, 2022
    Inventors: Raj Nair, Prabhudev Navali, Sudhir Halbhavi, Chin-Cheng Wu
  • Publication number: 20220046083
    Abstract: A technique performs load balancing self-adjustment within an application environment. The technique involves, while nodes of the application environment load balance traffic among clusters that provide services for an application in accordance with a first load balancing configuration, sensing application environment metrics. The technique further involves performing a self-adjustment operation that generates a second load balancing configuration based on the application environment metrics, the second load balancing configuration being different from the first load balancing configuration. The technique further involves deploying the second load balancing configuration among the nodes to enable the nodes to load balance the traffic among the clusters that provide the services for the application in accordance with second load balancing configuration in place of the first load balancing configuration.
    Type: Application
    Filed: August 4, 2021
    Publication date: February 10, 2022
    Inventors: Raj Nair, Prabhudev Navali, Sudhir Halbhavi, Chin-Cheng Wu
  • Patent number: 11246238
    Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: February 8, 2022
    Assignees: SULFURSCIENCE TECHNOLOGY CO., LTD., MING CHI UNIVERSITY OF TECHNOLOGY
    Inventors: Zhen-Yu Juang, Sung-Yen Wei, Chia-Chin Cheng, Chien-Kuo Hsieh
  • Patent number: 11242292
    Abstract: The present invention utilizes a high-speed intensive mixer in a fluidizing-type, solid-phase, neutralization reactor to blend solid-state alkali hydroxide with any humic acid sources. The final product is a dry humic acid salt. The purpose of this innovative method is to eliminate a series of complicated unit operations commonly employed by the traditional process. These removed steps may include dissolving caustic soda, mixing in a paste-like formation, extrusion, granulation, drying, and grinding, etc. The invention contributes to a simplified flowsheet, resulting in sharply reduced equipment investment, plant space, and labor and energy costs. All of these factors coupled with increased productivity will drastically lower the overall production cost. Also, the reduction of dust pollution will greatly minimize the impact in environmental protection and safety issues.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: February 8, 2022
    Inventor: James Chin Cheng Yang
  • Patent number: 11240352
    Abstract: Robust Header Compression (RoHC) compressors and decompressors are provided. A RoHC compressor includes a memory and a processor. The memory stores multiple contexts and multiple codes or program instructions. The processor executes the codes or the program instructions to perform the following steps: receiving a header flow; freeing at least one of the contexts when free space of the memory is insufficient; compressing the header flow; and transmitting the compressed header flow.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: February 1, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chin Cheng, Xiaolu Ma, Yixin Huang, Runrun Wei, Nengan Gong
  • Publication number: 20210379590
    Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.
    Type: Application
    Filed: June 4, 2020
    Publication date: December 9, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiao-Yen LEE, Ying-Te OU, Chin-Cheng KUO, Chung Hao CHEN
  • Patent number: 11187851
    Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 30, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo
  • Publication number: 20210344733
    Abstract: A software-defined media platform having one or more media processing units that may be dynamically instantiated, interconnected and configured according to changes in demand, resource availability, and other parameters affecting system performance relative to demand. In one example media processing method, a source media stream may be received via multicast or unicast. The source media stream may be processed into one or more levels of work product segments having different media characteristics by a plurality of transcoding processing units, as needed. One or more levels of work product segments, or the source media stream, may be packaged (e.g., including resegmenting) into final work product segments having select media characteristics, which may be uploaded to a cloud storage unit for delivery to end users.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Inventors: Paul Tweedale, Chin-Cheng Wu, Michael Shearer, Tung Ng
  • Patent number: 11152422
    Abstract: A method for forming a semiconductor device is provided. The method includes providing a substrate having a scribe line, forming a sensing pixel array in the substrate, forming a plurality of transparent pillars over the substrate, and forming a light shielding layer over the substrate and the transparent pillars. The sensing pixel array has a plurality of sensing pixels, and each of the transparent pillars is correspondingly disposed on one of the sensing pixels of the sensing pixel array. The method further includes performing a first cutting process to form an opening directly above the scribe line, while leaving the remaining material covering the scribe line, and performing an etching process along the opening to remove the remaining material until the scribe line is exposed.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 19, 2021
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Hsueh-Jung Lin, Chin-Cheng Li