Patents by Inventor Chin-Cheng Kuo
Chin-Cheng Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10999931Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.Type: GrantFiled: October 24, 2019Date of Patent: May 4, 2021Assignee: INNOLUX CORPORATIONInventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
-
Patent number: 10976607Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.Type: GrantFiled: December 2, 2019Date of Patent: April 13, 2021Assignee: INNOLUX CORPORATIONInventors: Wen-Cheng Huang, Ting-Sheng Chen, Chia-Chun Yang, Chin-Cheng Kuo
-
Publication number: 20210082788Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.Type: ApplicationFiled: November 30, 2020Publication date: March 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chung Hao CHEN, Chin-Cheng KUO
-
Patent number: 10854533Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.Type: GrantFiled: February 15, 2019Date of Patent: December 1, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chung Hao Chen, Chin-Cheng Kuo
-
Patent number: 10795200Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.Type: GrantFiled: January 22, 2019Date of Patent: October 6, 2020Assignee: INNOLUX CORPORATIONInventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo, Hsin-Tien Wu, Chih-Jen Chang
-
Publication number: 20200233138Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.Type: ApplicationFiled: January 8, 2020Publication date: July 23, 2020Inventors: Chien-Chih CHEN, Chia-Chun YANG, Chin-Cheng KUO
-
Publication number: 20200201121Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.Type: ApplicationFiled: December 2, 2019Publication date: June 25, 2020Inventors: Wen-Cheng HUANG, Ting-Sheng CHEN, Chia-Chun YANG, Chin-Cheng KUO
-
Publication number: 20200175219Abstract: A method is disclosed herein. The method includes: adjusting first parameters associated with parameterized cells in a netlist of an integrated circuit (IC) to generate second parameters associated with the parameterized cells in the netlist of the IC; updating the netlist of the IC according to the second parameters; and performing a simulation according to the netlist.Type: ApplicationFiled: November 22, 2019Publication date: June 4, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsun-Yu YANG, Ren-Hong FU, Chin-Cheng KUO, Jui-Feng KUAN
-
Publication number: 20200060024Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.Type: ApplicationFiled: October 24, 2019Publication date: February 20, 2020Inventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
-
Patent number: 10531563Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.Type: GrantFiled: October 30, 2017Date of Patent: January 7, 2020Assignee: INNOLUX CORPORATIONInventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
-
Patent number: 10488690Abstract: A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.Type: GrantFiled: August 20, 2018Date of Patent: November 26, 2019Assignee: INNOLUX CORPORATIONInventors: Chih-Chiao Yang, Chia-Chun Yang, Chin-Cheng Kuo, Tong-Jung Wang
-
Patent number: 10472228Abstract: A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.Type: GrantFiled: August 17, 2017Date of Patent: November 12, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chien-Hua Chen, Cheng-Yuan Kung, Che-Hau Huang, Chin-Cheng Kuo
-
Publication number: 20190295926Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.Type: ApplicationFiled: February 15, 2019Publication date: September 26, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chung Hao CHEN, Chin-Cheng KUO
-
Patent number: 10324251Abstract: A display module is provided. The display module includes a backlight module with an upper surface, a display panel opposite to the backlight module, and a glue having a first contact surface and a second contact surface located between the display panel and the backlight module, wherein the first contact surface is in contact with the display panel, the second contact surface is in contact with the upper surface of the backlight module, and there is a gap between the display panel and the backlight module. A method for fabricating a display module is also provided.Type: GrantFiled: November 20, 2017Date of Patent: June 18, 2019Assignee: INNOLUX CORPORATIONInventors: Li-Ling Chen, Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo
-
Patent number: 10317617Abstract: A display device and a method for preparing the same are disclosed. The display device includes a display panel and a backlight module. The backlight module is located below the display panel and includes a back plate, a first adhesive layer, a light emitting module and a reflector. The first adhesive layer is disposed on the back plate and the first adhesive layer includes a first area and a second area. The first area is adjacent to the second area. The light emitting module includes a light emitting unit and a print circuit board. The light emitting unit and the print circuit board are electrically connected, and the print circuit board is disposed in the first area of the first adhesive layer. A part of the reflector is disposed in the second area of the first adhesive layer.Type: GrantFiled: November 20, 2017Date of Patent: June 11, 2019Assignee: INNOLUX CORPORATIONInventors: Chih-Chiao Yang, Chia-Chun Yang, Chin-Cheng Kuo, Jia-Sin Li
-
Publication number: 20190171060Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.Type: ApplicationFiled: January 22, 2019Publication date: June 6, 2019Inventors: Chien-Chih CHEN, Chia-Chun YANG, Chin-Cheng KUO, Hsin-Tien WU, Chih-Jen CHANG
-
Patent number: 10236208Abstract: The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.Type: GrantFiled: June 16, 2016Date of Patent: March 19, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chin-Cheng Kuo, Pao-Nan Lee, Chih-Pin Hung, Ying-Te Ou
-
Patent number: 10234715Abstract: A display device includes a display panel, a light shielding unit, a supporting unit, and a backlight module. The display panel includes a first substrate and a first polarizer. The first substrate has a first surface, and the first surface has a first active area and a first non-active area. The first non-active area is disposed adjacent to the first active area, and the first polarizer is disposed on the first active area. The light shielding unit is disposed on the first non-active area and connected to the first polarizer. The supporting unit is disposed corresponding to the light shielding unit. The backlight module is disposed corresponding to the display panel and includes an optical film. The supporting unit is disposed between the light shielding unit and the optical film, and contacts the light shielding unit and the optical film.Type: GrantFiled: October 25, 2017Date of Patent: March 19, 2019Assignee: Innolux CorporationInventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo, Hsin-Tien Wu, Chih-Jen Chang
-
Publication number: 20190072810Abstract: A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.Type: ApplicationFiled: August 20, 2018Publication date: March 7, 2019Inventors: Chih-Chiao YANG, Chia-Chun YANG, Chin-Cheng KUO, Tong-Jung WANG
-
Publication number: 20190055118Abstract: A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.Type: ApplicationFiled: August 17, 2017Publication date: February 21, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG, Che-Hau HUANG, Chin-Cheng KUO