Abstract: Provided are a negative electrode active material which includes negative electrode active material particles which includes a silicon oxide (SiOx, 0<x?2); and at least one lithium silicate selected from Li2SiO3, Li2Si2O5, and Li4SiO4 in at least a part of the silicon oxide. The negative electrode active material particles have a maximum peak position by a Raman spectrum of more than 460 cm?1 and less than 500 cm?1. Also provided are a method of preparing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.

Abstract: A coupling structure is arranged between a first boundary member and a second boundary member. The coupling structure mainly includes a main coupling unit, a reinforcement unit, and a concrete layer, and the reinforcement unit is arranged on the main coupling unit and surrounds an intermediate area of the main coupling unit, and the main coupling unit and the reinforcement unit are both embedded in the concrete layer. The coupling structure can solve the current design difficulties of short columns and short beams and has excellent seismic performance and higher construction efficiency.

Abstract: A transistor includes a gate structure over a substrate, wherein the substrate includes a channel region. The transistor further includes a source/drain (S/D) in the substrate adjacent to the gate structure. The transistor further includes a lightly doped drain (LDD) region adjacent to the S/D, wherein a dopant concentration in the first LDD is less than a dopant concentration in the S/D. The transistor further includes a doping extension region adjacent the LDD region, wherein the doping extension region extends farther under the gate structure than the LDD region, and a maximum depth of the doping extension region is 10-times to 30-times greater than a maximum depth of the LDD.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: The disclosure provides a charging base. The charging base is applied to electrically connect to an electronic device and charge a stylus. The charging base includes: a base, a connector, a first charging end conductive structure, and a second charging end conductive structure. The base includes a through-hole. The connector is disposed on one side of the base and is used for being electrically connected to the electronic device. The first charging end conductive structure is formed on an upper surface of the base and is electrically connected to the connector. The second charging end conductive structure is formed in the through-hole and is electrically connected to the connector.

Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.

Abstract: A portable information handling system touchpad detects button inputs with a downward press at the touch surface that translates to a central button under the touch surface through a frame biased up by a central beam and plural biasing members. Downward presses at the touch surface off center translate towards the center of the frame to provide a central button input that is attributed with right, left and or center button push input values based upon detection of a location at which the downward press touch is sensed by the touch surface.

Abstract: An information handling system may include a first member, a second member, and one or more hinge assemblies for coupling the first and second members, where the one or more hinge assemblies comprise a central assembly, a first and a second orbit mechanism configured to couple to the first and second members respectively, a first primary shaft coupling a first pair of link bars to the central assembly and to each other, a first secondary shaft coupling the first pair of link bars to each other and to the first orbit mechanism via a first track comprising an elongated opening, a second primary shaft coupling a second pair of link bars to the central assembly and to each other, and a second secondary shaft coupling the second pair of link bars to each other and to the second orbit mechanism via a second track comprising an elongated opening.

Abstract: A semiconductor device includes a first fin, a second fin, and a third fin protruding above a substrate, where the third fin is between the first fin and the second fin; a gate dielectric layer over the first fin, the second fin, and the third fin; a first work function layer over and contacting the gate dielectric layer, where the first work function layer extends along first sidewalls and a first upper surface of the first fin; a second work function layer over and contacting the gate dielectric layer, where the second work function layer extends along second sidewalls and a second upper surface of the second fin, where the first work function layer and the second work function layer comprise different materials; and a first gate electrode over the first fin, a second gate electrode over the second fin, and a third gate electrode over the third fin.

Abstract: An LCD display module includes a polygon flexible printed circuit to produce a thinner display. The polygon flexible printed circuit connects a driver integrated circuit to a printed circuit board assembly and a glass substrate. The polygon flexible printed circuit has a narrow minor end connected to the glass substrate and a wider major end connected to the printed circuit board assembly. Because the polygon flexible printed circuit has different end widths, the polygon flexible printed circuit permits reduced spacing of electronic components in proximity of the narrower minor end. The LCD display module also includes a shielding can in physical communication with the printed circuit board assembly to reduce electromagnetic interference between the printed circuit board and the polygon flexible printed circuit.

Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.

Abstract: An LCD display module uses an ingenious gradient flexible printed circuit to produce a larger and thinner display. The gradient flexible printed circuit connects a driver integrated circuit between a printed circuit board assembly and an ITO circuit on a glass substrate. The gradient flexible printed circuit has a narrow, minor end connected to the ITO circuit and a wider, major end connected to the printed circuit board assembly. Because the gradient flexible printed circuit has different end widths, the gradient flexible printed circuit permits reduced spacing of electronic components in proximity of the narrower minor end. Signaling between the electronic components is improved, and electromagnetic shielding is reduced. The gradient flexible printed circuit also has a smaller dimensional stack, thus allowing for a larger display viewing area and a thinner display.

Abstract: A touch panel device includes a face plate, a bracket, and a PCB. The face plate receives a contact. The bracket includes a permanent magnet affixed to a surface of the bracket. The PCB is positioned proximate to the bracket such that a surface of the PCB is adjacent to the bracket. The PCB includes a Hall sensor collocated proximate to the permanent magnet. The touch panel circuit is coupled to the Hall sensor. When the contact is received at the face plate, the PCB moves closer to the bracket. In response, the touch panel circuit receives a voltage from the Hall sensor, determines a force associated with the contact based upon the voltage, and triggers a haptic feedback response in the bracket.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A display, including a carrying main body, a flexible carrier film, a double-sided tape, and an adhesive layer, is provided. The flexible carrier film includes a first bonding section and a second bonding section respectively disposed on two opposite sides of the carrying main body, and a bending section connected between the first bonding section and the second bonding section. The flexible carrier film has an inner surface and an outer surface opposite to each other. The inner surface has at least one first groove at the bending section. The flexible carrier film has a display layer thereon. At least a part of the display layer is connected to the outer surface at the second bonding section. The double-sided tape is disposed between the first bonding section and the carrying main body. The adhesive layer is disposed between the inner surface and the carrying main body at the bending section.

Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.

Abstract: An information handling system with a wireless charging system or wireless antenna may include a processor; a memory; a power management unit (PMU), an antenna controller to provide instructions to a radio to cause an antenna to transceive wirelessly with a network, or a wireless charging controller to schedule the wireless charging at a charging coil, where the antenna or charging coil are part of a twice-molded modular antenna including: the antenna a charging coil, an antenna holder onto which the antenna is insert molded, and an antenna cover that is molded onto the antenna or charging coil for interference at an antenna window edge surface of a chassis cover of the information handling system.

Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.