Abstract: In some examples a computing device, comprising a battery, a processing resource and a memory resource storing non-transitory machine-readable instructions can cause the processing resource to determine a battery charge capacity of the battery, in response to the battery charge capacity being less than a threshold capacity, cause the battery to charge, and in response to the battery charge capacity being greater than the threshold capacity, compare the battery charge capacity of the computing device with a different battery charge capacity associated with a different computing device, and based on the comparison, cause a charge determination event to occur.

Abstract: The disclosure provides a charging base. The charging base is applied to electrically connect to an electronic device and charge a stylus. The charging base includes: a base, a connector, a first charging end conductive structure, and a second charging end conductive structure. The base includes a through-hole. The connector is disposed on one side of the base and is used for being electrically connected to the electronic device. The first charging end conductive structure is formed on an upper surface of the base and is electrically connected to the connector. The second charging end conductive structure is formed in the through-hole and is electrically connected to the connector.

Abstract: A stylus pen for use with a charging base is provided. The stylus pen includes a pen body, a pen tip, a battery, a first receiving end conductive structure, and a second receiving end conductive structure. The pen body includes an opening to connect to the charging base. The pen tip is connected to the pen body. The battery is disposed in the pen body. The first receiving end conductive structure and the second receiving end conductive structure are disposed in the opening, and are respectively electrically connected to the battery.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: A method for estimating a risk for a subject suffering from encapsulating peritoneal sclerosis is provided, including measuring an expression level of at least one microRNA from a sample of the subject, and the microRNA is selected from miR-17, miR-100, miR-155, miR-202, miR-422a, and miR-483; comparing the expression level of the microRNA in the sample to that of a same miRNA of a control, when the expression level of miRNA in the sample is lower than that of the control, the subject is estimated having the risk of encapsulating peritoneal sclerosis. A kit for estimating a risk for a subject suffering from encapsulating peritoneal sclerosis is also provided, including at least one agent for identifying the at least one microRNA as above mentioned from the sample of the subject.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.

Abstract: This invention is announcing a composition of flavonoid skeleton in the formula I or formula II compound, wherein each of the substituents is given the definition as set forth in the specification and claims. This composition has the capacity to treating or preventing a virus infection in a subject.

Abstract: The invention provides a system capable uploading data into a blockchain, which comprises a data storage device and an electronic device. The data storage device comprises a controller, a plurality of flash memories, and a data transmission interface. The electronic device comprises a processor and a network communication component. The controller calculates a specific data stored in the flash memories by a hash algorithm to obtain a hash data corresponding to the specific data, and transmits the hash data to the electronic device. The processor of the electronic device uploads the hash data to the blockchain by a data chaining program so as to chain the hash data into the blockchain. Accordingly, the system chains the hash data corresponding to the specific data into the blockchain to ensure the security of the specific data in use.

Abstract: The invention discloses a digital signature system. The digital signature system comprises an electronic device and a data storage device. The electronic device generates a specific data by executing a specific operation, and calculates the specific data via a hash algorithm to generate a hash data. The data storage device comprises a controller, a plurality of flash memories, and a data transmission interface. The electronic device transmits the hash data to the data storage device via the transmission interface. The controller comprises a firmware. The firmware reads an unclonable function, and generates a private key according to the unclonable function, and encrypts the hash data by the private key to obtain a digital signature. The data storage device transmits the digital signature to the electronic device via the transmission interface.

Abstract: A chemical mechanical polishing pad conditioner includes a bottom substrate, an intermediate substrate and a diamond film. The intermediate substrate is arranged on the bottom substrate; the intermediate substrate includes a hollow portion and an annular portion surrounding the hollow portion; the annular portion includes a plurality of first polishing areas arranged at intervals along an annular area and a plurality of second polishing areas arranged among the first polishing areas; and the first polishing areas extend along a radial direction on the intermediate substrate. The diamond film is arranged on the intermediate substrate, and the diamond film overlays the first polishing areas and the second polishing areas. The diamond film is provided with a plurality of first surfaces and a plurality of second surfaces, and first polishing tips protruding from the first surfaces and second polishing tips protruding from the second surface are formed on the diamond film.

Abstract: The invention discloses a digital signature system. The digital signature system comprises an electronic device and a data storage device. The electronic device generates a specific data by executing a specific operation, and calculates the specific data via a hash algorithm to generate a hash data. The data storage device comprises a controller, a plurality of flash memories, and a data transmission interface. The electronic device transmits the hash data to the data storage device via the transmission interface. The controller comprises a firmware. The firmware reads an unclonable function, and generates a private key according to the unclonable function, and encrypts the hash data by the private key to obtain a digital signature. The data storage device transmits the digital signature to the electronic device via the transmission interface.

Abstract: A moisture absorbent product prepared according to the present invention is characterized by adjusting a composition ratio of a metal chloride, a metal oxide, a cellulose derivative, and a lipid to a specific range, thereby suppressing corrosion, rust, external leakage of a product due to moisture release in an environment such as high temperature while maintaining a high moisture absorption rate, and minimizing a volume change due to moisture absorption. Thus, the moisture absorbent product can be usefully used as a moisture absorption product embedded in a vehicle lamp.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: A semiconductor device and method of manufacture are provided. In some embodiments a treatment process is utilized to treat a work function layer. The treatment prevents excessive oxidation of the work function layer during subsequent processing steps, such as application of a subsequent photoresist material, thereby allowing the work function layer to be thinner than otherwise.

Abstract: A semiconductor device includes a first fin, a second fin, and a third fin protruding above a substrate, where the third fin is between the first fin and the second fin; a gate dielectric layer over the first fin, the second fin, and the third fin; a first work function layer over and contacting the gate dielectric layer, where the first work function layer extends along first sidewalls and a first upper surface of the first fin; a second work function layer over and contacting the gate dielectric layer, where the second work function layer extends along second sidewalls and a second upper surface of the second fin, where the first work function layer and the second work function layer comprise different materials; and a first gate electrode over the first fin, a second gate electrode over the second fin, and a third gate electrode over the third fin.

Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.

Abstract: A headset includes a curved headband, at least one sliding rod slidably arranged to one end of the headband, at least one suspension bracket rotatably connected to the at least one sliding rod, at least one insertion hole penetrating through the at least one suspension bracket, at least one fastening shaft mounted in the at least one insertion hole, and at least one elastic element. The at least one insertion hole has an assembling end, a buffering end, and a pivot block located between the assembling end and the buffering end. The at least one fastening shaft has a fixing portion, an extending portion, and an interfering portion located between the fixing portion and the extending portion. The pivot block clamps the interfering portion. The at least one elastic element is fastened between the extending portion and the buffering end.

Abstract: An artificial intelligence (AI) calculation circuit is provided. The AI calculation circuit can support various integer and floating-point calculations through the adjustment of circuit configuration. Integer multiplication and floating-point mantissa multiplication share the multiplication unit, integer comparison and floating-point comparison share the same comparison unit, integer addition and floating-point addition share the same addition unit.