Abstract: A headphone includes a base, an accommodating space, a bracket, a circuit board accommodated in the accommodating space, a signal cable, a microphone assembly accommodated in the accommodating space, and a sound chamber unit accommodated in the accommodating space. The base has a sidewall and an outer wall surrounding the accommodating space. A junction portion between the sidewall and the outer wall is recessed inward to form a recess. At least one connection wall has a through hole communicated with the accommodating space. The bracket is received in the recess. The bracket includes an outer cover and an inner cover. A cable path is formed between the outer cover and the inner cover. One end of the bracket has a guiding slot connected to the cable path. The guiding slot is corresponding to the through hole. The signal cable is arranged along the cable path.

Abstract: A data storage device is disclosed. The data storage device comprises a controller and a data storage unit. The controller comprises a firmware. The data storage unit comprises a first system storage sector and a second system storage sector. A state of the first system storage sector is preset as a display state by the firmware, and a state of the second system storage sector is preset as a hidden state by the firmware. The first system storage sector stores an original operating system, and the second system storage sector stores a backup operating system. When the original operating system damages, the firmware will recover the original operating system in the first system storage sector via the backup operating system in the second system storage sector; afterwards, a boot operation can be executed via the original operating system recovered, again.

Abstract: An image positioning system capable of real-time positioning compensation includes a 3D marking device, a photographing device, a 3D scanning device, a beam splitter, and a processing unit. The 3D marking device has a polyhedral cube. The beam splitter is configured to cause the photographing device and the 3D scanning device to capture an image of and scan the 3D marking device respectively from the same field of view. The processing unit is configured to calculate image data and 3D scanning data generated respectively by the photographing device and the 3D scanning device to obtain a positioning compensation amount and perform positioning compensation.

Abstract: A headband structure for headphones, comprising: a headband set, and an adjustment module arranged at an end of the headband set, wherein the adjustment module includes: an earphone hanger which is consisted of a hanger frame, a fixing base arranged at an end of the hanger frame, a spring arranged on the fixing base and a convex face arranged on the spring, a first cap body arranged at a side of the earphone hanger, a wave form fastener arranged on the first cap body to contact with the convex face, a second cap body arranged at another side of the earphone hanger, and a sliding space formed between the first cap body and the second cap body for accommodating an end of the earphone hanger.

Abstract: A method for obtaining ?-oryzanol comprises: (a) extracting an extract from a raw material containing ?-oryzanol by supercritical fluid extraction; (b) separating a pellet from the extract through solid-liquid separation; and (c) obtaining purified ?-oryzanol from the pellet.

Abstract: The embodiments of the present application provide a fixing device and a detection system. The fixing device includes: a bearing disk used for bearing a lapping head, the bearing disk being provided with positioning holes and a first positioning ring, the positioning holes being used for accommodating and fixing a positioning pin of a first type of lapping head, and the first positioning ring being used for fixing a positioning disk of a second type of lapping head.

Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.

Abstract: An electronic device includes a first body, a pivot assembly and a second body. The first body includes a first side and a second side, and the second side includes a groove. The pivot assembly includes a container, a first gear, a second gear and a third gear. The container includes an accommodating space and a side wall. The first gear is disposed in the accommodating space and connected to the groove. The second gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the first gear. The third gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the second gear. The second body is pivotally disposed at the container and connected to the third gear.

Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: A data storage device is disclosed. The data storage device comprises a data storage unit, a data transmission interface, and a microprocessor. The data transmission interface is connected to the data storage unit via a switch. The microprocessor is connected to an input and output device, and connected to the data storage unit via the switch. The microprocessor is configured with an embedded system. When a connection between the data transmission interface and the data storage unit is conducted via the switch, a host is able to read data from or write to the data storage unit via the data transmission interface. Otherwise, when a connection between the microprocessor and the data storage unit is conducted via the switch, the embedded system of the microprocessor can execute an input and output process between the input and output device and the data storage unit.

Abstract: A headset includes a curved headband, at least one sliding rod slidably arranged to one end of the headband, at least one suspension bracket rotatably connected to the at least one sliding rod, at least one insertion hole penetrating through the at least one suspension bracket, at least one fastening shaft mounted in the at least one insertion hole, and at least one elastic element. The at least one insertion hole has an assembling end, a buffering end, and a pivot block located between the assembling end and the buffering end. The at least one fastening shaft has a fixing portion, an extending portion, and an interfering portion located between the fixing portion and the extending portion. The pivot block clamps the interfering portion. The at least one elastic element is fastened between the extending portion and the buffering end.

Abstract: A clamp may include two substantially planar plates opposite from and generally parallel to one another, each plate having a mounting hole formed therein for receiving a fastener, two teeth, each tooth extending from a respective one of the two plates, such that each tooth is generally perpendicular to the plates, and such that each tooth extends towards the other from its respective plate, and a tongue opposite from and mechanically interfaced between the two plates, such that the tongue has a concave curved profile between the plates, and such that when a force is applied in a first direction by a fastener engaging with the clamp through the mounting holes, compression of the plates towards one another causes deflection of the tongue in a second direction substantially perpendicular to the first direction.

Abstract: A method for assembling an information handling system display may include attaching a first side of a strip of double-sided tape to a display panel cover. A display panel may then be aligned with the display panel cover, and, when aligned, the display panel may be in contact with a release paper attached to a second side of the double-sided tape. The release paper may then be removed from the double-sided tape while the display panel is in contact with the release paper. A first surface of the display panel may be attached to the second side of the double-sided tape as the release paper is removed.

Abstract: A keyboard module, adapted to an electronic device, is provided. The keyboard module includes a bottom plate, a flexible circuit layer, a first key structure and a second key structure. The bottom plate includes a first area and a second area. The flexible circuit layer covers the first area and the second area. A first key structure is arranged at the position of the flexible circuit layer corresponding to the first area. A second key structure is arranged at the position of the flexible circuit layer corresponding to the second area. The height of the first key structure is greater than the height of the second key structure. An electronic device with the keyboard module is also provided.

Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.

Abstract: A data compression method for a deep neural network is provided. The data compression method includes following steps. Pleural items of original data are re-mapped according to at least one offset value and a sign value to obtain pleural items of mapped data. A distribution center of the mapped data is aligned with 0 and all of the mapped data are non-negative integers. Pleural data blocks of the mapped data are encoded using at least two encoding modes to generate an encoding data.

Abstract: A headband structure for headphones, comprising: a headband set, and an adjustment module arranged at an end of the headband set, wherein the adjustment module includes: an earphone hanger which is consisted of a hanger frame, a fixing base arranged at an end of the hanger frame, a spring arranged on the fixing base and a convex face arranged on the spring, a first cap body arranged at a side of the earphone hanger, a wave form fastener arranged on the first cap body to contact with the convex face, a second cap body arranged at another side of the earphone hanger, and a sliding space formed between the first cap body and the second cap body for accommodating an end of the earphone hanger.

Abstract: A data protection system is disclosed. The data protection system comprises a cloud management platform and at least one data storage device. The cloud management platform includes a database stored with at least one key. The data storage device includes a data storage unit, a microprocessor, and a network communication component. The microprocessor is communicated with the cloud management platform by the network communication component. The data storage unit comprises a controller and a plurality of flash memories. The flash memories store a plurality of encrypted data. The microprocessor sends a key extraction request including a unique code to the cloud management platform. The cloud management platform selects the key matching to the unique code in the key extraction request from the database, and transmits the selected key to the data storage device. The controller of the data storage device decrypts the encrypted data by the key.