Abstract: An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

Abstract: A stiffener on a semiconductor package substrate includes a plurality of parts that are electrically coupled to the semiconductor package substrate on a die side. Both stiffener parts are electrically contacted through a passive device that is soldered between the two stiffener parts and by an electrically conductive adhesive that bonds a given stiffener part to the semiconductor package substrate. The passive device is embedded between two stiffener parts to create a smaller X-Y footprint as well as a lower Z-direction profile.

Abstract: An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

Abstract: An apparatus is provided which comprises: a first voltage regulator; a second voltage regulator; and a switch to selectively couple the first voltage regulator to the second voltage regulator, such that a first output node of the first voltage regulator is temporarily coupled to a second output node of the second voltage regulator via the switch.

Abstract: Described is an apparatus which comprises: a power supply node; a plurality of inductors inductively coupled with one another, wherein at least one inductor of the plurality is electrically coupled to the power supply node; a plurality of loads; and a plurality of capacitors coupled to the plurality of inductors, respectively, and also coupled to the plurality of loads, respectively.

Abstract: A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.

Abstract: A microelectronic device incorporating an air core inductor having one or more inserts to provide efficiency of the inductor are described. One or more inserts having a selected permeability may be placed within regions defined by coils of the air core inductor. The inserts can be formed of a solid material of the selected permeability or such a material can be applied to other structures, such as circuit components. Other embodiments may be described and/or claimed.

Abstract: A microelectronic device incorporating an air core inductor having one or more inserts to provide efficiency of the inductor are described. One or more inserts having a selected permeability may be placed within regions defined by coils of the air core inductor. The inserts can be formed of a solid material of the selected permeability or such a material can be applied to other structures, such as circuit components. Other embodiments may be described and/or claimed.

Abstract: A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.

Abstract: An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

Abstract: Methods and apparatus relating to a compact partitioned capacitor design for multiple voltage and/or load domains (e.g., with improved decoupling) are described. In an embodiment, a capacitor provides substrate decoupling for a plurality of loads. Moreover, the capacitor is capable of decoupling two or more voltage domains. Furthermore, in some embodiments the capacitor is capable of decoupling two or more voltage domains and mitigating self-noise and/or cross-noise between them. Other embodiments are also disclosed and claimed.