Patents by Inventor Chin-Ming Chen

Chin-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110135977
    Abstract: An automatic battery-overcharge power disconnection device electrically coupled to a battery includes an insulating frame, a space formed by enclosing edges of the frame, two grooves formed on a lateral edge of the frame, a flexible board installed at another opposite lateral edge of the frame, an opening formed at an end of the flexible board, a knife portion disposed on an internal side of the opening; a symmetrically folded electro-conductive thin plate, having two half-plate portions and a folding portion between two half-plate portions, and passed into the opening of flexible board, such that the two half-plate portions are clamped at the flexible board, and the folding portion is situated opposite to the knife portion; two conductive electrodes, each having a connecting portion extended out from the conductive connecting portion freely, disposed in the two grooves respectively, and electrically coupled to the two half-plate portions.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 9, 2011
    Inventors: Chin-Ming CHEN, Xing-Fa LIN
  • Publication number: 20100297494
    Abstract: A battery module includes a battery cell, a flexible shell and a supporting seat. The battery cell has a main body and two electrodes extended outwardly from the main body; the flexible shell has an upper and lower lid plates, both of which are connected and cooperated to each other to envelop the battery cell, and which are provided for the electrodes to extend out and respectively have an upper and lower adhesive parts, both of which are adhered to each other; and, the supporting seat is provided for arranging the flexible shell, in which the flexible shell further has an extending part, which is extended from one of the upper, lower adhesive parts towards the supporting seat and has an adhesive layer adhered to the supporting seat by a thermal pressing process, such that the flexible shell and the supporting seat can be connected securely.
    Type: Application
    Filed: May 21, 2009
    Publication date: November 25, 2010
    Inventor: Chin-Ming CHEN
  • Patent number: 7619888
    Abstract: A heat dissipating module includes a heat dissipating apparatus and a fan. The fan is disposed adjacent to a side of the heat dissipating apparatus. A heat dissipating apparatus includes a flat heat column and a plurality of heat dissipating fins. The heat dissipating fins are disposed at the exterior of the flat heat column. A flat heat column has a pipe-body and a base, and the pipe-body includes a circular sidewall, an open end and a closed end. The base is coupled to the circular sidewall at the open end to form a closed space in the flat heat column, wherein the circular sidewall converges from the open end toward the closed end to form a converging part and a flat part.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: November 17, 2009
    Assignee: Delta Electronics, Inc.
    Inventors: Min-Hui Yu, Chi-Feng Lin, Chin-Ming Chen
  • Publication number: 20090194252
    Abstract: A heat dissipation module includes a heat sink, a two-phase heat exchange device and a supporting element. The two-phase heat exchange device is located between the supporting element and the heat sink. The supporting element receives the two-phase heat exchange device, and the supporting element has a main body including a bottom part and at least two sidewall parts. An accommodating space is formed by the bottom part and the sidewall parts of the main body of the supporting element to receive the two-phase heat exchange device, and the received two-phase heat exchange device is attached to the bottom part of the main body of the supporting element. The two-phase heat exchange device is located and sandwiched between the supporting element and the heat sink.
    Type: Application
    Filed: September 30, 2008
    Publication date: August 6, 2009
    Inventors: Cheng-Chih LEE, Chung-Fa Lee, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20090168351
    Abstract: The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member.
    Type: Application
    Filed: April 14, 2008
    Publication date: July 2, 2009
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Chih-Hao Hsia, Shu-Hui Chan, Hao-Wen Ko
  • Publication number: 20090120613
    Abstract: A heat sink includes a heat conductive portion, a plurality of fins and at least one connecting portion. The fins and connecting portion are disposed around the heat conductive portion. The connecting portion is disposed between the fins and has a fixed part. The fixed part is disposed at one side of the connecting portion and is used for connecting with a fastener.
    Type: Application
    Filed: April 7, 2008
    Publication date: May 14, 2009
    Inventors: Chin-Ming CHEN, Yu-Hung Huang, Alex Hsia, Shu-Hui Chan
  • Publication number: 20090107654
    Abstract: The present invention provides a heat dissipation module, a base thereof and a manufacturing method thereof. The heat dissipation module includes the base having a bottom, a plurality of guiding columns and a plurality of fins. The bottom and the guiding columns are formed as a single piece, and the fins are tightly fitted on the guiding columns.
    Type: Application
    Filed: September 4, 2008
    Publication date: April 30, 2009
    Inventors: Chin-Ming CHEN, Yu-Hung HUANG, Chun-Yang HUNG, Sung-Ching HO
  • Publication number: 20080295994
    Abstract: A heat-dissipating fin assembly including a first fin and a second fin is provided. Each of the first fin and the second fin respectively includes a body, a bending part and a connecting part. The bending part is bent from an end of the body to form a turning portion along a predetermined direction. The connecting part, located near a turning portion of the bending part from the end of the body, extends opposite to the predetermined direction. When the first fin is connected to the second fin, the connecting part of the first fin is connected with the second fin. Also, an assembling method of the heat-dissipating fin assembly is provided.
    Type: Application
    Filed: February 12, 2008
    Publication date: December 4, 2008
    Inventors: Cheng-Chih Lee, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20080295995
    Abstract: A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed.
    Type: Application
    Filed: April 29, 2008
    Publication date: December 4, 2008
    Inventors: Wei-Fang WU, Cheng-Chih Lee, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20080245510
    Abstract: A heat dissipation apparatus includes a plurality of fins and a two-phase heat exchange device connected to the fins. The two-phase heat exchange device includes a main body and a continuous wick structure. The main body forms a closed space therein, and the continuous wick structure is disposed on the entire inner surface of the main body. Methods for manufacturing a two-phase heat exchange device and a heat dissipation apparatus are also introduced.
    Type: Application
    Filed: June 19, 2008
    Publication date: October 9, 2008
    Inventors: Min-Hui YU, Chi-Feng LIN, Chin-Ming CHEN
  • Publication number: 20080170369
    Abstract: A heat dissipating apparatus includes a heat dissipating base and a heat dissipating element. The heat dissipating base includes a heat conducting plate and a heat dissipating plate having a hole. The heat conducting plate is disposed in the hole by a way of fitting with the hole and the outer edge of the heat conducting plate is tightly contacted with the inner wall of the hole. The heat dissipating element is disposed on and connected to the heat dissipating base.
    Type: Application
    Filed: January 2, 2008
    Publication date: July 17, 2008
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Kun-Yu Kuo, Sung-Ching Ho
  • Publication number: 20080130230
    Abstract: A heat dissipating module includes a heat dissipating apparatus and a fan. The fan is disposed adjacent to a side of the heat dissipating apparatus. A heat dissipating apparatus includes a flat heat column and a plurality of heat dissipating fins. The heat dissipating fins are disposed at the exterior of the flat heat column. A flat heat column has a pipe-body and a base, and the pipe-body includes a circular sidewall, an open end and a closed end. The base is coupled to the circular sidewall at the open end to form a closed space in the flat heat column, wherein the circular sidewall converges from the open end toward the closed end to form a converging part and a flat part.
    Type: Application
    Filed: November 19, 2007
    Publication date: June 5, 2008
    Inventors: Min-Hui Yu, Chi-Feng Lin, Chin-Ming Chen
  • Publication number: 20080130229
    Abstract: A heat dissipating module includes a fan and a heat sink. The heat sink comprises a body and at least one movable member. The body comprises a plurality of fins, at least one first slot and at least one second slot. The first and second slots are integrally formed on the body as a single piece. The movable member, rotatably or movably coupled to the first slot, comprises a pivoting portion, an operating portion, a jointing portion and at least one fixing portion. The pivoting portion is rotatably or movably received in the first slot. A first end of the operating portion connects to the pivoting portion, rotating or moving the pivoting portion. The jointing portion, at a second end of the operating portion, selectively connects to or separates from the second slot. The fixing portion protrudes from the pivoting portion, abutting and securing the fan to the heat sink.
    Type: Application
    Filed: November 8, 2007
    Publication date: June 5, 2008
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Yu-Hsien Lin
  • Publication number: 20080078531
    Abstract: A heat pipe includes a hollow annular body with two open ends and two bending portions. A wick structure is formed at an inner surface of the annular body. The bending portions are respectively disposed at the two open ends to form a sealed space within the hollow annular body. A working fluid is filled in the sealed space. Also, a method of manufacturing a heat pipe including steps of: providing a hollow annular body with two open ends, and a wick structure is formed at an inner surface of the hollow annular body; and forming two bending portions respectively at the two open ends to form a sealed space within the hollow annular body, and a working fluid is filled in the sealed space.
    Type: Application
    Filed: April 27, 2007
    Publication date: April 3, 2008
    Inventors: Ming-Te Chung, Chi-Feng Lin, Chin-Ming Chen
  • Patent number: D581375
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: November 25, 2008
    Assignee: Delta Electronics Inc.
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Chih-Hao Hsia, Shu-Hui Chan
  • Patent number: D581882
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: December 2, 2008
    Assignee: Delta Electronics Inc.
    Inventors: Chin-Ming Chen, Yuhsien Lin, Tsung-Lin Chen, Alex Hsia
  • Fan
    Patent number: D585976
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: February 3, 2009
    Assignee: Delta Electronics Inc.
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Chih-Hao Hsia, Shu-Hui Chan, Hao-Wen Ko
  • Fan
    Patent number: D589466
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: March 31, 2009
    Assignee: Delta Electronics Inc.
    Inventors: Chin-Ming Chen, Yuhsien Lin, Tsung-Lin Chen, Alex Hsia
  • Patent number: D597497
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: August 4, 2009
    Assignee: Delta Electronics Inc.
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Chun-Yang Hung, Sung-Ching Ho
  • Patent number: D632267
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: February 8, 2011
    Assignee: Lextar Electronics Corp.
    Inventors: Chin-Ming Chen, Chin-Chang Hsu, Hsuan-Chi Liu