Abstract: A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump; and a guide part disposed in the opening of the heat sink, communicated to the pump and having an outer surface, a through hole and a guide passage formed on the outer surface. The pump drives a working fluid in the liquid-cooled heat dissipation module to pass through the through hole, the pump and the guide passage to circularly dissipate heat.

Abstract: A heat sink has a heat-dissipating portion and a contact portion for contacting an electric device generating heat. The diameter of the contact portion is smaller than that of the heat-dissipating portion. The heat-dissipating portion has a plurality of fins. The contact portion is disposed on a bottom surface of the heat-dissipating and formed with the heat-dissipating portion as a single unitary member. The contact portion includes a first axial cross section and a second axial cross section. The first axial cross section is away from the heat-dissipating portion, and the second axial cross section is near the heat-dissipating portion. The diameter of the first axial cross section is larger than that of the second axial cross section.

Abstract: A heat dissipating module has a fan and at least one heat sink contacting with a heat source. The fan has an impeller and a housing. The housing has a base for supporting the impeller, at least one rib extending from the edge of the base to the backward direction of the center of the base, at least one sidewall, an annular wall connecting with the rib and/or the sidewall, at least one protrusion axially protruding from the annular wall and/or the sidewall, at least one securing member disposed on the end of the protrusion, and at least one fastener disposed in the securing member. The base, the rib, the sidewall, the annular wall, the protrusion, and the securing member are integrally formed as a single piece. The protrusion has at least one block structure for fixing the heat sink to the housing.

Abstract: A heat dissipation module includes a heat column and a plurality of heat dissipation fins disposed outside of the heat column and connected with the heat column. The heat column has a column body and a base, and the column body has a top portion and a sidewall ringed with the top portion. The sidewall and the top portion are integrally formed. The base is disposed opposite to the top portion, and the base has an indentation for allowing an end of the sidewall of the column body to insert so as to form a closed space between the base and the column body. The base further has an annular protrusion close to the indentation, and after the end of the sidewall of the column body is inserted into the indentation of the base, the annular protrusion is processed to be filled between the indentation and the sidewall so as to tightly assemble the base and the column body.

Abstract: A fastening structure for a fan, comprising a frame which comprises a fastening member comprising a vertical portion fixed to the frame, and an extending portion extending towards the interior of the frame and comprising a protrusion, wherein when the fan is assembled with the fastening structure, the fan is rotated along an axle thereof to closely fit the protrusion in an hole of the outer frame of the fan so that the fan can be fixed on the frame.

Abstract: A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan and driven by the fan. The heat sink is coupled to the fan, and has an opening for receiving the pump. A guide member is disposed in the opening of the heat sink and communicates with the pump. The guide member has a through hole and a guide passage formed on the surface of the guide member. Power provided by the fan, the working fluid in the liquid-cooling heat dissipation module circulates through the through hole, the pump and the guide passage to dissipate heat.

Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

Abstract: A heat dissipating assembly. The heat dissipating assembly comprises a frame, a clamping member, and a rotatable handle. The frame comprises a locking member. The clamping member is disposed crossing the frame. The rotatable handle is rotatably connected to the frame and abuts the clamping member. The rotatable handle exerts pressure on the clamping member, and the locking member locks the rotatable handle.

Abstract: A heat dissipating module. A frame accommodates a fan. An engaging assembly is coupled to the frame and includes an engaging body, a tongue, a resilient element, a wrench bar, and a connecting element. The engaging body includes a hollow portion and at least one first pivot hole. The tongue includes a bent portion and a bottom engaging portion. The bent portion includes at least one second pivot hole and is slidably engaged in the hollow portion. The resilient element fits on the tongue and is interposed between the engaging body and the bottom engaging portion of the tongue. The wrench bar abuts the surface of the engaging body and includes at least one third pivot hole. The connecting element fits in the first, second, and third pivot holes and is disposed in the engaging body, pivoting the tongue and wrench bar to the engaging body.

Abstract: A heat dissipation module includes a heat pipe and a plurality of fins disposed around the heat pipe. The heat pipe includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around the top portion. The base is combined with the main body to form a closed chamber. The base is disposed corresponding to the top portion and has an uneven surface facing the top portion. The first wick is disposed on the sidewall portion and the top portion of the main body, the second wick is disposed on the base, and the working fluid is filled within the closed chamber.

Abstract: A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The bottom portion has an uneven surface facing the accommodating space. The wick is disposed over the uneven surface of the bottom portion and the working fluid is filled within the casing.

Abstract: A composite heat dissipating apparatus includes a heat pipe and at least two heat sinks. The heat sinks are connected to each other. A space for accommodating the heat pipe therein is formed at a connection between the heat sinks. Each of the heat sinks is integrally formed as a single piece.

Abstract: A heat dissipation module includes a heat pipe and at least one thermal conductor. Each of the thermal conductors includes an opening for allowing the heat pipe to pass therethrough. A joining portion extends from an edge of the opening of each of the thermal conductors. The joining portion has a cavity for receiving a solder material. A solder material is disposed in the cavity, and the heat pipe is inserted through the openings. The heat pipe and the thermal conductors are turned over in the reflow process, such that the heat pipe and the thermal conductors are perfectly connected. An assembling method of the heat dissipation module is further provided.

Abstract: A vapor chamber applied to an electronic device generating heat is provided. The vapor chamber includes a hollow tube and a capillary structure, which is continuously formed on the inner surface of the hollow tube. The method for manufacturing the vapor chamber includes providing a hollow tube, forming the capillary structure on the inner surface of the hollow tube, filling a working fluid into the tube, and finally evacuating the hollow tube and sealing the other end of the tube, so as to provide better thermal transferring effect.

Abstract: A heat-dissipating device. The heat-dissipating device includes a base, a plurality of heat-dissipating fins, and a fan. The heat-dissipating fins are disposed around the base. The base includes a first end surface and a second end surface. The first end surface contacts a heat source. The fan is disposed on the second end surface. An airflow space is formed between the heat-dissipating fins and the first end surface for airflow to pass through.

Abstract: A heat sink includes a plurality of fins, each of which includes a first vent and a first baffle. Each baffle is extended at one side of the first vent, and each of the first vents of the fins is located corresponding to the first vent of an adjacent fin. The heat sink further has a base, on which the fins are installed in parallel.

Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

Abstract: A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.

Abstract: A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump; and a guide part disposed in the opening of the heat sink, communicated to the pump and having an outer surface, a through hole and a guide passage formed on the outer surface. The pump drives a working fluid in the liquid-cooled heat dissipation module to pass through the through hole, the pump and the guide passage to circularly dissipate heat.