Abstract: A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan and driven by the fan. The heat sink is coupled to the fan, and has an opening for receiving the pump. A guide member is disposed in the opening of the heat sink and communicates with the pump. The guide member has a through hole and a guide passage formed on the surface of the guide member. Power provided by the fan, the working fluid in the liquid-cooling heat dissipation module circulates through the through hole, the pump and the guide passage to dissipate heat.

Abstract: A heat dissipating module. A frame accommodates a fan. An engaging assembly is coupled to the frame and includes an engaging body, a tongue, a resilient element, a wrench bar, and a connecting element. The engaging body includes a hollow portion and at least one first pivot hole. The tongue includes a bent portion and a bottom engaging portion. The bent portion includes at least one second pivot hole and is slidably engaged in the hollow portion. The resilient element fits on the tongue and is interposed between the engaging body and the bottom engaging portion of the tongue. The wrench bar abuts the surface of the engaging body and includes at least one third pivot hole. The connecting element fits in the first, second, and third pivot holes and is disposed in the engaging body, pivoting the tongue and wrench bar to the engaging body.

Abstract: A heat pipe and manufacturing method thereof. The manufacturing method includes steps of: providing a pipe; shaping the pipe by bending or pressing according to requirements of a heat-dissipation module of an electronic device; inserting a molding bar into the pipe; forming a wick structure in the pipe; separating the molding bar from the pipe; and adding a working fluid to the pipe, wherein the working fluid is confined in a closed space of the pipe. The pipe is shaped before formation of the wick structure therein to prevent damage to the wick structure.

Abstract: A heat dissipation module includes a first annular wall, a second annular wall, at least one porous structure, at least one first heat conductive structure and second heat conductive structure. The second annular wall with respect to the first annular wall, and the first annular wall and the second annular wall are jointed to form a closed chamber. The porous structure is disposed on an inner surface of the closed chamber. The first heat conductive structure is externally connected to the first annular wall and the second heat conductive structure is internally connected to the second annular wall.

Abstract: An LED light bulb structure is disclosed. The light bulb structure comprises a light bulb body and a positioning seat. The positioning seat is provided with a seat face having a recess to accommodate the LED elements, and the recess is a vertical hole which leads the correspondingly mounted LED elements, thereby the combination of the seat and the light bulb body enhances the positioning of LED elements so as to improve the brightness of the light rays in the course of illumination.

Abstract: A heat pipe includes a main body, a wick structure, and a working fluid. The wick structure is formed on an inner wall of the main body and the working fluid is filled in the main body. The coil-shaped wire is attached to the inner wall of the main body so as to form a plurality of grooves. The coil-shaped wire is obtained by winding a copper wire around a supporting frame which has a predetermined shape corresponding to the main body. The supporting frame can be exactly accommodated within the heat pipe.

Abstract: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.

Abstract: A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.

Abstract: The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.

Abstract: A heat dissipation apparatus and a vapor chamber thereof. The heat dissipation apparatus comprises a heat sink and a vapor chamber for dissipating heat from a heat source of an electric device. The vapor chamber comprises a heat-absorption region, a heat-dissipation region, a working fluid, a wick structure and at least one buffer region. The working fluid in the heat-absorption region is vaporized while absorbing heat in the heat-absorption region from the heat source, and the vaporized working fluid condenses in the heat-dissipation region after latent heat thereof is released. The capillarity of the wick structure drives the working fluid returning to the heat-absorption region from the heat-dissipation region, and the buffer regions include a reservoir for accessing the working fluid. The heat-dissipation apparatus equipped with a vapor chamber having buffer regions can reduce entire weight and shorten distance during heat conduction so that heat dissipation efficiency is increased.

Abstract: A heat dissipation apparatus. The heat dissipation apparatus includes a base and a support member. The support member has an opening and at least one protruding part surrounding the opening. The support member is connected with the base in a predetermined site by the protruding parts. When the base passes through the opening and the protruding parts are disposed in the predetermined site, the protruding parts become deformed to be engaged with the base by a force. The protruding parts and the support member may be integrally formed. Alternately, the base may comprise a groove in the predetermined site for allowing the protruding parts be inserted into the groove. The protruding parts substantially protrude inwardly into the opening so that the support member is engaged with the base when the protruding parts are inserted into the groove.

Abstract: A cylindrical heat pipe. The heat pipe includes a hollow body, a cover, and a tube. The hollow body includes a sealed bottom, a top portion and an inner wall. The cover includes an elevated portion near the top portion. The tube penetrates the cover. The cover seals the hollow body and guides working fluid passing therethrough into the heat pipe. After working fluid is added and vacuums, the tube is sealed, thus the elevated portion enlarges heat-dissipation region of the heat pipe.

Abstract: A heat pipe and manufacturing method thereof. A pipe is provided and shaped. A molding bar is inserted into the pipe. A wick structure is formed in the pipe. The molding bar is separated from the pipe. A working fluid is added and confined in a closed space of the pipe. The pipe is shaped before formation of the wick structure therein to prevent damage to the wick structure.

Abstract: A heat dissipating assembly. The heat dissipating assembly comprises a frame, a clamping member, and a rotatable handle. The frame comprises a locking member. The clamping member is disposed crossing the frame. The rotatable handle is rotatably connected to the frame and abuts the clamping member. The rotatable handle exerts pressure on the clamping member, and the locking member locks the rotatable handle.

Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

Abstract: A heat sink comprises a plurality of heat-dissipating units, and each heat-dissipating unit provides a base and a plurality of parallel fins disposed thereon, respectively. The fins of any two adjacent heat-dissipating units extend in different directions.

Abstract: A heat-dissipating fin of a heat sink for improving thermal conduction is disclosed. The heat sink has a base plate and a plurality of heat-dissipating fins. The base plate includes a first surface contacting with a heat source, and a second surface having a plurality of grooves orderly formed on the second surface. The heat dissipating fin of the heat sink has the feature that the thickness of the heat-dissipating fin is not uniform, and the thickness of a bottom surface of the heat-dissipating fin facing the groove is greater than the other portions of the heat-dissipating fin.

Abstract: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.

Abstract: A cooling fin structure is constructed by a thermally conductive sheet bent to form a heat radiation part and a welding part. The welding part is formed with a vacant region, which is defined by notches, openings or a slot, and the thermally conductive sheet is welded to a substrate through the welding part.