Patents by Inventor Chin-Tien Chiu

Chin-Tien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
    Patent number: 9773766
    Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 26, 2017
    Assignees: SanDisk Information Technology (Shanghai) Co., Ltd., SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng Fu, Zhong Lu, Cheeman Yu, Yuang Zhang, Li Wang, Pradeep Kumar Rai, Weili Wang, Enyong Tai, King Hoo Ong, Kim Lee Bock
  • Waterfall wire bonding
    Patent number: 9704797
    Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: July 11, 2017
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Zhong Lu, Fen Yu, Chin Tien Chiu, Cheeman Yu, Fuqiang Xiao
  • SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC ABSORPTION AND SHIELDING
    Publication number: 20170110383
    Abstract: A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
    Type: Application
    Filed: December 30, 2016
    Publication date: April 20, 2017
    Applicant: SanDisk Information Technology (Shanghai) Co. Ltd.
    Inventors: Dacheng Huang, Ye Bai, Kaiyou Qian, Chin-Tien Chiu
  • Semiconductor device including electromagnetic absorption and shielding
    Patent number: 9595454
    Abstract: A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (202), one or more semiconductor die (224,225), and molding compound around the one or more semiconductor die (224,225). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer (210) on the substrate (202). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 14, 2017
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Dacheng Huang, Ye Bai, Kaiyou Qian, Chin-Tien Chiu
  • Wire tail connector for a semiconductor device
    Patent number: 9362244
    Abstract: A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: June 7, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Chin Tien Chiu, Cheeman Yu, Hem Takiar
  • EMI shielding and thermal dissipation for semiconductor device
    Patent number: 9337153
    Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: May 10, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Peng Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin Tien Chiu, Cheeman Yu, Hem Takiar, Ye Bai
  • Semiconductor die laminating device with independent drives
    Patent number: 9331045
    Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 3, 2016
    Assignees: SanDisk Information Technology (Shanghai) Co., Ltd., SanDisk Semiconductor (Shanghai) Co., Ltd.
    Inventors: Wei Gu, Zhong Lu, Cheeman Yu, Chin-Tien Chiu, En-Yong Tai, Min Ni
  • METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY
    Publication number: 20160086827
    Abstract: A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.
    Type: Application
    Filed: December 4, 2015
    Publication date: March 24, 2016
    Inventors: Peng Fu, Zhong Lu, Chin Tien Chiu, Cheeman Yu, Matthew Chen, Weiting Jiang
  • Semiconductor device including embedded controller die and method of making same
    Patent number: 9236368
    Abstract: A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: January 12, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Kaiyou Qian, Cheeman Yu
  • Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
    Patent number: 9230919
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: January 5, 2016
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar
  • Semiconductor device including alternating stepped semiconductor die stacks
    Patent number: 9230942
    Abstract: A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: January 5, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Dacheng Huang, Zhong Lu, Zhongli Ji
  • Hidden plating traces
    Patent number: 9209159
    Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: December 8, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao
  • SEMICONDUCTOR DEVICE INCLUDING ALTERNATING STEPPED SEMICONDUCTOR DIE STACKS
    Publication number: 20150228621
    Abstract: A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 13, 2015
    Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Dacheng Huang, Zhong Lu, Zhongli Ji
  • SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING AND/OR SPACING SEMICONDUCTOR DIE
    Publication number: 20150221624
    Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
    Type: Application
    Filed: January 9, 2013
    Publication date: August 6, 2015
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng Fu, Zhong Lu, Cheeman Yu, Yuang Zhang, Li Wang, Pradeep Kumar Rai, Weili Wang, Enyong Tai, King Hoo Ong, Kim Lee Bock
  • PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CONTACT PAD AREAS
    Publication number: 20150223335
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Application
    Filed: April 13, 2015
    Publication date: August 6, 2015
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar
  • EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
    Publication number: 20150214184
    Abstract: A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.
    Type: Application
    Filed: April 9, 2015
    Publication date: July 30, 2015
    Applicants: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD., SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
    Inventors: Wei Gu, Zhong Lu, Shrikar Bhagath, Chin-Tien Chiu, Hem Takiar, XiangYang Liu
  • SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CONTROLLER DIE AND METHOD OF MAKING SAME
    Publication number: 20150214206
    Abstract: A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
    Type: Application
    Filed: January 28, 2013
    Publication date: July 30, 2015
    Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Kaiyou Qian, Cheeman Yu
  • SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
    Publication number: 20150187745
    Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. Pillars, for example of solder, may also formed on the substrate, around the semiconductor die. The pillars are formed to a height above the substrate that is greater than the height of the substrate-mounted semiconductor die, including any wire bonds, above the substrate. A second group of one or more semiconductor die, such as flash memory die, may be affixed to the substrate, on top of the solder pillars without contacting the substrate-mounted semiconductor die.
    Type: Application
    Filed: December 5, 2014
    Publication date: July 2, 2015
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Chin-Tien Chiu, Suresh Upadhyayula, EnYong Tai, Dacheng Huang, Yuang Zhang
  • Extrinsic gettering on semiconductor devices
    Patent number: 9064836
    Abstract: A semiconductor wafer, die and semiconductor package formed therefrom are disclosed, where the inactive surface of the wafer has an extrinsic gettering pattern formed from a texturing process. In examples, the texturing process follows a polishing process that removes stress concentration point from the inactive surface of the wafer.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: June 23, 2015
    Assignee: SanDisk Semiconductor (Shanghai) Co., Ltd.
    Inventors: Chin-Tien Chiu, Shrikar Bhagath, Yuang Zhang, Lu Zhong, Kaiyou Qian
  • SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES
    Publication number: 20150115479
    Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
    Type: Application
    Filed: May 7, 2012
    Publication date: April 30, 2015
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Wei Gu, Zhong Lu, Cheeman Yu, Chin-Tien Chiu, En-Yong Tai, Min Ni