Abstract: The invention disclosed an anti-reflective film. The anti-reflective film comprises a substrate, a hard coating layer disposed on the substrate and a low refractive layer disposed on the hard coating layer. The low refractivity layer comprises a fluorine-containing acrylate-modified polysiloxane resin, a plurality of hollow silica nanoparticles, an initiator and a leveling agent comprising a perfluoropolyether group-containing (meth)acrylic-modified organosilicone compound. The reflectivity of the anti-reflective film of the anti-reflective film is less than 1.1%, and the water contact angle thereof is ranging between 90° and 125°.

Abstract: This invention is to provide a hard coating film, comprising a polymethyl methacrylate (PMMA) base film and an antiglare hard coating layer formed thereon, wherein the antiglare hard coating layer comprises a (meth)acrylate composition, an initiator, a plurality of silica nanoparticles, a plurality of organic microparticles and a leveling agent. The (meth)acrylate composition comprises a urethane (meth)acrylate oligomer with a functionality of 6 to 15 and a molecular weight ranging between 1,000 and 4,500, and at least one (meth)acrylate monomer with a functionality of 3 to 6, and at least one (meth)acrylate monomer with functionality of less than 3.

Abstract: An antenna of reduced size but of multiple functions according to manual adjustment includes a side frame made of metallic material, a feeding portion, and a moving module. The side frame defines first and second gaps each passing through the side frame to form at least one radiating portion. The feeding portion can feed current to either of the radiating portions. The metallic and movable moving module including an extending portion is movable relative to the side frame. In a first position, the extending portion is not connected to any radiating portion, and when moved to a second position, the extending portion is connected to one of the radiating portions.

Abstract: A semiconductor device includes a compound semiconductor layer disposed on a substrate, a protection layer disposed on the compound semiconductor layer, and a source electrode, a drain electrode and a gate electrode penetrating the protection layer and on the compound semiconductor layer, wherein the gate electrode is disposed between the source electrode and the drain electrode. The semiconductor device also includes a plurality of field plates disposed over the protection layer and between the gate electrode and the drain electrode, wherein the plurality of field plates are separated from each other.

Abstract: Embodiments disclosed herein provide an apparatus to enable smooth and safe assembly of functional modules to computer chassis. The apparatus includes a chassis and a pair of racks mounted to the chassis. Each rack has a plurality of gear teeth formed thereon. A module having a housing is slidably coupled to the chassis and disposed between the pair of racks. A pair of gear pinions are rotatably mounted to the housing and meshed to the gear teeth of one of the racks. A damping member is coupled between each gear pinion and the housing. A sliding movement of the housing relative to the chassis rotates the pair of gear pinions to roll over along the gear teeth. During the sliding movement of the housing, the damping member exerts a resistance force against the housing, to reduce the movement speed of the housing.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes one or more lower interconnects arranged within a dielectric structure over a substrate. A bottom electrode is disposed over one of the one or more lower interconnects. The bottom electrode includes a first material having a first electronegativity. A data storage layer separates the bottom electrode from a top electrode. The bottom electrode is between the data storage layer and the substrate. A reactivity reducing layer includes a second material and has a second electronegativity that is greater than or equal to the first electronegativity. The second material contacts a lower surface of the bottom electrode that faces the substrate.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.

Abstract: A projection device includes a first lens component, a second lens component, a first reflecting sheet embedded in the first lens component, a second reflecting sheet embedded in the second lens component, a light source opposite to the first reflecting sheet, a diffractive optical element opposite to the second reflecting sheet, and a rotating subassembly. The first lens component and the second lens component are not integral. The second reflecting sheet is opposite to the first reflecting sheet. The rotating subassembly can drive the second lens component to rotate relative to the first lens component. The projection device can realize multi-directional projection of images.

Abstract: A bicycle inductive lock included a housing, a lock body, and a control circuit device. An annular latch and the lock body are disposed in the housing. A back cover is configured to close the housing. The annular latch has a first engaging groove, a second engaging groove and a third engaging groove. The lock body includes a first baffle that can be engaged in the first engaging groove or the second engaging groove, a second baffle that can be engaged in third engaging groove, and a speed reduction motor having a lever. The lever includes an angle control block and an eccentric paddle. The control circuit device includes an induction unit and a key fob. The key fob is configured to generate induction with the induction unit for transmitting a signal. With the above configuration, the bicycle inductive lock can sense the signal to be locked or unlocked.

Abstract: The application discloses an electronic device including a motherboard and a housing structure. The motherboard has a first surface and a second surface. The housing structure includes a first casing, a first cushion, a second casing, and a second cushion. The first casing has at least one first fixing member. The first cushion covers the first surface, is accommodated in the first casing and has at least one first through hole. The second casing has at least one second fixing member. The second cushion covers the second surface, is accommodated in the second casing and has at least one second through hole. A peripheral edge of the first cushion is attached to a peripheral edge of the second cushion, and the first fixing member may be fixed to the second fixing member through the first through hole and the second through hole.

Abstract: A bicycle bell includes a fixing seat on a pipe clamp, a bell cover, and an elastic support. The elastic support has two curved arms and a horizontal section. The two curved arms extend upward from two ends of the horizontal section. The two curved arms have engaging ends extending outwardly and laterally. The horizontal section is mounted to the fixing seat. The engaging ends are connected to the bell cover in a snap-on manner. In the bicycle bell, the fixing seat and the bell cover are assembled through the elastic support. The elastic support is a relatively flexible medium with poor energy conductivity, so that the vibration amplitude of the bell cover is large, the energy loss is small, and the vibration is longer and louder.

Abstract: A lens module including a lens barrel and a plurality of lenses having refractive power is provided. The lenses are arranged in the lens barrel from an object side to an image side. The lens barrel has an inner-wall surface and an outer-wall surface opposite to each other, and has an air outlet communicating with outside. The air outlet is located between the inner-wall surface and the outer-wall surface. A first lens of these lenses is a lens closest to the object side. The first lens has an object-side optical surface facing the object side. At least over 95% of the surface area of the object-side optical surface of the first lens is exposed to outside, and a material of the first lens is glass. Furthermore, another lens module is also provided.

Abstract: The invention is to provide an anti-reflective film. The anti-reflective film comprises a substrate, a hard coating layer disposed on the substrate and a low refractive layer disposed on the hard coating layer. The low refractive layer comprises a (meth)acrylate resin, hollow silica nanoparticles, an initiator and a leveling agent. Wherein the leveling agent comprises a (meth)acrylic-modified organosilicone compound having a perfluoropolyether group. The reflectivity of the anti-reflective film of the present invention is in the range of 1.2% to 1.4%.

Abstract: The present invention is to provide a hard coating layered optical film, comprising a poly(methylmethacrylate) (PMMA) base film and a hard coating layer thereon. The hard coating layer comprises a (meth)acrylate composition and an initiator, wherein the (meth)acrylate composition comprises a urethane (meth)acrylate oligomer of functionalities from 6 to 15, at least one (meth)acrylate monomer of functionalities from 3 to 6 and at least one (meth)acrylate monomer of functionalities less than 3, wherein the molecular weight of the (meth)urethane acrylate oligomer of functionalities from 6 to 15 is ranging between 1,000 to 4,500. The hard coating layer of the hard coating layered optical film can be further coated with a functional layer, such as a low reflection layer to form an anti-reflection hard coating layered optical film. The hard coating layer can optionally comprise micro-particles to generate an anti-glare hard coating film.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells coupled to a control circuit. The control circuit is configured to perform a first programming stage including iteratively programming each of the memory cells to first program states and verifying that the memory cells have a threshold voltage above one of a plurality of first verify voltages corresponding to the first program states. The first programming stage ends before all of the memory cells are verified thereby leaving a fraction of the memory cells below the one of the plurality of first verify voltages. The control circuit also performs a second programming stage including iteratively programming each of the memory cells to second program states and verifying that at least a predetermined number of the memory cells have the threshold voltage above one of a plurality of second verify voltages corresponding to the second program states.

Abstract: An automatic adjustable supporting equipment, including a supporting band, an adjusting device, and a controller, is provided. The supporting band wraps around a limb of a user. The adjusting device is disposed on the supporting band, and includes an actuating mechanism and an accelerometer. The actuating mechanism is configured to adjust a pressure applied on the limb by the supporting band. The accelerometer is configured to detect an acceleration value. The controller is coupled to adjusting device, and is configured to drive the actuating mechanism to adjust the pressure to a preset pressure value according to the acceleration value.

Abstract: Provided is a semiconductor device including a first fin-type field effect transistor (FinFET). The first FinFET includes a first gate structure over a first semiconductor fin and the first gate structure includes a first work function layer. The first work function layer includes a first layer and a second layer. The first layer has a bar-shaped structure, the second layer has a U-shaped structure encapsulating sidewalls and a bottom surface of the first layer, and the first layer and the second layer include different materials. A method of manufacturing the semiconductor device is also provided.

Abstract: A semiconductor device includes a compound semiconductor layer disposed on a substrate, a protection layer disposed on the compound semiconductor layer, and a source electrode, a drain electrode and a gate electrode penetrating the protection layer and on the compound semiconductor layer, wherein the gate electrode is disposed between the source electrode and the drain electrode. The semiconductor device also includes a plurality of field plates disposed over the protection layer and between the gate electrode and the drain electrode, wherein the plurality of field plates are separated from each other. A method for fabricating the semiconductor device is also provided.

Abstract: A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

Abstract: Disclosed herein is a carbon quantum dot produced by the step of subjecting dopamine and spermine to a pyrolysis treatment at 250° C. Also disclosed herein is use of the carbon quantum dot for treating a bacterial infection, and for inhibiting bacterial growth and biofilm formation.