Abstract: The present invention is directed to a process for preparing amides or polyamides by replacing isocyanate starting materials of a catalyzed thermal reaction with aromatic carbamates. Through the catalyzed thermal process involving a non-isocyanate precursor of the present invention, efficiency for producing amides or polyamides can be significantly improved, and the impure side products produced from a side reaction of isocyanate can be greatly curtailed. Hence, amides or polyamides of high purity and yield can be achieved. The invention also relates to a process for preparing aromatic carbamates, the new non-isocyanate precursors for amides or polyamides.

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar? represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

Abstract: A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar? represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

Abstract: The present invention is directed to a process for preparing amides or polyamides by replacing isocyanate starting materials of a catalyzed thermal reaction with aromatic carbamates. Through the catalyzed thermal process involving a non-isocyanate precursor of the present invention, efficiency for producing amides or polyamides can be significantly improved, and the impure side products produced from a side reaction of isocyanate can be greatly curtailed. Hence, amides or polyamides of high purity and yield can be achieved. The invention also relates to a process for preparing aromatic carbamates, the new non-isocyanate precursors for amides or polyamides.

Abstract: The present invention relates to a multi-functional carbamate having a soft segment, which can be used as a raw material in the preparation of a polyisocyanate having a special siloxane soft segment in its structure by a non-phosgene method; to a polyisocyanate having a special siloxane soft segment prepared by a non-phosgene method; to a urethane prepolymer having a special siloxane soft segment, prepared from a polyisocyanate having a special siloxane soft segment and a polyol; and also to a elastomeric urethane having a special siloxane soft segment, prepared by reacting a polyisocyanate having a special siloxane soft segment with a polyol and an optional chain extender. The present invention also relates to a synthesis method for the above-mentioned substances.

Abstract: A polymeric benzoxazine resin structure with an adamantane-containing main chain produces materials of low dielectric characteristics when cured.

Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: A copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin forms a low-dielectric thermosetting polymeric material for making electronic components. A method of manufacturing the copolymer is also introduced. The method includes allowing DCPD-phenol oligomer, aniline, and paraformaldehyde to react at 110° C. for 6-12 hours before being extracted and baked to obtain DCPDBz; and mixing cyanate ester and the DCPDBz at 150° C.; heating the mixture up to 220° C.

Abstract: A copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin forms a low-dielectric thermosetting polymeric material for making electronic components. A method of manufacturing the copolymer is also introduced. The method includes allowing DCPD-phenol oligomer, aniline, and paraformaldehyde to react at 110° C. for 6-12 hours before being extracted and baked to obtain DCPDBz; and mixing cyanate ester and the DCPDBz at 150° C.; heating the mixture up to 220° C.

Abstract: A series of novel phosphorus-containing compounds having the formula: is provided in which R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof, as well as a polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:

Abstract: A series of curing agents are provided. The curing agents are multi-functional and phosphorus-containing. The curing agents have excellent processability to be used as an epoxy resin curing agent. The curing agents can be cured to obtain a phosphorus-containing epoxy thermoset with flame retardancy characteristic. The epoxy thermosets are very fit for circuit board substrate having high glass transition temperature; semiconductor packaging material; and related materials.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Abstract: Disclosed is a method for making a low-k, flame-retardant, bi-functional benzoxazine. The method includes the steps of dissolving phosphoric diamine with various functional groups, phenolic adamantane and paraformaldehyde in a solvent at 72° C. to 88° C. for 7 to 9 hours, and cooling and introducing the solution in n-hexane to separate the low-k, flame-retardant, phosphoric, bi-functional benzoxazine.

Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.