Patents by Inventor Ching Hsuan Lin

Ching Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100004426
    Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.
    Type: Application
    Filed: July 2, 2009
    Publication date: January 7, 2010
    Inventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
  • Publication number: 20090318132
    Abstract: A method and system for detecting an insufficient coverage location in a mobile network is provided to detect the insufficient coverage location in a systematic and efficient way. The method generates a corresponding cell list for a registered address of a subscriber of the mobile network, where the cell list comprises at least one cell that potentially covers the registered address. Next, the call detail record (CDR) entries associated with the cell list are extracted. Then, it is determined whether the registered address is an insufficient coverage location of the mobile network according to the error codes included in the extracted CDR entries.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 24, 2009
    Inventors: Ta-Gang Chiou, Ching-Hsuan Lin, Chao-Chi Chang
  • Publication number: 20090258997
    Abstract: A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein R1-R12, A, B, D, X, and Y are as defined in the specification. A process for the preparation of the compound of formula (1), a curing agent, and a flame resistant epoxy resin and a preparation process thereof are also provided.
    Type: Application
    Filed: April 13, 2009
    Publication date: October 15, 2009
    Inventors: Ching-Hsuan Lin, Tsung Li Lin, Chia Wei Chang, Kuen-Yuan Hwang, An-Pang Tu, Fang-Hsien Su
  • Publication number: 20090215967
    Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 27, 2009
    Applicant: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Ching-Hsuan Lin, Yu Ming Hu, Hong Tze Lin
  • Patent number: 7566780
    Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: July 28, 2009
    Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing University
    Inventors: Ching-Hsuan Lin, Ya-Ru Taso, Chau-Wei Hsieh, Hao-Hsin Lee, Fang-Hsien Su, An-Pang Tu, Kuen-Yuan Hwang
  • Publication number: 20090182116
    Abstract: A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein Q, R5, Ar1, Ar2, A, and B are as defined in the specification. The present invention provides a process for the preparation of the compound of formula (I). The present invention also provides a compound of formula (PA) and a process for preparing the same. The present invention further provides a compound of formula (PI) and a process for preparing the same.
    Type: Application
    Filed: January 14, 2009
    Publication date: July 16, 2009
    Applicant: National Chung Hsing University
    Inventors: Ching-Hsuan LIN, Chia Wei CHANG, Tsung Li LIN
  • Publication number: 20090171120
    Abstract: The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds.
    Type: Application
    Filed: January 21, 2008
    Publication date: July 2, 2009
    Applicants: CHANG CHUN PLASTICS CO., LTD., NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Ching-Hsuan Lin, Ya-Ru Taso, Chau-Wei Hsieh, Hao-Hsin Lee, Fang-Hsien Su, An-Pang Tu, Kuen-Yuan Hwang
  • Publication number: 20080045688
    Abstract: Processes of synthesizing aromatic amine-based benzoxazine resins are disclosed. The processes provide new routes for synthesizing benzoxazine from aromatic diamines or multifunctional aromatic amines that may solve the problem of insoluble products resulted from the condensation of hydroxymethylamine with amine by using aromatic diamine, phenol and formaldehyde as a raw materials.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 21, 2008
    Inventors: Ching-Hsuan Lin, Ya-Ru Taso, Jhao-Wei Sie, Hao-Hsin Lee
  • Publication number: 20080021193
    Abstract: A method of manufacturing new materials for a printed circuit board and Low-Earth Orbit (LEO) spacecraft is provided. The present invention includes dinitro, diamine, various phosphorous-containing polyimides and polyamides, and synthesizing methods thereof. The polymers of the embodiment of present invention exhibit good flame retardancy, high glass transition temperature, good mechanical properties and superior oxygen resistance, so they are good materials for Low-Earth Orbit applications. Besides, these polymers can also be used as matrix for halogen-free flexible printed circuit board.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 24, 2008
    Inventors: Ching-Hsuan Lin, Chun-Hung Lin
  • Patent number: 6797821
    Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: September 28, 2004
    Inventors: Chun-Shan Wang, Jeng-Yueh Shieh, Ching Hsuan Lin
  • Publication number: 20030120021
    Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.
    Type: Application
    Filed: January 30, 2002
    Publication date: June 26, 2003
    Applicant: Chun-Shan WANG
    Inventors: Chun-Shan Wang, Jeng-Yueh Shieh, Ching Hsuan Lin
  • Patent number: 6291627
    Abstract: A flame-retardant epoxy resin was prepared by reacting an active-hydrogen-containing phosphorus compound with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group, is suitable for printed circuit board and semiconductor encapsulation applications.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: September 18, 2001
    Assignee: National Science Council
    Inventors: Chun-Shan Wang, Ching Hsuan Lin
  • Publication number: 20010003771
    Abstract: A flame-Retardant advanced epoxy resin was prepared by reacting an active-hydrogen-containing phosphorus compound with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group, which has a high glass transition temperature (Tg), high decomposition temperature and high elastic modulus and thus is suitable for printed circuit board and semiconductor encapsulation applications by curing with a curing agent.
    Type: Application
    Filed: January 10, 2001
    Publication date: June 14, 2001
    Inventors: Chun-Shan Wang, Ching Hsuan Lin, Hong Chen Chiu