Abstract: A circuit includes a power management circuit and a memory circuit. The power management circuit is configured to receive a first control signal and a second control signal, and to supply a first supply voltage, a second supply voltage and a third supply voltage. The first control signal has a first voltage swing, and the second control signal has a second voltage swing different from the first voltage swing. The first control signal causes the power management circuit to enter a power management mode having a first state and a second state. The memory circuit is coupled to the power management circuit, and is in the first state or the second state in response to at least the first supply voltage supplied by the power management circuit.

Abstract: A circuit includes first and second bit lines, a second power node having a voltage level below that of a first power node, a reference node having a reference voltage level, first and second pass gates and drivers, first and second logic gates coupled to the second power node, first and second conversion circuits coupled between the first power node and respective first and second logic and pass gates, and first and second NOR gates coupled between the second power node and respective first and second logic gates and drivers. The first and second pass gates selectively couple the first and second bit lines to the first power node responsive to the respective second and first logic gates and conversion circuits, and the first and second drivers selectively couple the first and second bit lines to the reference node responsive to the respective first and second logic and NOR gates.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.

Abstract: A system for determining spraying information used for spraying a 3D object using a spray tool is provided. The system includes a 3D image capturing device and a computing device. The 3D image capturing device is configured to capture a 3D image of the 3D object. The computing device is configured to determine a plurality of border data points of the 3D object based on the 3D image, to determine a plurality of inside points positioned on a surface of the 3D object within a range defined among the border data points according to a spray width with which the spray tool is to spray the 3D object, and to output the border data points and the inside points as the spraying information for spraying the 3D object.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: A circuit includes a bit line, a pass gate coupled between the bit line and a power node having a first power voltage level, and a driver coupled between the bit line and a reference node having a reference voltage level. The pass gate couples the bit line to the power node when the first signal has the reference voltage level and decouples the bit line from the power node when the first signal has the first power voltage level. The driver receives a second signal based on a control signal, couples the bit line to the reference node when the second signal has a second power voltage level below the first power voltage level, and decouples the bit line from the reference node when the second signal has the reference voltage level. An input circuit generates the first signal independent of the control signal.

Abstract: An integrated circuit includes a first array of memory cells, a second array of memory cells, a first pair of complementary data lines, a second pair of complementary data lines, and a third pair of complementary data lines. The first pair of complementary data lines extend along the first array of memory cells, and are coupled to the first array of memory cells. The second pair of complementary data lines extend along the second array of memory cells, and are coupled to the first pair of complementary data lines. The third pair of complementary data lines extend along the second array of memory cells, and are coupled to the second array of memory cells. A number of rows of memory cells in the first array of memory cells is different from a number of rows of memory cells in the second array of memory cells.

Abstract: A latch circuit includes a latch clock generator configured to generate a latched clock signal based on a clock signal and a first enable signal, and an input latch coupled to the latch clock generator to receive the latched clock signal. The input latch is configured to generate a latched output signal based on the latched clock signal and an input signal. In response to the first enable signal having a disabling logic level, the latch clock generator is configured to set a logic level of the latched clock signal to a corresponding disabling logic level, regardless of the clock signal. The latch clock generator includes a first inverter configured to generate an inverted signal of the first enable signal, and a NAND gate coupled to the first inverter to receive the inverted signal of the first enable signal. The NAND gate is configured to generate the latched clock signal based on the clock signal and the inverted signal of the first enable signal.

Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.

Abstract: A method includes specifying a target memory macro, and determining failure rates of function-blocks in the target memory macro based on an amount of transistors and area distributions in a collection of base cells. The method also includes determining a safety level of the target memory macro, based upon a failure-mode analysis of the target memory macro, from a memory compiler, based on the determined failure rate.

Abstract: A method of operating a memory macro includes receiving a first signal indicating a first operational mode of the memory macro, receiving a second signal indicating a second operational mode of the memory macro, generating, by a first logic circuit, a third signal and a fourth signal based on the first signal and a fifth signal thereby causing a change in the first operational mode of the memory macro, and generating, by a second logic circuit, the fifth signal and a sixth signal based on at least the second signal and thereby causing a change in the second operational mode of the memory macro. The first logic circuit is coupled to a first memory cell array and a first IO circuit. The second logic circuit is coupled to a first and second set of word line driver circuits.

Abstract: A latch circuit includes a latch clock generator configured to generate a latched clock signal based on a clock signal and a first enable signal, and an input latch coupled to the latch clock generator to receive the latched clock signal. The input latch is configured to generate a latched output signal based on the latched clock signal and an input signal. In response to the first enable signal having a disabling logic level, the latch clock generator is configured to set a logic level of the latched clock signal to a corresponding disabling logic level, regardless of the clock signal.

Abstract: A method, of detecting an address decoding error of a semiconductor device, includes: decoding an original address, with an address decoder of the semiconductor device, to form a corresponding decoded address; recoding the decoded address, with an encoder of the semiconductor device, to form a recoded address; making a comparison, with a comparator of the semiconductor device, of the recoded address and the original address; and detecting an address decoding error based on the comparison.

Abstract: A latch circuit includes a latch clock generator configured to generate a latched clock signal based on a clock signal and a first enable signal, and an input latch coupled to the latch clock generator to receive the latched clock signal. The input latch is configured to generate a latched output signal based on the latched clock signal and an input signal. In response to the first enable signal having a disabling logic level, the latch clock generator is configured to set a logic level of the latched clock signal to a corresponding disabling logic level, regardless of the clock signal.

Abstract: An integrated circuit includes a first array of memory cells, a second array of memory cells, a first pair of complementary data lines, a second pair of complementary data lines, and a third pair of complementary data lines. The first pair of complementary data lines extend along the first array of memory cells, and are coupled to the first array of memory cells. The second pair of complementary data lines extend along the second array of memory cells, and are coupled to the first pair of complementary data lines. The third pair of complementary data lines extend along the second array of memory cells, and are coupled to the second array of memory cells. A number of rows of memory cells in the first array of memory cells is different from a number of rows of memory cells in the second array of memory cells.

Abstract: A method includes specifying a target memory macro with one or more parameters, finding function-blocks in the target memory macro, and determining failure rates of the function-blocks based on an amount of transistors and area distributions in a collection of base cells. The method includes generating a failure-mode analysis for the target memory macro, from a memory compiler, based on the failure rates of the function-blocks. The method includes determining a safety level of the target memory macro, based upon the failure-mode analysis of the target memory macro.

Abstract: A circuit includes a selection circuit configured to receive a first address from a first port and a second address from a second port, a first latch circuit coupled to the selection circuit and configured to output each of the first address and the second address received from the selection circuit, a decoder, and a control circuit. The control circuit is configured to generate a plurality of signals configured to cause the decoder to decode each of the first address and the second address.

Abstract: A circuit includes a selection circuit configured to receive a first address at a first input and a second address at a second input, pass the first address to an output when a select signal has a first logical state, and pass the second address to the output when the select signal has a second logical state different from the first logical state. The circuit also includes a decoder configured to decode the passed first address or second address.

Abstract: A circuit includes a selection circuit configured to receive a first address at a first input and a second address at a second input, pass the first address to an output when a select signal has a first logical state, and pass the second address to the output when the select signal has a second logical state different from the first logical state. The circuit also includes a decoder configured to decode the passed first address or second address.