Abstract: A water washing device for carbon fiber filament and a method of water washing using the same are provided. The water washing device divides a temperature controller and the carbon fiber filament by disposing a division plate in a water washing tank; thus a temperature of washing water can be accurately controlled. Further, spray nozzle(s) can be controlled to enhance washing effect of the carbon fiber filament.

Abstract: Carbon fiber and method of forming the same are provided. The method modifies proportion of a finishing oil to control a relation between a surface tension and a particle size of the finishing oil, and thus penetration of the finishing oil into an interior of the carbon fiber is avoided. Therefore, the carbon fiber can have both low oil residues and a high strength.

Abstract: A mobile device includes an NFC (Near Field Communication) antenna including a metal coil and a first dielectric substrate, a coupling metal element, and a second dielectric substrate. The metal coil is disposed on the first dielectric substrate. The coupling metal element is adjacent to the metal coil. The coupling metal element does not directly touch the metal coil. The coupling metal element is disposed on the second dielectric substrate. The coupling metal element is configured to adjust the operational frequency of the NFC antenna.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a first radiating member, a second radiating member, a grounding member, and a capacitance element. The first radiating member includes a first radiating part, a second radiating part, a feeding part, and a grounding part. The second radiating member is coupling to the first radiating member. The second radiating member includes a third radiating part and a main body part that are connected to each other. There is a first predetermined length between a feeding point of the feeding part and an open end of the second radiating part. There is an electrical length between a connection point where the main body part is electrically connected to the capacitance element and an open end of the third radiating part. The electrical length is greater than the first predetermined length.

Abstract: An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.

Abstract: A semiconductor device is disposed and includes a substrate, on which a scan line, a data line, a source electrode, a drain electrode, an organic semiconductor pattern, an organic insulating layer, a gate electrode, and an organic protection layer are disposed. The source electrode is electrically connected to the data line. The organic semiconductor pattern is disposed between the source electrode and the drain electrode. The organic insulating layer is disposed on an upper surface and a side surface of the organic semiconductor pattern. The organic insulating layer is at least disposed between the side surface of the organic semiconductor pattern and the gate electrode and disposed between the upper surface of the organic semiconductor pattern and the gate electrode. The gate electrode is electrically connected to the scan line. The organic protection layer covers the gate electrode.

Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Abstract: A mobile device including a metal housing, a substrate, a grounding metal element, a first radiation element, a second radiation element, and a switch element is provided. The metal housing includes a body portion and a slot disposed on the body portion. The substrate is disposed on the metal housing. The grounding metal element is disposed on the metal housing and coupled to the metal housing. The switch element is disposed on the substrate, and the switch element is coupled between the second radiation element and the grounding metal element. When the switching element is switched to a first mode, a first radiation pattern is generated by the first radiation element and the second radiation element, when the switching element is switched to a second mode, a second radiation pattern is generated by the first radiation element and the second radiation element.

Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes an electrostatic discharge detection circuit, a discharge circuit, and a switch. The electrostatic discharge detection circuit detects whether an electrostatic discharge event occurs at the bounding pad to generate a first detection circuit. The discharge circuit receives the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the discharge circuit provides a discharge path between the bounding pad and a ground terminal according to the first detection signal. The switch is coupled between the core circuit and the ground terminal and controlled by the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the switch is turned off according to the first detection signal.

Abstract: A semiconductor package and a method of forming the same are disclosed. A method of forming a semiconductor package includes the following operations. A polymer layer is formed over a die. A metal feature is formed in the polymer layer. An argon-containing plasma treatment is performed to the polymer layer and the metal feature.

Abstract: A mobile device including a metal housing, a substrate, a grounding metal element, a first radiation element, a second radiation element, and a switch element is provided. The metal housing includes a body portion and a slot disposed on the body portion. The substrate is disposed on the metal housing. The grounding metal element is disposed on the metal housing and coupled to the metal housing. The switch element is disposed on the substrate, and the switch element is coupled between the second radiation element and the grounding metal element. When the switching element is switched to a first mode, a first radiation pattern is generated by the first radiation element and the second radiation element, when the switching element is switched to a second mode, a second radiation pattern is generated by the first radiation element and the second radiation element.

Abstract: A semiconductor package and a method of forming the same are disclosed. A method of forming a semiconductor package includes the following operations. A polymer layer is formed over a die. A metal feature is formed in the polymer layer. An argon-containing plasma treatment is performed to the polymer layer and the metal feature.

Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Abstract: A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radiation element has a feeding point, and is disposed on the first surface of the dielectric substrate. The first vertical projection of the first radiation element at least partially overlaps the slot. The second radiation element is disposed on the second surface of the dielectric substrate. The second vertical projection of the second radiation element at least partially overlaps the slot. An antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover.