Abstract: A fingerprint sensing device includes a plurality of sensing units. Each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located between the first anode and the first cathode. The diode includes a second anode and a second cathode, and a semiconductor layer located between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Abstract: A method for fabricating a shallow trench isolation includes forming a trench in a substrate, forming a bottom shallow trench isolation dielectric filling a gap of the trench, and forming a top shallow trench isolation dielectric on the bottom shallow trench isolation. The bottom shallow trench isolation dielectric has a concave center portion, and the top shallow trench isolation dielectric is deposited on the bottom shallow trench isolation by a high density plasma chemical vapor deposition process using low deposition to sputter ratio. A semiconductor structure having the shallow trench isolation is also disclosed.

Abstract: An optical sensing device includes a thin film transistor disposed on a substrate, an optical sensor, a planar layer, and an organic light emitting diode. The optical sensor includes a metal electrode disposed on a gate dielectric layer of the thin film transistor and connecting to a drain electrode of the thin film transistor, an optical sensing layer disposed on the metal electrode, and a first transparent electrode disposed on the optical sensing layer. The planar layer covers at least a part of the thin film transistor and the optical sensor. The organic light emitting diode is disposed on the planar layer. The anode electrode and the cathode electrode of the organic light emitting diode are electrically coupled to a gate line and a data line respectively.

Abstract: An optical sensing device includes a thin film transistor disposed on a substrate, an optical sensor, a planar layer, and an organic light emitting diode. The optical sensor includes a metal electrode disposed on a gate dielectric layer of the thin film transistor and connecting to a drain electrode of the thin film transistor, an optical sensing layer disposed on the metal electrode, and a first transparent electrode disposed on the optical sensing layer. The planar layer covers at least a part of the thin film transistor and the optical sensor. The organic light emitting diode is disposed on the planar layer. The anode electrode and the cathode electrode of the organic light emitting diode are electrically coupled to a gate line and a data line respectively.

Abstract: A fingerprint sensing device includes a plurality of sensing units. Each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located between the first anode and the first cathode. The diode includes a second anode and a second cathode, and a semiconductor layer located between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Abstract: An optical sensing device includes a thin film transistor disposed on a substrate, an optical sensor, a planar layer, and an organic light emitting diode. The optical sensor includes a metal electrode disposed on a gate dielectric layer of the thin film transistor and connecting to a drain electrode of the thin film transistor, an optical sensing layer disposed on the metal electrode, and a first transparent electrode disposed on the optical sensing layer. The planar layer covers at least a part of the thin film transistor and the optical sensor. The organic light emitting diode is disposed on the planar layer. The anode electrode and the cathode electrode of the organic light emitting diode are electrically coupled to a gate line and a data line respectively.

Abstract: A method for fabricating a shallow trench isolation includes forming a trench in a substrate, forming a bottom shallow trench isolation dielectric filling a gap of the trench, and forming a top shallow trench isolation dielectric on the bottom shallow trench isolation. The bottom shallow trench isolation dielectric has a concave center portion, and the top shallow trench isolation dielectric is deposited on the bottom shallow trench isolation by a high density plasma chemical vapor deposition process using low deposition to sputter ratio. A semiconductor structure having the shallow trench isolation is also disclosed.

Abstract: A light sensing device includes a substrate, a control unit and a light sensing unit. The control unit and the light sensing unit are disposed on the substrate. The control unit includes a gate electrode, a gate insulation layer, an oxide semiconductor pattern, a source electrode and a drain electrode. The gate insulation layer is disposed on the gate electrode, and the oxide semiconductor pattern is disposed on the gate insulation layer. The light sensing unit includes a bottom electrode, a light sensing diode and a top electrode. The light sensing diode is disposed on the bottom electrode, and the top electrode is disposed on the light sensing diode. The gate insulation layer partially covers the top electrode, and the gate insulation layer has a first opening partially exposing the bottom electrode. The drain electrode is electrically connected to the bottom electrode via the first opening.

Abstract: A multi-function Radio-Frequency device integrated into a computer system is disclosed and includes a substrate including a first surface and a second surface opposite to each other, a touchpad area disposed on the first surface of the substrate for generating a touch signal according to a touch situation, an antenna disposed on the first surface and/or the second surface of the substrate for receiving and transmitting a Radio-Frequency signal, and a control module disposed on the second surface of the substrate and coupled to the touchpad area and the antenna for generating a touch control signal according to the touch signal and generating an identification signal according to the Radio-Frequency signal to the computer system.

Abstract: The mechanism of forming a metal bump structure described above resolves the delamination issues between a conductive layer on a substrate and a metal bump connected to the conductive layer. The conductive layer can be a metal pad, a post passivation interconnect (PPI) layer, or a top metal layer. By performing an in-situ deposition of a protective conductive layer over the conductive layer (or base conductive layer), the under bump metallurgy (UBM) layer of the metal bump adheres better to the conductive layer and reduces the occurrence of interfacial delamination. In some embodiments, a copper diffusion barrier sub-layer in the UBM layer can be removed. In some other embodiments, the UBM layer is not needed if the metal bump is deposited by a non-plating process and the metal bump is not made of copper.

Abstract: A multi-function Radio-Frequency device integrated into a computer system is disclosed and includes a substrate including a first surface and a second surface opposite to each other, a touchpad area disposed on the first surface of the substrate for generating a touch signal according to a touch situation, an antenna disposed on the first surface and/or the second surface of the substrate for receiving and transmitting a Radio-Frequency signal, and a control module disposed on the second surface of the substrate and coupled to the touchpad area and the antenna for generating a touch control signal according to the touch signal and generating an identification signal according to the Radio-Frequency signal to the computer system.

Abstract: A label sheet positioning device is provided for a barcode printer, including a pressure regulation seat having two pressure adjusting knobs and at least one universal adjusting knob mounted to a top thereof. The pressure adjusting knobs serve to adjust pressure for positioning in the upward-downward direction of a label sheet of the barcode printer. The universal adjusting knob functions to realize fine adjustment of pressure for positioning in a universal adjustable manner that the pressure regulation seat applies to the label sheet. At least one universal adjusting mechanism is coupled to bottom of the pressure regulation seat for effecting adjustment of inclination direction by the universal adjustment realized by the universal adjusting knob.

Abstract: A label tensioning board is provided for a label printer, including a body, at least one shaft, a resilient element, and at least one slide. The body forms a slot for rotatably accommodating the shaft. The resilient element is coupled to a proximal end of the shaft and the proximal end of the shaft is fixed to an enclosure of the label printer to allow for resilient rotation and returning of the body for adjustment of tension. The body forms at least one rail and a stop. The slide slidably engages the rail for sliding movement along the rail. The slide forms a positioning projection for setting a space between the slide and the stop that accommodate and guides the conveyance of a sheet of label paper. As such, a tensioning board featuring both adjustment of label tension and positioning of the label is provided.

Abstract: A process system includes a manufacture device, a concentration detector and a compensation device. The manufacture device is used for processing a wafer using a chemical solution. The concentration detector detects a concentration of a key component in the chemical solution. The compensation device provides a supplement solution to the manufacture device when the concentration of the key component in the chemical solution is lower than a definite value, wherein the supplement solution includes a component that is the same as the key component in the chemical solution.