Patents by Inventor Ching-Wen Wang

Ching-Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293531
    Abstract: A depth sensing system and a depth sensing method are provided. The sensing system includes depth sensing module and a processor for performing the sensing method. The depth sensing method incudes: obtaining a sensed target data set via a depth sensing module; calculating a period number corresponding to a measuring pixel; and calculating an actual range value or an actual depth of the measuring pixel in accordance with a period number and a range value of the measuring pixel. The step of calculating the period number of the target data set includes: calculating a spatial ratio in accordance with the position values of the pixel of optical center and measuring pixel, and a focal length of the depth sensing module; calculating a basic range in accordance with the spatial ratio and an unit depth; and calculating the period number corresponding to the measuring pixel.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: May 6, 2025
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Wu-Feng Chen, Ching-Wen Wang, Cheng Che Tsai, Hsueh-Tsung Lu
  • Patent number: 12292273
    Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.
    Type: Grant
    Filed: September 11, 2022
    Date of Patent: May 6, 2025
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Wu-Feng Chen, Ching-Wen Wang, Cheng Che Tsai, Hsueh-Tsung Lu
  • Patent number: 12265179
    Abstract: A three-dimensional structure sensing system includes an image sensor that receives a reflected light from an object irradiated by an emitted light, the reflected light being converted into image data representing an image of the object; and a depth processing unit that generates depth data according to the image data. It is determined whether the depth data is affected by a reflective surface according to the image data and the depth data.
    Type: Grant
    Filed: August 15, 2023
    Date of Patent: April 1, 2025
    Assignee: Himax Technologies Limited
    Inventors: Min-Chian Wu, Cheng-Che Tsai, Ching-Wen Wang
  • Patent number: 12266124
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: April 1, 2025
    Assignee: Himax Technologies Limited
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Patent number: 12262550
    Abstract: A method of manufacturing a semiconductor structure is provided. A substrate including a first silicon carbide layer and a second silicon carbide layer under the first silicon carbide layer is formed. The substrate includes a unit region and a termination region surrounding the unit region. A first guard ring structure is formed in the termination region and the first silicon carbide layer, adjoining a top surface of the first silicon carbide layer. A second guard ring structure is formed in the termination region and the second silicon carbide layer. Second guard ring well regions of the second guard ring structure correspond one-on-one to first guard ring well regions of the first guard ring structure. Each of the second guard ring well regions overlaps with a corresponding one of the first guard ring well regions in a vertical direction perpendicular to the top surface of the substrate.
    Type: Grant
    Filed: December 12, 2024
    Date of Patent: March 25, 2025
    Assignee: Diodes Incorporated
    Inventors: Ching-Wen Wang, Jie Li, Ming-Wei Tsai, Chiao-Shun Chuang
  • Patent number: 12261046
    Abstract: Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask and epitaxial layer on a semiconductor substrate, and forming a first doped region in the epitaxial layer by performing a first implantation through the first patterned hard mask. A second doped region is formed in the epitaxial layer by performing a second implantation through the first patterned hard mask, with the first doped region at least partially overlapping the second doped region. A second patterned hard mask is formed, which surrounds the first patterned hard mask and covers at least a portion of the first doped region. A third doped region is formed in the epitaxial layer by performing a third implantation through the first patterned hard mask and the second patterned hard mask.
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: March 25, 2025
    Assignee: Diodes Incorporated
    Inventors: Jie Li, Ming-Wei Tsai, Chiao-Shun Chuang, Ching-Wen Wang
  • Publication number: 20250060455
    Abstract: A three-dimensional structure sensing system includes an image sensor that receives a reflected light from an object irradiated by an emitted light, the reflected light being converted into image data representing an image of the object; and a depth processing unit that generates depth data according to the image data. It is determined whether the depth data is affected by a reflective surface according to the image data and the depth data.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Inventors: Min-Chian Wu, Cheng-Che Tsai, Ching-Wen Wang
  • Patent number: 12218191
    Abstract: A semiconductor structure includes a silicon carbide layer, which has a unit region and a termination region surrounding the unit region. A first guard ring structure is located in the termination region of the silicon carbide layer, and adjoins a top surface of the silicon carbide layer. The first guard ring structure may include at least one first guard ring well region. A second guard ring structure is located in the silicon carbide layer and below the first guard ring structure. The second guard ring structure may include at least one second guard ring well region, which corresponds to the at least one first guard ring well region in a vertical direction. A method for manufacturing the semiconductor structure is also provided.
    Type: Grant
    Filed: March 13, 2024
    Date of Patent: February 4, 2025
    Assignee: Diodes Incorporated
    Inventors: Ching-Wen Wang, Jie Li, Ming-Wei Tsai, Chiao-Shun Chuang
  • Patent number: 12131510
    Abstract: An object detection system includes a projector that projects an original transmitted light on a scene containing an object; an adjustable device configured to shape the original transmitted light, thereby generating a shaped transmitted light; and an image capture device configured to capture an image from a reflected light from the scene. The original transmitted light is alternated with the shaped transmitted light, thereby resulting in an integrated image captured by the image capture device.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: October 29, 2024
    Assignee: Himax Technologies Limited
    Inventors: Wu-Feng Chen, Ching-Wen Wang, Cheng-Che Tsai, Hsueh-Tsung Lu
  • Publication number: 20240241259
    Abstract: A time-of-flight (ToF) three-dimensional (3D) sensing system includes a projector that generates an emitted light corresponding to an emitted signal; a sensor that generates a received signal according to a reflected light; and a decoder that determines a distance between the sensor and the object according to the received signal. The emitted signal associated with the emitted light is generated in a basis period, and the received signal associated with the reflected light is generated by the sensor with a first phase shift with respect to a beginning of the basis period. No emitted light is generated in a supplemental period following the basis period, and the received signal has a second phase shift with respect to a beginning of the supplemental period. The distance between the sensor and the object is determined according to the first phase shift and the second phase shift.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Publication number: 20240233152
    Abstract: A depth sensing system and a depth sensing method are provided. The sensing system includes depth sensing module and a processor for performing the sensing method. The depth sensing method incudes: obtaining a sensed target data set via a depth sensing module; calculating a period number corresponding to a measuring pixel; and calculating an actual range value or an actual depth of the measuring pixel in accordance with a period number and a range value of the measuring pixel. The step of calculating the period number of the target data set includes: calculating a spatial ratio in accordance with the position values of the pixel of optical center and measuring pixel, and a focal length of the depth sensing module; calculating a basic range in accordance with the spatial ratio and an unit depth; and calculating the period number corresponding to the measuring pixel.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 11, 2024
    Inventors: Wu-Feng CHEN, Ching-Wen WANG, Cheng Che TSAI, Hsueh-Tsung LU
  • Publication number: 20240168168
    Abstract: A three-dimensional (3D) scanning system includes a projector that generates an emitted light projected on an object, a reflected light being reflected from the object; a sensor that generates image data according to the reflected light; and a depth processor that generates depth data according to the image data and at least one modified factor representing corresponding deviation amount between the image data and an ideal image data due to a circle of confusion caused by the reflected light passing a lens of the sensor and then irradiating a sense plane of the sensor out of focus.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Min-Chian Wu, Ting-Sheng Hsu, Ching-Wen Wang, Cheng-Che Tsai
  • Publication number: 20240155231
    Abstract: A method for performing light shaping with aid of an adaptive projector and associated apparatus are provided.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 9, 2024
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventors: Wu-Feng Chen, Ching-Wen Wang, Cheng-Che Tsai, Hsueh-Tsung Lu
  • Patent number: 11979661
    Abstract: A method for performing light shaping with aid of an adaptive projector and associated apparatus are provided.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: May 7, 2024
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Wu-Feng Chen, Ching-Wen Wang, Cheng-Che Tsai, Hsueh-Tsung Lu
  • Publication number: 20240119613
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Publication number: 20240085172
    Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.
    Type: Application
    Filed: September 11, 2022
    Publication date: March 14, 2024
    Inventors: Wu-Feng CHEN, Ching-Wen WANG, Cheng Che TSAI, Hsueh-Tsung LU
  • Patent number: 11929041
    Abstract: A display apparatus includes a backlight module with backlight zones, a panel over the backlight module, and a circuit configured to generate compensated pixel data for the panel based on image data and an arrangement of the zones of the backlight module, in which the image data has image areas respectively corresponding to the backlight zones. For a first image area being a low-luminance image area and a luminance intensity of a first zone of the zones corresponding to the first image area being less than a luminance intensity of a second zone corresponding to a second image area neighboring the first image area, the circuit performs first pixel compensation for high-luminance pixels in the second image area and second pixel compensation on low-luminance pixels in the second image area, in which the second pixel compensation is greater than the first pixel compensation.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 12, 2024
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chao Chen Huang, Tsai Hsing Chen, Cheng Che Tsai, Ching-Wen Wang
  • Publication number: 20240071281
    Abstract: A display device includes a display panel and a circuit. For a first sub-pixel, the circuit obtains a corresponding second sub-pixel. The circuit calculates a first compensation value according to the grays levels of the first sub-pixel and the second sub-pixel, and calculates a second compensation value according to the polarity states of the first sub-pixel and the second sub-pixel and the difference between the gray levels of the two sub-pixels. The circuit also calculates a gain according to the position of the first sub-pixel, compensates the gray level to the first sub-pixel according to the first compensation value, the second compensation value and the gain to obtain an output gray level, and drives the first sub-pixel according to the output gray level.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Inventors: Cheng-Hsun LEE, Tsai Hsing CHEN, Cheng Che TSAI, Ching-Wen WANG
  • Patent number: 11915512
    Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 27, 2024
    Assignee: Himax Technologies Limited
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Ting-Sheng Hsu, Min-Chian Wu
  • Publication number: 20240062398
    Abstract: A depth sensing apparatus includes an image sensor, a depth decoder and a depth fusion processor. The mage sensor captures raw images from a scene with different exposure configurations. The depth decoder decodes each raw image into depth values, each raw image having pixels respectively corresponding to the depth values. The depth fusion processor sets one of the raw images and the rest of at least one raw image as a base image and at least one reference image, respectively, and substitutes invalid depth values of the depth values corresponding to the base image with valid depth values corresponding to the at least one reference image to generate a depth map of the scene. The invalid depth values corresponding to the base image and the valid depth values corresponding to the at least one reference image map to the same pixels of the raw images.
    Type: Application
    Filed: August 21, 2022
    Publication date: February 22, 2024
    Inventors: Hsueh-Tsung LU, Ching-Wen WANG, Cheng Che TSAI, Wu-Feng CHEN