Patents by Inventor Ching-Wen Wang

Ching-Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210020832
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a magnetic tunnel junction (MTJ) region and an edge region, forming an first inter-metal dielectric (IMD) layer on the substrate, and then forming a first MTJ and a second MTJ on the first IMD layer, in which the first MTJ is disposed on the MTJ region while the second MTJ is disposed on the edge region. Next, a second IMD layer is formed on the first MTJ and the second MTJ.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 21, 2021
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Patent number: 10890839
    Abstract: The structured light imaging device includes a projector including a diffractive optical element, an image sensor, and a processing circuit. The processing circuit is configured to control the projector to emit a beam having a special pattern, and alter an amplitude of the beam during a sensing period. The image sensor is configured to capture an image corresponding to the beam during the sensing period, and transmits the image to the processing circuit. The processing circuit calculates a depth according to the image and a predetermined image having the special pattern. Therefore, the interference phenomenon is reduced.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: January 12, 2021
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Tsai-Hsing Chen, Seng-Yu Huang, Wei-Cheng Lu, Hsueh-Tsung Lu
  • Patent number: 10890442
    Abstract: A structured light projector and a method for structured light projection are disclosed. The structured light projector includes a projection module, a liquid crystal (LC) lens and a processor. The projection module is configured to project an optical pattern. The (LC) lens module is disposed over the projection module, and is configured to focus the optical pattern onto a region of space. The processor is configured to generate a control signal depending on an environment temperature of the projection module for controlling the LC lens.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 12, 2021
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen, Hsueh-Tsung Lu
  • Publication number: 20200390791
    Abstract: Compositions (e.g., pharmaceutical compositions, nutraceutical compositions or medical food compositions) comprising tannic acids, particularly tannic acids which are D-amino acid oxidase inhibitor with superior potency, purity and safety profile; and uses thereof for treating CNS disorder and obesity disorders including diabetes, hyperglycemia, hyperlipidemia or hypercholesterolemia.
    Type: Application
    Filed: May 26, 2020
    Publication date: December 17, 2020
    Applicant: SyneuRx International (Taiwan) Corp.
    Inventors: Guochuan Emil Tsai, Ching-Cheng Wang, Tien-Lan Hsieh, Yi-Wen Mao
  • Publication number: 20200363773
    Abstract: The present disclosure provides a protection casing assembly for a wearable device. The protection casing assembly includes a main case and a frame. The main case has a first accommodation space and configured to allow a wearable device to be disposed detachably. When the wearable device is disposed in the first accommodation space, the wearable device and the main case define a second accommodation space adjacent to at a device surface of the wearable device. The frame is detachably disposed in the second accommodation space.
    Type: Application
    Filed: October 2, 2019
    Publication date: November 19, 2020
    Inventors: CHING-FU WANG, SHENG-CHE SU, PO-WEN HSIAO, CHIA-HO LIN
  • Patent number: 10840437
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a magnetic tunnel junction (MTJ) region and an edge region, forming an first inter-metal dielectric (IMD) layer on the substrate, and then forming a first MTJ and a second MTJ on the first IMD layer, in which the first MTJ is disposed on the MTJ region while the second MTJ is disposed on the edge region. Next, a second IMD layer is formed on the first MTJ and the second MTJ.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 17, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Publication number: 20200352045
    Abstract: The present disclosure provides a foldable apparatus for receiving a foldable device. The foldable apparatus includes a casing for receiving the foldable device. The casing includes a body and a bending zone. The body is for providing an accommodation to the foldable device. The bending zone is for folding the body from an unfolded position to a folded position. The bending zone includes a stress relaxation structure for retaining the body in the folded position and reversing the body to the unfolded position.
    Type: Application
    Filed: April 30, 2020
    Publication date: November 5, 2020
    Inventors: CHING-FU WANG, SHENG-CHE SU, PO-WEN HSIAO, CHIA-HO LIN
  • Publication number: 20200335477
    Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A core layer and a dielectric layer are sequentially stacked over the package array. The core layer includes a plurality of cavities. A plurality of first conductive patches is formed on the dielectric layer above the cavities.
    Type: Application
    Filed: July 8, 2020
    Publication date: October 22, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chien-Ling Hwang, Pei-Hsuan Lee, Tzu-Chun Tang, Yu-Ting Chiu, Jui-Chang Kuo
  • Patent number: 10784252
    Abstract: An ESD protection circuit, which protects a subject NMOS transistor coupled between an I/O pad and a ground, includes a first discharge device arranged between the I/O pad and the ground, having a trigger-on voltage that is lower than a breakdown voltage of the subject NMOS transistor; and a gate voltage control device, including a discharge NMOS transistor coupled to the ground and a gate of the subject NMOS transistor; a first PMOS transistor connected to the gate of the subject NMOS transistor and a connection node; and a first NMOS transistor connected to the connection node and the ground. The connection node is connected to the gate of the discharge NMOS transistor, and the gate of the first PMOS transistor and the gate of the first NMOS transistor are connected to each other.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: September 22, 2020
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang Huang, Li-Fan Chen, Chih-Hsuan Lin, Yu-Kai Wang, Hung-Wei Chen, Ching-Wen Wang, Ting-You Lin, Chun-Chih Chen
  • Patent number: 10756052
    Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A dielectric layer having a core layer formed thereon is provided. The core layer includes a plurality of cavities penetrating through the core layer. The dielectric layer and the core layer are attached onto the package array such that the core layer is located between the dielectric layer and the package array. A plurality of first conductive patches is formed on the dielectric layer above the cavities.
    Type: Grant
    Filed: July 28, 2019
    Date of Patent: August 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chien-Ling Hwang, Pei-Hsuan Lee, Tzu-Chun Tang, Yu-Ting Chiu, Jui-Chang Kuo
  • Patent number: 10700409
    Abstract: A back cover includes a metal body having a first side, a second side, and a groove that is formed at the first side. The metal body further has a first radiator, a second radiator, and a ground radiator. The first radiator is disposed in the groove, and has a main portion and a support portion that cooperatively form a T-shape. The main portion includes a feeding end adjacent to a closed end of the groove. The second radiator is adjacently connected to the groove and is defined by the first and second sides, and an edge of the groove. The ground radiator is formed by a portion of the metal body excluding the first and second radiators. The second radiator and the support portion are connected to the ground radiator. The first and second radiators, and the ground radiator are serve as an antenna structure.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 30, 2020
    Assignee: Acer Incorporated
    Inventors: Shih-Ting Huang, Ching-Chi Lin, Chien-Wen Chen, Chuan-Chun Wang
  • Patent number: 10633118
    Abstract: A mobile rustproofing washing system includes a receptacle, a control module, a water supply module, a filtration module and a washing module. The receptacle is removably disposed on a mobile carrier. The control module is disposed in the receptacle. The water supply module is disposed in the receptacle and includes a front water tank and a rear water tank. The filtration module is connected to the front water tank and the rear water tank. The filtration module receives and filters water from the front water tank. The filtered water is stored in the rear water tank. The washing module connects with the rear water tank and receives water therefrom, so as to carry out a washing process. Therefore, the mobile rustproofing washing system is quick to mount/demount and easy to use, thereby having high mobility.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: April 28, 2020
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yu-Ping Wang, Chin-Cheng Wu, Ming-Jia Wang, Chun-Yu Chen, Yi-Rong Zeng, Kuan-You Liu, Ming-Ta Hsieh, Ching-Wen Fan
  • Publication number: 20200106155
    Abstract: A back cover includes a metal body having a first side, a second side, and a groove that is formed at the first side. The metal body further has a first radiator, a second radiator, and a ground radiator. The first radiator is disposed in the groove, and has a main portion and a support portion that cooperatively form a T-shape. The main portion includes a feeding end adjacent to a closed end of the groove. The second radiator is adjacently connected to the groove and is defined by the first and second sides, and an edge of the groove. The ground radiator is formed by a portion of the metal body excluding the first and second radiators. The second radiator and the support portion are connected to the ground radiator. The first and second radiators, and the ground radiator are serve as an antenna structure.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 2, 2020
    Applicant: Acer Incorporated
    Inventors: Shih-Ting Huang, Ching-Chi Lin, Chien-Wen Chen, Chuan-Chun Wang
  • Patent number: 10608045
    Abstract: A semiconductor device and method of forming the same, the semiconductor device includes a substrate, first plug, a magnetoresistive random access memory (MRAM) structure, a spacer layer, a seal layer and a first conductive pattern. The substrate has a first region and a second region, and the first plug is disposed on a dielectric layer disposed on the substrate, within the first region. The MRAM structure is disposed in the dielectric layer and electrically connected to the first plug. The spacer layer is disposed both within the first region and the second region, to cover the MRAM structure. The seal layer is disposed on the MRAM structure and the first plug, only within the first region. The first conductive pattern penetrates through the seal layer to electrically connect the MRAM structure.
    Type: Grant
    Filed: March 10, 2019
    Date of Patent: March 31, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Publication number: 20200098740
    Abstract: An ESD protection circuit, which protects a subject NMOS transistor coupled between an I/O pad and a ground, includes a first discharge device arranged between the I/O pad and the ground, having a trigger-on voltage that is lower than a breakdown voltage of the subject NMOS transistor; and a gate voltage control device, including a discharge NMOS transistor coupled to the ground and a gate of the subject NMOS transistor; a first PMOS transistor connected to the gate of the subject NMOS transistor and a connection node; and a first NMOS transistor connected to the connection node and the ground. The connection node is connected to the gate of the discharge NMOS transistor, and the gate of the first PMOS transistor and the gate of the first NMOS transistor are connected to each other.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang HUANG, Li-Fan CHEN, Chih-Hsuan LIN, Yu-Kai WANG, Hung-Wei CHEN, Ching-Wen WANG, Ting-You LIN, Chun-Chih CHEN
  • Publication number: 20200075421
    Abstract: A method includes providing a structure having first and second fins over a substrate and oriented lengthwise generally along a first direction and source/drain (S/D) features over the first and second fins; forming an interlayer dielectric (ILD) layer covering the S/D features; performing a first etching process at least to an area between the S/D features, thereby forming a trench in the ILD layer; depositing a dielectric material in the trench; performing a second etching process to selectively recess the dielectric material; and performing a third etching process to selectively recess the ILD layer, thereby forming a contact hole that exposes the S/D features.
    Type: Application
    Filed: August 9, 2019
    Publication date: March 5, 2020
    Inventors: I-Wen Wu, Chen-Ming Lee, Fu-Kai Yang, Mei-Yun Wang, Chang-Yun Chang, Ching-Feng Fu, Peng Wang
  • Patent number: 10570947
    Abstract: A flipper screw includes a lower cover with a screw and a lower cover with nut, and it is used for fixing the web by replacing the anti-slip screw. The upper cover and the lower cover are provided with plural snap portion, which can be snapped in the rib around the screw hole, so as to avoid the web accidentally being released from the flipper.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 25, 2020
    Inventor: Ching-Wen Wang
  • Publication number: 20200054695
    Abstract: The present invention provides an active substance of Lactic Acid Bacteria, a composition comprising thereof and its use for promoting longevity, especially for increasing Cisd2 gene expression, reducing mitochondrial damage and delaying aging conditions such as nerve degeneration and sarcopenia.
    Type: Application
    Filed: August 15, 2019
    Publication date: February 20, 2020
    Applicant: GRAPE KING BIO LTD.
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shin-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG
  • Publication number: 20200054696
    Abstract: The present invention provides an active substance of Lactic Acid Bacteria, a composition comprising thereof and its use for promoting longevity, especially for increasing Cisd2 gene expression, reducing mitochondrial damage and delaying aging conditions such as nerve degeneration and sarcopenia.
    Type: Application
    Filed: August 15, 2019
    Publication date: February 20, 2020
    Applicant: GRAPE KING BIO LTD.
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shin-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG
  • Publication number: 20200054692
    Abstract: The present invention provides a Bifidobacterium lactis having active substances, a composition comprising the same, and a method of promoting longevity using the same by subjecting the composition to a subject, thereby increasing Cisd2 gene expression, reducing damage of mitochondria, delaying aging-related symptoms including nerve degeneration and sarcopenia, and so on.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 20, 2020
    Inventors: Chin-Chu CHEN, Yen-Lien Chen, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-TZU SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG