Abstract: Embodiments of a photodiode array are provided herein. In some embodiments, a photodiode array may include a semiconductor layer configured to convert photons into analog electrical signals; and a passive layer having a first surface and a second surface disposed opposite the first surface, wherein the semiconductor layer is coupled to the first surface, and wherein the passive layer is configured to have a signal receiving component coupled directly to the second surface of the passive layer.

Abstract: A radiation detector is provided that provides fast sequential image acquisition. In one embodiment, the radiation detector a diode capacitor that is charged in response to a radiation exposure event. The charge stored in the diode capacitor is transferred to a separate storage capacitor, allowing a new charge to be generated and stored at the diode capacitor.

Abstract: A tiled imager panel is disclosed. In certain embodiments, the tiled imager panel is formed from separate imager chips that are mechanically tiled together so as to minimize the gap between the tiled imager chips. In addition, in certain embodiments, a scintillator material associated with the tiled imager panel is in a hermetically sealed environment so as to be protected from moisture.

Abstract: A tiled imager panel is disclosed. In certain embodiments, the tiled imager panel is formed from separate imager chips that are mechanically tiled together so as to minimize the gap between the tiled imager chips. In addition, in certain embodiments, a scintillator material associated with the tiled imager panel is in a hermetically sealed environment so as to be protected from moisture.

Abstract: A radiation detector is provided that provides fast sequential image acquisition. In one embodiment, the radiation detector a diode capacitor that is charged in response to a radiation exposure event. The charge stored in the diode capacitor is transferred to a separate storage capacitor, allowing a new charge to be generated and stored at the diode capacitor.

Abstract: An article, such as a solar cell or module, is presented. In one embodiment, the article includes a photovoltaically active region and a photovoltaically inactive region. A filler material is disposed in the inactive region; the filler material includes a reflective material configured to scatter at least 50% of light incident on the filler material. Another embodiment is an article that includes a photovoltaically active region and a photovoltaically inactive region. A filler material is disposed in the inactive region; the filler material includes a wavelength converting material. Other embodiments are described herein in which the filler material described above and disposed in the inactive region includes both the reflective material and the wavelength converting material.

Abstract: A functional block for assembly includes at least one element and a patterned magnetic film comprising at least one magnetic region attached to the element. A wafer includes a host substrate comprising a number of elements. The wafer further includes a patterned magnetic film attached to the elements and comprising a number of magnetic regions. The magnetic regions are attached to respective ones of the elements. A method of manufacture includes forming a number of magnetic regions on a host substrate having an array of elements. The forming step provides at least one of the magnetic regions for a respective group comprising at least one of the elements.

Abstract: A fluidic assembly method includes dispersing a number of functional blocks in a fluid to form a slurry. Each of the functional blocks includes at least one element and a patterned magnetic film comprising at least one region. The fluidic assembly method further includes immersing at least a portion of an article in the fluid. The article includes a substrate, a number of receptor sites disposed on the substrate and a number of magnetic receptors, each of the magnetic receptors being disposed within a respective one of the receptor sites. A method of manufacturing an assembly includes disposing a number of functional blocks over at least a portion of an article, agitating the functional blocks relative to the article and assembling at least a subset of the functional blocks to the magnetic receptors on the article.

Abstract: Briefly, in accordance with one or more embodiments, a detector panel of an imaging system may be produced from a photodiode array integrated with a thin-film transistor array. The thin film transistor array may have one or more vias formed for increasing the adhesion of the photodiode array to the thin-film transistor array. The vias may comprise sidewalls having stepped structures. The thin-film transistor array may comprise a first metallization layer and a second metallization layer. A third metallization layer may be added to the thin film transistor array wherein diodes of the photodiode array may contact the third metallization layer. Diodes of the photodiode array may contact the first metallization layer and/or the second metallization layer via the third metallization layer without directly contacting the first metallization layer or the second metallization layer.

Abstract: Systems, methods and apparatus are provided through which in some implementations field-effect-transistor (FET) leakage from a pixel array panel of a digital X-ray detector is reduced by acquiring an image and an offset image from the pixel array panel of the digital X-ray detector while a negative voltage of the pixel array panel is at a higher level than a negative voltage of a threshold state of the pixel array panel of the digital X-ray detector.

Abstract: Systems, methods and apparatus are provided through which in some implementations field-effect-transistor (FET) leakage from a pixel array panel of a digital X-ray detector is reduced by acquiring an image and an offset image from the pixel array panel of the digital X-ray detector while a negative voltage of the pixel array panel is at a higher level than a negative voltage of a threshold state of the pixel array panel of the digital X-ray detector.

Abstract: A structured scintillator and a detection system employing structured scintillators. More specifically, a structured scintillator comprising a scintillator material having a plurality of isolated structures is disclosed. The structures may be conical in shape. The structures may be formed on a substantially transparent material layer which has been patterned to form a plurality of isolated regions. The structures may be formed on top of the isolated regions to provide isolated scintillator structures having space therebetween. The isolated regions and scintillator structures may be aligned with underlying detection devices.

Abstract: A digital X-ray panel and method of fabricating an X-ray detector panel assembly is provided. The method includes forming a detector matrix on the detector substrate, forming a dam on the detector substrate circumscribing the detector matrix, forming a scintillator material on the detector matrix, and forming a hermetic covering on the scintillator material that at least one of extends to a surface of the dam and extends past the dam. The digital X-ray panel assembly includes a detector substrate, a detector matrix formed on said detector substrate, a dam formed on said detector substrate circumscribing the detector matrix, a scintillator material formed on the detector matrix, and a hermetic covering formed on the scintillator material that at least one of extends past the detector matrix and the dam, and extends past the detector matrix onto a surface of the dam.

Abstract: An article for assembly includes a substrate, at least one receptor site disposed on the substrate and a patterned magnetic film. The patterned magnetic film includes at least one magnetic region, each magnetic region being disposed within one of the receptor sites. The patterned magnetic film comprises a material with a perpendicular magnetic anisotropy. An assembly includes at least one functional block comprising at least one element and a patterned magnetic film comprising at least one region. The assembly further includes an article comprising a substrate, at least one receptor site disposed on the substrate and at least one receptor configured to generate a magnetic field gradient for attracting the region. The receptor is positioned at the receptor site.

Abstract: A functional block for assembly includes at least one element and a patterned magnetic film comprising at least one magnetic region attached to the element. A wafer includes a host substrate comprising a number of elements. The wafer further includes a patterned magnetic film attached to the elements and comprising a number of magnetic regions. The magnetic regions are attached to respective ones of the elements. A method of manufacture includes forming a number of magnetic regions on a host substrate having an array of elements. The forming step provides at least one of the magnetic regions for a respective group comprising at least one of the elements.

Abstract: A method of making a capacitive micromachined ultrasound transducer cell is provided. The method includes providing a carrier substrate, where the carrier substrate comprises glass. The step of providing the glass substrate may include forming vias in the glass substrate. Further, the method includes providing a membrane such that at least one of the carrier substrate, or the membrane comprises support posts, where the support posts are configured to define a cavity depth. The method further includes bonding the membrane to the carrier substrate by using the support posts, where the carrier substrate, the membrane and the support posts define an acoustic cavity.

Abstract: A structured scintillator and a detection system employing structured scintillators. More specifically, a structured scintillator comprising a scintillator material having a plurality of isolated structures is disclosed. The structures may be conical in shape. The structures may be formed on a substantially transparent material layer which has been patterned to form a plurality of isolated regions. The structures may be formed on top of the isolated regions to provide isolated scintillator structures having space therebetween. The isolated regions and scintillator structures may be aligned with underlying detection devices.

Abstract: Briefly, in accordance with one or more embodiments, a detector panel of an imaging system may be produced from a photodiode array integrated with a thin-film transistor array. The thin film transistor array may have one or more vias formed for increasing the adhesion of the photodiode array to the thin-film transistor array. The vias may comprise sidewalls having stepped structures. The thin-film transistor array may comprise a first metallization layer and a second metallization layer. A third metallization layer may be added to the thin film transistor array wherein diodes of the photodiode array may contact the third metallization layer. Diodes of the photodiode array may contact the first metallization layer and/or the second metallization layer via the third metallization layer without directly contacting the first metallization layer or the second metallization layer.

Abstract: A fluidic assembly method includes dispersing a number of functional blocks in a fluid to form a slurry. Each of the functional blocks includes at least one element and a patterned magnetic film comprising at least one region. The fluidic assembly method further includes immersing at least a portion of an article in the fluid. The article includes a substrate, a number of receptor sites disposed on the substrate and a number of magnetic receptors, each of the magnetic receptors being disposed within a respective one of the receptor sites. A method of manufacturing an assembly includes disposing a number of functional blocks over at least a portion of an article, agitating the functional blocks relative to the article and assembling at least a subset of the functional blocks to the magnetic receptors on the article.

Abstract: Storage capacitor design for a solid state imager. The imager includes several pixels disposed on a substrate in an imaging array pattern. Each pixel includes a photosensor coupled to a thin film switching transistor. Several scan lines are disposed at a first level with respect to the substrate along a first axis and several data lines are disposed at a second level along a second axis of the imaging array. Several data lines disposed at a second level with respect to the substrate along a second axis of the imaging array pattern. Each pixel comprises a storage capacitor coupled parallel to the photosensor, the storage capacitor comprising a storage capacitor electrode and a capacitor common electrode.