Abstract: A radiation detector assembly, in some aspects, includes a detector substrate and a detector matrix array disposed on the detector substrate. A scintillator material is disposed on the detector matrix array and a moisture resistant layer is disposed on the scintillator material. The moisture resistant layer includes a plurality of sub-layers. The assembly also includes a protective cover disposed over the detector substrate and the moisture resistant layer, and an adhesive material disposed between the detector substrate and the cover. The adhesive material in some configurations is disposed so that it is not in contact with the moisture resistant layer.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly includes a scintillator material disposed on a detector matrix array disposed on a detector substrate; and an encapsulating coating disposed on the scintillator material. The encapsulating coating includes a combination of a mono-chloro-poly-para-xylylene layer and a poly-para-xylylene layer. In one embodiment, a poly-para-xylylene layer is disposed over the scintillator material and a mono-chloro-poly-para-xylylene layer is disposed over the poly-para-xylylene layer.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Abstract: Storage capacitor design for a solid state imager. The imager includes several pixels disposed on a substrate in an imaging array pattern. Each pixel includes a photosensor coupled to a thin film switching transistor. Several scan lines are disposed at a first level with respect to the substrate along a first axis and several data lines are disposed at a second level along a second axis of the imaging array. Several data lines disposed at a second level with respect to the substrate along a second axis of the imaging array pattern. Each pixel comprises a storage capacitor coupled parallel to the photosensor, the storage capacitor comprising a storage capacitor electrode and a capacitor common electrode.

Abstract: A method for fabricating a radiation detector including at least one Thin Film Transistor (TFT) includes forming a low resistance data line strap unitary with a light block element on the TFT.

Abstract: A digital X-ray panel and method of fabricating an X-ray detector panel assembly is provided. The method includes forming a detector matrix on the detector substrate, forming a dam on the detector substrate circumscribing the detector matrix, forming a scintillator material on the detector matrix, and forming a hermetic covering on the scintillator material that at least one of extends to a surface of the dam and extends past the dam. The digital X-ray panel assembly includes a detector substrate, a detector matrix formed on said detector substrate, a dam formed on said detector substrate circumscribing the detector matrix, a scintillator material formed on the detector matrix, and a hermetic covering formed on the scintillator material that at least one of extends past the detector matrix and the dam, and extends past the detector matrix onto a surface of the dam.

Abstract: A radiation detector assembly, in some aspects, includes a detector substrate and a detector matrix array disposed on the detector substrate. A scintillator material is disposed on the detector matrix array and a moisture resistant layer is disposed on the scintillator material. The moisture resistant layer includes a plurality of sub-layers. The assembly also includes a protective cover disposed over the detector substrate and the moisture resistant layer, and an adhesive material disposed between the detector substrate and the cover. The adhesive material in some configurations is disposed so that it is not in contact with the moisture resistant layer.

Abstract: A radiation detector includes a top gate thin film transistor (TFT) including a source electrode, a drain electrode, a gate electrode, a first dielectric layer, and a second dielectric layer, wherein the second dielectric layer is extending over a surface of the first dielectric layer. The radiation detector also includes a capacitor that includes at least two electrodes and a dielectric layer. The capacitor dielectric layer is formed unitarily with the TFT second dielectric layer.

Abstract: A solid state imager is provided that comprises an imaging array of gated photodiodes. The imager comprises a plurality of photosensor pixels arranged in a pixel array, and each of the photosensor pixels includes a photodiode having a sidewall, the sidewall having a gate dielectric layer disposed thereon, and a field plate disposed around the photodiode body. The field plate comprises amorphous silicon disposed on the gate dielectric layer and extends substantially completely around the sidewall of said photodiode. The field plate is electrically coupled to the common electrode of the imaging array so that the field plate creates an electric field around the photodiode body in correspondence with the potential of said common electrode. A method of fabricating the gated photodiode array is also provided.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly includes a scintillator material disposed on a detector matrix array disposed on a detector substrate; and an encapsulating coating disposed on the scintillator material. The encapsulating coating includes a combination of a mono-chloro-poly-para-xylylene layer and a poly-para-xylylene layer. In one embodiment, a poly-para-xylylene layer is disposed over the scintillator material and a mono-chloro-poly-para-xylylene layer is disposed over the poly-para-xylylene layer.

Abstract: A method for fabricating a radiation detector including at least one Thin Film Transistor (TFT) includes forming a low resistance data line strap unitary with a light block element on the TFT.

Abstract: A radiation detector includes a top gate thin film transistor (TFT) including a source electrode, a drain electrode, a gate electrode, a first dielectric layer, and a second dielectric layer, wherein the second dielectric layer is extending over a surface of the first dielectric layer. The radiation detector also includes a capacitor that includes at least two electrodes and a dielectric layer. The capacitor dielectric layer is formed unitarily with the TFT second dielectric layer.

Abstract: An imager includes a photodiode array, each photodiode having an associated switching device, such as a thin-film transistor, addressable via a scan line. A data line for reading out from the photodiodes is formed first on a glass substrate, allowing the data line to be optimized in terms of thickness for conductivity.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.

Abstract: A radiation imager includes a light sensitive imaging array, a barrier layer formed over the light sensitive imaging array, a continuous polymer layer formed over the barrier layer, and a scintillator formed directly on the continuous polymer layer. The continuous polymer layer improves the adherence of the scintillator by reducing delamination especially under adverse environmental conditions.

Abstract: A light block material disposed over the photosensitive region of a switching device (e.g., TFT) of a radiation imager is disclosed. The light block material prevents optical photons emitted from a scintillator from passing into the switching device and being absorbed. Cross-talk and noise in the imager are thereby reduced. Also, non-linear pixel response and spurious signals passing to readout electronics are avoided. Optionally, opaque caps comprising the same light block material may be included in the imager structure. The caps cover contact vias filled with a common electrode and located in the contact finger region of the imager. The integrity of the filled vias is thereby maintained during subsequent processing. Also disclosed is a radiation imager containing these structures.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.