Patents by Inventor Ching-Yu Chen
Ching-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11121230Abstract: Structures and methods for controlling dopant diffusion and activation are disclosed. In one example, a semiconductor structure is disclosed. The semiconductor structure includes: a channel layer; a barrier layer over the channel layer; a gate electrode over the barrier layer; and a doped layer formed between the barrier layer and the gate electrode. The doped layer includes (a) an interface layer in contact with the barrier layer and (b) a main layer between the interface layer and the gate electrode. The doped layer comprises a dopant whose doping concentration in the interface layer is lower than that in the main layer.Type: GrantFiled: September 19, 2019Date of Patent: September 14, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ching-Yu Chen, Wei-Ting Chang, Yu-Shine Lin, Jiang-He Xie
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Publication number: 20210242337Abstract: Various embodiments of the present disclosure are directed toward an integrated chip including an undoped layer overlying a substrate. A first barrier layer overlies the undoped layer. A doped layer overlies the first barrier layer. Further, a second barrier layer overlies the first barrier layer, where the second barrier layer is laterally offset from a perimeter of the doped layer by a non-zero distance. The first and second barrier layers comprise a same III-V semiconductor material. A first atomic percentage of a first element within the first barrier layer is less than a second atomic percentage of the first element within the second barrier layer.Type: ApplicationFiled: May 12, 2020Publication date: August 5, 2021Inventors: Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Chia-Ling Yeh, Ching Yu Chen
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Publication number: 20210226040Abstract: A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Inventors: Chia-Ling Yeh, Ching Yu Chen
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Patent number: 11011614Abstract: A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.Type: GrantFiled: May 17, 2019Date of Patent: May 18, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Ling Yeh, Ching Yu Chen
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Patent number: 10989221Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.Type: GrantFiled: June 29, 2016Date of Patent: April 27, 2021Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
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Publication number: 20210099818Abstract: A system and a method for evaluating noise cancelling capability are provided, and the system and method are configured to evaluate a noise cancelling capability of an external device. The system includes a mixer, a player, a recorder and a comparator. The mixer receives and mixes a target audio file and a noise audio file and outputs a mix audio file. The player is connected to the mixer for receiving the mix audio file. The player outputs a first audio signal to the external device. The external device cancels the noise of the first audio signal and outputs a second audio signal. The recorder receives the second audio signal and outputs a noise-cancelled audio file. The comparator is connected to the recorder for receiving the noise-cancelled audio file. The comparator compares the noise-cancelled audio file and the target audio file and outputs an evaluation report according to a comparing result.Type: ApplicationFiled: November 18, 2019Publication date: April 1, 2021Inventors: Yi-Ching Chen, Ching-Yu Chen, Yun-Chiu Ching
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Publication number: 20210083279Abstract: A fast charging lithium-ion battery includes a positive electrode plate, a negative electrode plate, a separator, and an electrolyte. The positive electrode plate includes a positive current collector and a positive active material layers. The negative electrode plate includes a negative current collector and negative active material layers. The negative active material layers include titanium niobium oxide, lithium titanate, or a combination thereof. The separator is disposed between the positive electrode plate and the negative electrode plate. The electrolyte contacts the positive electrode plate and the negative electrode plate. The negative active material layers have an effective area corresponding to the positive electrode plate. The negative active material layers have a thickness on one surface of the negative current collector. A ratio of the effective area to the thickness is greater than 2×105 mm.Type: ApplicationFiled: September 18, 2020Publication date: March 18, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Deng-Tswen SHIEH, Sheng-Fa YEH, Shih-Chieh LIAO, Ching-Yu CHEN, Hao-Tzu HUANG
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Patent number: 10874030Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.Type: GrantFiled: April 24, 2019Date of Patent: December 22, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Kuo-Wei Lee
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Patent number: 10856447Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.Type: GrantFiled: January 11, 2019Date of Patent: December 1, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Kuo-Wei Lee
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Patent number: 10782750Abstract: The present disclosure describes an intake system for a fan module within a computer system. The intake system includes a cowling positioned in line with an intake path of the fan module. The cowling is configured to direct air into the fan module. The system further includes a remote intake that has a remote inlet, a remote outlet, and a remote conduit. The remote inlet is configured to intake air from around an element that is within the computer system and outside of the intake path of the fan module. The remote outlet is configured to discharge the air from the remote inlet into the intake path of the fan module. The remote conduit is configured to transport the air from the remote inlet to the remote outlet.Type: GrantFiled: April 23, 2019Date of Patent: September 22, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Yu-Jou Ho
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Patent number: 10779439Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.Type: GrantFiled: August 28, 2018Date of Patent: September 15, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Erh-Kai Fang
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Publication number: 20200214177Abstract: A dynamic air impedance mechanism is provided which has particular utility in changing the impedance of air flow within servers. The mechanism comprises an air duct having a plurality of vent holes, a control plate defining a plurality of openings, and relative movement between the openings in the control plate and the corresponding vent holes in the air duct to change the impedance of air flow through the server.Type: ApplicationFiled: May 15, 2019Publication date: July 2, 2020Inventors: Chao-Jung CHEN, Yu-Nien Huang, Ching-Yu CHEN, Tsung-Ta LI
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Publication number: 20200214172Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.Type: ApplicationFiled: April 24, 2019Publication date: July 2, 2020Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Ching-Yu CHEN, Kuo-Wei LEE
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Patent number: 10694640Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.Type: GrantFiled: May 21, 2018Date of Patent: June 23, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
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Publication number: 20200111891Abstract: Structures and methods for controlling dopant diffusion and activation are disclosed. In one example, a semiconductor structure is disclosed. The semiconductor structure includes: a channel layer; a barrier layer over the channel layer; a gate electrode over the barrier layer; and a doped layer formed between the barrier layer and the gate electrode. The doped layer includes (a) an interface layer in contact with the barrier layer and (b) a main layer between the interface layer and the gate electrode. The doped layer comprises a dopant whose doping concentration in the interface layer is lower than that in the main layer.Type: ApplicationFiled: September 19, 2019Publication date: April 9, 2020Inventors: Ching-Yu Chen, Wei-Ting Chang
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Publication number: 20200077543Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.Type: ApplicationFiled: January 11, 2019Publication date: March 5, 2020Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Ching-Yu CHEN, Kuo-Wei LEE
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Publication number: 20200006522Abstract: A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.Type: ApplicationFiled: May 17, 2019Publication date: January 2, 2020Inventors: Chia-Ling Yeh, Ching Yu Chen
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Patent number: 10512193Abstract: The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.Type: GrantFiled: January 18, 2019Date of Patent: December 17, 2019Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
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Publication number: 20190364697Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.Type: ApplicationFiled: August 28, 2018Publication date: November 28, 2019Inventors: Chao-Jung CHEN, Yi-Nien HUANG, Ching-Yu CHEN, Erh-Kai FANG
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Patent number: 10474529Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.Type: GrantFiled: November 9, 2017Date of Patent: November 12, 2019Assignee: VIA Technologies, Inc.Inventors: Ching-Yu Chen, Yi-Lin Lai, Chen-Te Chen