Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.

Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.

Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.

Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A cooling fan assembly is provided which includes a fan housing and an axial fan. The fan housing has a shroud panel with cutout portions along the airflow path of the axial fan. Fixed members separate the cutout portions. Flap members are attached to the fixed members so that the flap members can pivot between an open position and a closed position. The flap members are pushed by airflow from the axial fan into an open position when the fan is operational. When the fan is non-operational or when air begins to enter the fan in the reverse direction of the axial fan's airflow path, the flap members are configured to move to a closed position. In the closed position, air cannot flow through the reverse direction of the axial fan's airflow path.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A driver circuit supplies a positive voltage and a negative voltage to a load. The driver circuit includes: a positive power conversion circuit, coupled to the load, and generating the positive voltage according to an input voltage; a negative power conversion circuit, coupled to the positive power conversion circuit and the load, and generating the negative voltage according to the positive voltage; and a headroom adaptive adjustment circuit, coupled to the positive power conversion circuit and the load, and generating an adjustment signal according to one or more of a load current flowing through the load, the positive voltage Vp and the negative voltage Vn. The adjustment signal is sent to the positive power conversion circuit to adjust a regulation target of the positive voltage.

Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.

Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.

Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.

Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.

Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.

Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.

Abstract: A heat dissipation apparatus having a base, a heat dissipater, and a plurality of fin arrays. The base has at least one horizontal portion disposed in the base and at least one vertical portion extending therefrom. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one vertical portion of the heat dissipater.

Abstract: A computing system includes a chassis having an airflow entrance and an airflow exhaust, a duct structure disposed in the chassis, and a redirection mechanism located on a wall of the duct structure and extending through a cutout in the wall of the duct structure. In the computing system, the duct structure has a first end facing the airflow entrance and a second end facing the airflow exhaust. The redirection mechanism has a deflector having an inlet airfoil extending away from the duct structure towards the airflow entrance and at least one exhaust airfoil extending into the duct structure.

Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.

Abstract: An illumination apparatus includes a frame, an optical base plate, a light source and an optical film. The optical base plate is disposed in the frame and has a first protrusion portion at the center of the optical base plate. The first protrusion portion has at least a reflective surface and a top surface, which are connected with each other. The light source is disposed in the frame and located adjacent to the periphery of the optical base plate. The light source is disposed corresponding to the reflective surface and has a plurality of light-emitting elements. Each light-emitting element has an optical axis direction, and the optical axis directions extend toward the first protrusion portion. The optical film is disposed at the frame, and the first protrusion portion of the optical base plate protrudes toward the optical film.

Abstract: A method is disclosed that includes the operations outlined below. An insulating material is disposed within a plurality of trenches on a semiconductor substrate and over the semiconductor substrate. The first layer is formed over the insulating material. The first layer and the insulating material are removed.

Abstract: The present invention discloses a light emitting device array billboard and a control method thereof. The light emitting device array billboard includes a light emitting device array circuit, plural line switch circuits, plural channel switch circuits, plural ghost image compensation switch circuits, and a control circuit. The control circuit operates the line switch circuits and the channel switch circuit to turn ON a selected light emitting device for a duty period in a lighting period, and operates the plural ghost image compensation switch circuits to electrically connect a channel node corresponding to the selected light emitting device to a ghost image compensation voltage after the lighting period. The control circuit further adjusts a channel operation signal according to a gray scale compensation signal, to turn ON the selected light emitting device for a gray scale compensation period in addition to the duty period.