Abstract: An antenna structure includes the following. A first radiation element has a feeding point. A second radiation element is coupled to the feeding point. A third radiation element is coupled through a capacitive element to the second radiation element. A fourth radiation element is coupled through a tunable circuit to a ground element. The fourth radiation element is adjacent to the first radiation element. A fifth radiation element is coupled to the fourth radiation element. A nonconductive support element has a first surface and a second surface which are opposite to each other. The first radiation element, the second radiation element, the capacitive element, the third radiation element, and the fourth radiation element are disposed on the first surface. The fifth radiation element is disposed on the second surface.

Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, a nonconductive support element, and a metal mechanism element. The first radiation element has a feeding point. The second radiation element is coupled to a first grounding point on the ground element and adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the first radiation element. The first radiation element is between the second radiation element and the third radiation element. The ground element, the first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The metal mechanism element has a slot.

Abstract: A sensing module includes a first antenna unit, a second antenna unit, a first inductor and a proximity sensor. The first antenna unit has at least one first communication frequency band, and the second antenna unit has at least one second communication frequency band. The first antenna unit and the second antenna unit are connected in parallel to one end of the first inductor, and the other end of the first inductor is electrically connected to the proximity sensor.

Abstract: A structure including a redistribution structure comprising dielectric layers and conductive layers alternately stacked is provided, wherein a dielectric layer among the dielectric layers of the redistribution structure comprises a first surface, a conductive layer among the conductive layers of the redistribution structure comprising a second surface, and the conductive layer comprises a wiring layer and a seed layer; and an under-bump metallization (UBM) layer comprises a third surface, a fourth surface opposite to the third surface, and a sidewall surface extending from the third surface to the fourth surface, wherein a portion of the seed layer is between the wiring layer and the UBM layer, and the UBM is in contact with the dielectric layer.

Abstract: An antenna structure includes a signal unit, a first ground unit, a second ground unit and a parasitic unit. The signal unit is configured for disposing a feed port thereon. The first ground unit is disposed correspondingly to the signal unit and configured to be connected to a system ground. The second ground unit is separated from the first ground unit and configured to be connected to the system ground. The parasitic unit is adjacent to the second ground unit and configured to be coupled to the first ground unit. The signal unit, the first ground unit, the second ground unit and the parasitic unit are made of the same or different conductive materials.

Abstract: An antenna structure includes a signal unit and a first ground unit. The signal unit is configured for disposing a feeding port thereon. The first ground unit has a generally tubular or ring-shaped form. The first ground unit is disposed correspondingly to the signal unit and includes a first ground end. The first ground end is configured to be connected to a system ground. The signal unit and the first ground unit are made of the same or different conductive materials.

Abstract: A method of manufacturing the package structure includes providing a carrier on which first dies and second dies are respectively bonded to form stacks and an encapsulant laterally encapsulating the stacks, forming a dielectric layer over the stacks, forming openings in the dielectric layer to expose a portion of the second dies, forming trenches in the gaps through the encapsulant to expose the carrier, forming a cover layer on sidewalls of the trenches and sidewalls of the openings, and conformally forming a seed layer on the trenches, the openings, the carrier, the cover layer, the encapsulant, and the dielectric layer, forming a mask layer to cover a portion of the seed layer and expose the seed layer in the openings, and performing a plating process to form a conductive portion in the openings using the seed layer.

Abstract: A fully homomorphic encryption computing method includes: receiving a homomorphic encryption application; converting the homomorphic encryption application into a data flow graph; and performing a resource scheduling on the data flow graph according to connection relationships of a plurality of processing modules and an execution time to produce a scheduled result. The processing modules have at least two heterogeneous processor types.

Abstract: A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The clamping element includes a guide rod and a second limiting hole, the guide rod is inserted into the guide hole to allow the second limiting hole located on the guide hole to be communicated with the first limiting hole. The limiting element is inserted into the first and second limiting holes to integrate the base with the clamping element for clamping the workpiece.

Abstract: A vehicle driving control apparatus and a control method and a display method for the same are provided. The vehicle driving control apparatus includes a sensor and a processor. The sensor detects current relative position and current relative velocity of an object around a vehicle. The processor calculates a collision probability between the vehicle and the object based on the current relative position and current relative velocity of the object, and determines whether to adjust a driving dynamics of the vehicle based on the collision probability.

Abstract: A manufacturing method for a carbon fiber includes the following steps. A first monomer and a second monomer are dissolved in a first solvent, and a polymerization reaction is performed to form a copolymerized polymer, in which the first monomer includes acrylonitrile, the second monomer has an unsaturated bond, the first solvent includes dimethyl sulfoxide, and based on 100 wt % of the first solvent, a content of the dimethyl sulfoxide is between 99.9 wt % and 100 wt %. A spinning step is performed on the copolymerized polymer.

Abstract: A flexible printed circuit and an antenna structure are provided. The flexible printed circuit has a main body part and a bending part and includes a substrate, two copper foil layers, and two coverlays. The substrate includes a first surface and a second surface, and one surface of each of the two copper foil layers is disposed on the first surface and the second surface of the substrate, respectively. Each of the two coverlays is disposed on another surface of each of the two copper foil layers. Each of the two coverlays includes at least two coverlay holes, and the at least two coverlay holes penetrate through the coverlay and are disposed on the main body part.

Abstract: A manufacturing method for a carbon fiber includes: performing an emulsification step that includes uniformly mixing a silicone oil composition and an emulsifier to form an oiling agent, in which the silicone oil composition includes ?-divinyltriamine propylmethyldimethoxyl silane and N-(?-aminoethyl)-?-aminopropylmethylbimethoxy silane; performing an oiling step that includes soaking a carbon raw filament in the oiling agent, such that the oiling agent is adhered to a surface of the carbon raw filament to form a carbon fiber precursor; and performing a calcination step on the carbon fiber precursor, such that the carbon fiber is formed.

Abstract: A structure including a redistribution structure comprising dielectric layers and conductive layers alternately stacked is provided, wherein a dielectric layer among the dielectric layers of the redistribution structure comprises a first surface, a conductive layer among the conductive layers of the redistribution structure comprising a second surface, and the conductive layer comprises a wiring layer and a seed layer; and an under-bump metallization (UBM) layer comprises a third surface, a fourth surface opposite to the third surface, and a sidewall surface extending from the third surface to the fourth surface, wherein a portion of the seed layer is between the wiring layer and the UBM layer, and the UBM is in contact with the dielectric layer.

Abstract: A water washing device for carbon fiber filament and a method of water washing using the same are provided. The water washing device divides a temperature controller and the carbon fiber filament by disposing a division plate in a water washing tank; thus a temperature of washing water can be accurately controlled. Further, spray nozzle(s) can be controlled to enhance washing effect of the carbon fiber filament.

Abstract: An optoelectronic tweezer device includes a transparent substrate, a semiconductor layer, a first electrode and a dielectric layer. The semiconductor layer is located above the transparent substrate and includes a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region. The first electrode is located on the first doping region and is electrically connected to the first doping region. The dielectric layer is located above the semiconductor layer and has a first through hole overlapping the first electrode.

Abstract: An antenna structure and an electronic device are proposed. The antenna structure includes a feeding source, a main radiation portion, a grounding portion and a floating portion. The main radiation portion is connected to the feeding source and extends toward a first direction. The grounding portion is connected to a grounding layer, and a first gap is formed between the grounding portion and the main radiation portion. The grounding portion extends toward the first direction. A second gap is formed between the floating portion and the grounding portion. The floating portion extends toward the first direction. The main radiation portion, the grounding portion and the floating portion are arranged sequentially along a second direction.

Abstract: A sensing module includes a first antenna unit, a second antenna unit, a first inductor and a proximity sensor. The first antenna unit has at least one first communication frequency band, and the second antenna unit has at least one second communication frequency band. The first antenna unit and the second antenna unit are connected in parallel to one end of the first inductor, and the other end of the first inductor is electrically connected to the proximity sensor.

Abstract: An optoelectronic tweezer device includes a transparent substrate, a semiconductor layer, a first electrode and a dielectric layer. The semiconductor layer is located above the transparent substrate and includes a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region. The first electrode is located on the first doping region and is electrically connected to the first doping region. The dielectric layer is located above the semiconductor layer and has a first through hole overlapping the first electrode.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a feeding source, a main radiation portion, a metal portion, and a grounding portion. The main radiation portion is signally connected to the feeding source. There is a first gap between the metal portion and the main radiation portion. There is a second gap between the grounding portion and the metal portion, and there is a third gap between the grounding portion and the main radiation portion. The main radiation portion couples with the metal portion via the first gap, and the grounding portion couples with the metal portion via the second gap.