Patents by Inventor Ching-Wen Chen

Ching-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Publication number: 20240119613
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Patent number: 11956421
    Abstract: Method and apparatus of video coding are disclosed. According to one method, in the decoder side, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block when the neighboring block satisfies one or more conditions. An MPM (Most Probable Mode) list is derived based on information comprising at least one of neighboring Intra modes. A current Intra mode is derived utilizing the MPM list. The current luma block is decoded according to the current Intra mode According to another method, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block if the neighboring block is coded in BDPCM (Block-based Delta Pulse Code Modulation) mode, where the predefined Intra mode is set to horizontal mode or vertical mode depending on prediction direction used by the BDPCM mode.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Publication number: 20240113080
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu
  • Publication number: 20240106757
    Abstract: A method of wireless signal transmission management includes transmitting a plurality of data packets to tethering equipment from user equipment to tethering equipment, determining a size of each of the plurality of data packets by the tethering equipment, designating data packets of the plurality of data packets having a specific range of sizes as control signal packets by the tethering equipment, and prioritizing in transmitting the control signal packets to a cellular network by the tethering equipment.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ching-Hao Lee, Yi-Lun Chen, Ho-Wen Pu, Yu-Yu Hung, Jun-Yi Li, Ting-Sheng Lo
  • Publication number: 20240096756
    Abstract: A method of making a semiconductor device includes manufacturing a first transistor over a first side of a substrate. The method further includes depositing a spacer material against a sidewall of the first transistor. The method further includes recessing the spacer material to expose a first portion of the sidewall of the first transistor. The method further includes manufacturing a first electrical connection to the transistor, a first portion of the electrical connection contacts a surface of the first transistor farthest from the substrate, and a second portion of the electrical connect contacts the first portion of the sidewall of the first transistor. The method further includes manufacturing a self-aligned interconnect structure (SIS) extending along the spacer material, wherein the spacer material separates a portion of the SIS from the first transistor, and the first electrical connection directly contacts the SIS.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Chih-Yu LAI, Chih-Liang CHEN, Chi-Yu LU, Shang-Syuan CIOU, Hui-Zhong ZHUANG, Ching-Wei TSAI, Shang-Wen CHANG
  • Publication number: 20240096701
    Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.
    Type: Application
    Filed: May 17, 2023
    Publication date: March 21, 2024
    Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Ching-Wei TSAI, Shang-Wen CHANG, Yi-Hsun CHIU, Chih-Hao WANG
  • Publication number: 20240085172
    Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.
    Type: Application
    Filed: September 11, 2022
    Publication date: March 14, 2024
    Inventors: Wu-Feng CHEN, Ching-Wen WANG, Cheng Che TSAI, Hsueh-Tsung LU
  • Patent number: 11930543
    Abstract: A method of radio bearer transmission in dual connectivity for a network in a long term evolution (LTE) system comprises generating at least a packet data convergence protocol protocol data unit (PDCP PDU) by a PDCP entity of the network corresponding to a radio bearer (RB), and assigning each PDCP PDU with an identity, wherein the identity indicates which PDCP entity the PDCP PDU belongs to.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: March 12, 2024
    Assignee: ACER INCORPORATED
    Inventors: Hung-Chen Chen, Ching-Wen Cheng
  • Publication number: 20240077479
    Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.
    Type: Application
    Filed: August 10, 2023
    Publication date: March 7, 2024
    Applicant: DeepBrain Tech. Inc
    Inventors: Han-Lin Wang, Chia-Wei Chen, Yao-Wen Liang, Ting-Chun Lin, Yun-Ting Kuo, You-Yin Chen, Yu-Chun Lo, Ssu-Ju Li, Ching-Wen Chang, Yi-Chen Lin
  • Patent number: 11924444
    Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 5, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Publication number: 20240071281
    Abstract: A display device includes a display panel and a circuit. For a first sub-pixel, the circuit obtains a corresponding second sub-pixel. The circuit calculates a first compensation value according to the grays levels of the first sub-pixel and the second sub-pixel, and calculates a second compensation value according to the polarity states of the first sub-pixel and the second sub-pixel and the difference between the gray levels of the two sub-pixels. The circuit also calculates a gain according to the position of the first sub-pixel, compensates the gray level to the first sub-pixel according to the first compensation value, the second compensation value and the gain to obtain an output gray level, and drives the first sub-pixel according to the output gray level.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Inventors: Cheng-Hsun LEE, Tsai Hsing CHEN, Cheng Che TSAI, Ching-Wen WANG
  • Patent number: 11917185
    Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: February 27, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang
  • Publication number: 20240063101
    Abstract: A structure including a redistribution structure comprising dielectric layers and conductive layers alternately stacked is provided, wherein a dielectric layer among the dielectric layers of the redistribution structure comprises a first surface, a conductive layer among the conductive layers of the redistribution structure comprising a second surface, and the conductive layer comprises a wiring layer and a seed layer; and an under-bump metallization (UBM) layer comprises a third surface, a fourth surface opposite to the third surface, and a sidewall surface extending from the third surface to the fourth surface, wherein a portion of the seed layer is between the wiring layer and the UBM layer, and the UBM is in contact with the dielectric layer
    Type: Application
    Filed: August 22, 2022
    Publication date: February 22, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Chen, Ming-Che Ho, Hung-Jui Kuo
  • Patent number: 11898276
    Abstract: Carbon fiber and method of forming the same are provided. The method modifies proportion of a finishing oil to control a relation between a surface tension and a particle size of the finishing oil, and thus penetration of the finishing oil into an interior of the carbon fiber is avoided. Therefore, the carbon fiber can have both low oil residues and a high strength.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: February 13, 2024
    Assignee: FORMOSA PLASTICS CORPORATION
    Inventors: Kun-Yeh Tsai, Chia-Chi Hung, Wen-Ju Chou, Ching-Wen Chen, Chia-Chun Hsieh, Shi-Jie Lin, Long-Tyan Hwang
  • Patent number: 11888549
    Abstract: A mobile device includes an NFC (Near Field Communication) antenna including a metal coil and a first dielectric substrate, a coupling metal element, and a second dielectric substrate. The metal coil is disposed on the first dielectric substrate. The coupling metal element is adjacent to the metal coil. The coupling metal element does not directly touch the metal coil. The coupling metal element is disposed on the second dielectric substrate. The coupling metal element is configured to adjust the operational frequency of the NFC antenna.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: January 30, 2024
    Assignee: WISTRON NEWEB CORP.
    Inventors: Ting-Han Shih, Ching-Wen Chen
  • Patent number: 11882733
    Abstract: An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: January 23, 2024
    Assignee: Au Optronics Corporation
    Inventors: Shuo-Yang Sun, Shih-Hua Hsu, Ching-Wen Chen, Ying-Hui Lai
  • Patent number: 11870153
    Abstract: An electronic device and an antenna structure thereof are provided. The antenna structure includes a first, a second and a third radiating element and a grounding element. The first radiating element includes a first and a second radiating portion, a feeding portion and a grounding portion. The grounding portion includes a first, a second, a third, a fourth and a fifth section. The first section is connected between the first radiating portion and the feeding portion. The grounding element is connected with the fourth section and the fifth section. The second radiating element is connected with the grounding element. The second radiating element includes a third radiating portion, and the third and the second radiating portion are coupled with each other. The third radiating element is connected with the feeding portion, and the third radiating element and the first section are coupled with each other.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: January 9, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Cheng-Wei Chiang, Cheng-Rui Zhang, Ching-Wen Chen