Abstract: A lens assembly includes a lens barrel, a lens disposed on the lens barrel, and a filter configured to filter light passing through the lens, wherein the lens barrel includes a seating portion in which the filter is disposed, and a step portion disposed facing the filter between the seating portion and an optical axis, wherein an avoidance groove formed to be concave in an optical axis direction is disposed on an upper surface of the seating portion.

Abstract: A lens assembly includes a first lens barrel; a second lens barrel disposed in front of the first lens barrel while surrounding at least a portion of the first lens barrel; and a first lens disposed in front of the second lens barrel in contact with a portion of the second lens barrel, wherein a thermal conductance of the second lens barrel is higher than a thermal conductance of the first lens barrel.

Abstract: An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, sequentially arranged from an object side. The imaging lens system satisfies the following conditional expressions: ?2.6<f1/f6<?2.0, and 0.26?f/f4?0.32, where f is a focal length of the imaging lens system, f1 is a focal length of the first lens, f4 is a focal length of the fourth lens, and f6 is a focal length of the sixth lens.

Abstract: A semiconductor package structure includes a circuit pattern structure, an encapsulant and an anchoring structure. The encapsulant is disposed on the circuit pattern structure. The anchoring structure is disposed adjacent to an interface between the encapsulant and the circuit pattern structure, and is configured to reduce a difference between a variation of expansion of the encapsulant and a variation of expansion of the circuit pattern structure in an environment of temperature variation.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the first to seventh lenses are spaced apart from each other along the optical axis, and the optical imaging system satisfies 0.4<L1TR/L7TR<1.9, where L1TR is an overall outer diameter of the first lens, L7TR is an overall outer diameter of the seventh lens, and L1TR and L7TR are expressed in a same unit of measurement.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the first to seventh lenses are spaced apart from each other along the optical axis, and the optical imaging system satisfies 0.4<L1TR/L7TR<1.9, where L1TR is an overall outer diameter of the first lens, L7TR is an overall outer diameter of the seventh lens, and L1TR and L7TR are expressed in a same unit of measurement.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens sequentially disposed from an object side. The optical imaging system satisfies |Pnu|[10?6° C.?1 mm?1]?30, where Pnu is ?Pnui in which i=1, 2, . . . , 7, Pnui is 1/(vti·fi), vti is [DTni/(ni?1)?CTEi]?1, fi is an effective focal length of an i-th lens, ni is a refractive index of the i-th lens, DTni is a rate (dni/dT) of change of the refractive index according to a temperature of the i-th lens, and CTEi is a thermal expansion coefficient of the i-th lens.

Abstract: A water purification system designed to simulate the hydrological cycle for water purification. The water purification system comprises several main components and follows a series of steps to achieve efficient and effective water purification. The present invention comprises a vacuum chamber, a vacuum pump, a compressor, and a cooling coil. The vacuum chamber serves as the central unit where the water undergoes the simulated evaporation process. The vacuum pump creates a vacuum within the chamber, achieving an optimal vacuum range of 80%-92%, which lowers the boiling point of the water to 38-55° C. The compressor, utilizing its heat, transfers energy to the water in the vacuum chamber, leading to the generation of steam through a distillation process. The cooling coil, located after the distillation stage, condenses the steam back into liquid form, resulting in purified water collection. This condensed water, akin to rainwater, is clean and suitable for drinking.

Abstract: A semiconductor package structure includes a circuit pattern structure, an encapsulant and an anchoring structure. The encapsulant is disposed on the circuit pattern structure. The anchoring structure is disposed adjacent to an interface between the encapsulant and the circuit pattern structure, and is configured to reduce a difference between a variation of expansion of the encapsulant and a variation of expansion of the circuit pattern structure in an environment of temperature variation.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens sequentially disposed from an object side. The optical imaging system satisfies |Pnu|[10?6° C.?1 mm?1]?30, where Pnu is ?Pnui in which i=1, 2, . . . , 7, Pnui is 1/(vti·fi), vti is [DTni/(ni?1)?CTEi]?1, fi is an effective focal length of an i-th lens, ni is a refractive index of the i-th lens, DTni is a rate (dni/dT) of change of the refractive index according to a temperature of the i-th lens, and CTEi is a thermal expansion coefficient of the i-th lens.

Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: A lens module is provided. The lens module includes a first lens, a second lens, and a third lens sequentially disposed from an object side to an imaging side, a first spacing member disposed between the first lens and the second lens and having a first passage extending in a direction that intersects an optical axis, a second spacing member disposed between the second lens and the third lens and having a second passage extending in a direction that intersects the optical axis, and a lens barrel configured to accommodate the first lens, the second lens, the third lens, the first spacing member and the second spacing member, and configured to have a first connection passage disposed on an inner side surface and connected to the first passage and the second passage.

Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: An electronic device package is provided. The electronic device package includes a redistribution layer (RDL), a first electronic component and an interconnector. The RDL includes a topmost circuit layer, and the topmost circuit layer includes a conductive trace. The first electronic component is disposed over the RDL. The interconnector is disposed between the RDL and the first electronic component. A direction is defined by extending from a center of the first electronic component toward an edge of the first electronic component, and the direction penetrates a first sidewall and a second sidewall of the interconnector, the second sidewall is farther from the center of the first electronic component than the first sidewall is, and the conductive trace is outside a projection region of the second sidewall.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

Abstract: A method of managing teeth performed in a processor-based device includes: displaying a first oral measurement image including tooth measurement images in a tooth shape to measure state information of each of user’s teeth; receiving state information of a target teeth of the user measured from a tooth diagnostic device; receiving a selection signal input for selecting a first tooth measurement image from among the tooth measurement images; matching state information of the target tooth with state information of the first tooth measurement image; and representing the state information of the first tooth measurement image in the first oral measurement image.

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.