Abstract: In accordance with one exemplary embodiment of the present invention, there is a negative electrode active material for a secondary battery which includes a silicon-carbon composite that includes a carbon-based material and a first silicon-based nano-coating layer formed on the carbon-based material; silicon carbide; silicon nitride; and second silicon-based particles.

Abstract: A lens assembly includes a lens barrel, a lens disposed on the lens barrel, and a filter configured to filter light passing through the lens, wherein the lens barrel includes a seating portion in which the filter is disposed, and a step portion disposed facing the filter between the seating portion and an optical axis, wherein an avoidance groove formed to be concave in an optical axis direction is disposed on an upper surface of the seating portion.

Abstract: A lens assembly includes a first lens barrel; a second lens barrel disposed in front of the first lens barrel while surrounding at least a portion of the first lens barrel; and a first lens disposed in front of the second lens barrel in contact with a portion of the second lens barrel, wherein a thermal conductance of the second lens barrel is higher than a thermal conductance of the first lens barrel.

Abstract: An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, sequentially arranged from an object side. The imaging lens system satisfies the following conditional expressions: ?2.6<f1/f6<?2.0, and 0.26?f/f4?0.32, where f is a focal length of the imaging lens system, f1 is a focal length of the first lens, f4 is a focal length of the fourth lens, and f6 is a focal length of the sixth lens.

Abstract: A display panel and a display device are provided. The display panel has a display region and a non-display region. The display panel includes: a substrate; a driving array layer including first pixel circuits in the non-display region and second pixel circuits in the display region; a light-emitting device layer including first light-emitting devices in the non-display region and second light-emitting devices in the display region; and a photosensitive device assembly including first photosensitive devices and second photosensitive devices in the driving array layer. The first light-emitting devices are electrically connected with the first pixel circuits and the second light-emitting devices are electrically connected with the second pixel circuits.

Abstract: The present application relates to a positive electrode active material and a preparation method thereof, a positive electrode sheet and a secondary battery. The positive electrode active material has a composition chemical formula of LixNa1-xAyB1-yO2-nDn, where A is selected from a combination of Ni and Mn, B is selected from at least one non-alkali metal positive-valent element other than Ni, Mn, Co, and S, D is selected from F and/or S, 0.8?x?0.92, 0.90?y<1.0, 0<n?0.2, and a peak position difference between the Ni—O bond and the Mn—O bond of the positive electrode active material in a Raman spectrum is greater than 80 cm?1 and less than 110 cm?1. The positive electrode active material has high specific capacity and high cycle stability at a high voltage window, and low cost, causing the prepared secondary battery to have high cost performance.

Abstract: A semiconductor package structure includes a circuit pattern structure, an encapsulant and an anchoring structure. The encapsulant is disposed on the circuit pattern structure. The anchoring structure is disposed adjacent to an interface between the encapsulant and the circuit pattern structure, and is configured to reduce a difference between a variation of expansion of the encapsulant and a variation of expansion of the circuit pattern structure in an environment of temperature variation.

Abstract: The present disclosure relates to a UV- and heat-curable ladder-like polysilsesquioxane copolymer and a method for preparing the same. Since a controlled functionality can be provided only on a desired region via a thiol-ene click reaction without an additional additive, an insulating layer having a low dielectric constant and a microcircuit pattern can be formed without an additional etching process.

Abstract: Disclosed is an insulation structure for a transformer. The insulation structure according to the present inventive concept includes a low voltage part winding, a ferrite core, and a high voltage part having a high voltage part winding wound on one side of the ferrite core, an epoxy mold located to surround the high voltage part winding, a terminal protruding outward from one side of the epoxy mold, and a shield located to surround the outer peripheral surface of the terminal, wherein the epoxy mold has a conductive coating layer formed on the outer surfaces thereof in such a way as to be connected to ground or the ferrite core.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the first to seventh lenses are spaced apart from each other along the optical axis, and the optical imaging system satisfies 0.4<L1TR/L7TR<1.9, where L1TR is an overall outer diameter of the first lens, L7TR is an overall outer diameter of the seventh lens, and L1TR and L7TR are expressed in a same unit of measurement.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the first to seventh lenses are spaced apart from each other along the optical axis, and the optical imaging system satisfies 0.4<L1TR/L7TR<1.9, where L1TR is an overall outer diameter of the first lens, L7TR is an overall outer diameter of the seventh lens, and L1TR and L7TR are expressed in a same unit of measurement.

Abstract: An encoding apparatus and a decoding apparatus in a transform between a Modified Discrete Cosine Transform (MDCT)-based coder and a different coder are provided. The encoding apparatus may encode additional information to restore an input signal encoded according to the MIDCT-based coding scheme, when switching occurs between the MDCT-based coder and the different coder. Accordingly, an unnecessary bitstream may be prevented from being generated, and minimum additional information may be encoded.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens sequentially disposed from an object side. The optical imaging system satisfies |Pnu|[10?6° C.?1 mm?1]?30, where Pnu is ?Pnui in which i=1, 2, . . . , 7, Pnui is 1/(vti·fi), vti is [DTni/(ni?1)?CTEi]?1, fi is an effective focal length of an i-th lens, ni is a refractive index of the i-th lens, DTni is a rate (dni/dT) of change of the refractive index according to a temperature of the i-th lens, and CTEi is a thermal expansion coefficient of the i-th lens.

Abstract: A water purification system designed to simulate the hydrological cycle for water purification. The water purification system comprises several main components and follows a series of steps to achieve efficient and effective water purification. The present invention comprises a vacuum chamber, a vacuum pump, a compressor, and a cooling coil. The vacuum chamber serves as the central unit where the water undergoes the simulated evaporation process. The vacuum pump creates a vacuum within the chamber, achieving an optimal vacuum range of 80%-92%, which lowers the boiling point of the water to 38-55° C. The compressor, utilizing its heat, transfers energy to the water in the vacuum chamber, leading to the generation of steam through a distillation process. The cooling coil, located after the distillation stage, condenses the steam back into liquid form, resulting in purified water collection. This condensed water, akin to rainwater, is clean and suitable for drinking.

Abstract: A semiconductor package structure includes a circuit pattern structure, an encapsulant and an anchoring structure. The encapsulant is disposed on the circuit pattern structure. The anchoring structure is disposed adjacent to an interface between the encapsulant and the circuit pattern structure, and is configured to reduce a difference between a variation of expansion of the encapsulant and a variation of expansion of the circuit pattern structure in an environment of temperature variation.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens sequentially disposed from an object side. The optical imaging system satisfies |Pnu|[10?6° C.?1 mm?1]?30, where Pnu is ?Pnui in which i=1, 2, . . . , 7, Pnui is 1/(vti·fi), vti is [DTni/(ni?1)?CTEi]?1, fi is an effective focal length of an i-th lens, ni is a refractive index of the i-th lens, DTni is a rate (dni/dT) of change of the refractive index according to a temperature of the i-th lens, and CTEi is a thermal expansion coefficient of the i-th lens.

Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: A lens module is provided. The lens module includes a first lens, a second lens, and a third lens sequentially disposed from an object side to an imaging side, a first spacing member disposed between the first lens and the second lens and having a first passage extending in a direction that intersects an optical axis, a second spacing member disposed between the second lens and the third lens and having a second passage extending in a direction that intersects the optical axis, and a lens barrel configured to accommodate the first lens, the second lens, the third lens, the first spacing member and the second spacing member, and configured to have a first connection passage disposed on an inner side surface and connected to the first passage and the second passage.