Abstract: The present disclosure provides a probe and a probe card device. The probe card device includes a first plate and a plurality of probes. The probes are arranged through the first plate, and include a first probe and a second probe. The first probe has a first body and an end portion of the first body. The end portion of the first body has a first recess and a first protrusion. The second probe has a second body and an end portion of the second body. The end portion of the second body has a second recess and a second protrusion. The second protrusion extends into the first recess.

Abstract: A high speed signal transmitting and receiving detection device is provided. The high speed signal transmitting and receiving detection device includes a substrate unit and a plurality of probe units. The plurality of probe units pass through the substrate unit. The substrate unit includes a conducting space, a plurality of fillers and a plurality of barriers. Each of the fillers is arranged in the conducting space and between two of the probe units that are adjacent to each other. Each of the barriers is arranged in the conducting space and between the two of the probe units that are adjacent to each other. A capacitance effect between the two of the probe units that are adjacent to each other is formed through the filler and the barrier that correspond to the two of the probe units that are adjacent to each other.

Abstract: A probe card structure is provided. The probe card structure includes a circuit board, an adapter board, and a probe head assembly. The adapter board is disposed on one side of the circuit board, a plurality of electrically conductive pillars are formed on one surface of the adapter board that faces the circuit board. A solder ball is disposed on one end of each of the plurality of electrically conductive pillars facing the circuit board, and the adapter board is coupled to the circuit board through the solder balls of the plurality of electrically conductive pillars. The probe head assembly including a plurality of probes, the probe head assembly is coupled to the adapter board, and the plurality of probes are electrically connected to the adapter board.

Abstract: A probing system includes a chuck configured to support a device under test (DUT); and a manipulator disposed above the chuck and including a first probe protruding from the manipulator toward the chuck, wherein the first probe includes a temperature-sensing device for sensing a temperature adjacent to a front surface of the DUT. A probing device includes a chuck; a DUT disposed over the chuck; a manipulator disposed above the DUT, wherein the manipulator includes a first probe protruding from the manipulator toward the DUT and including a temperature-sensing device for sensing a temperature, the DUT is moved toward the manipulator for sensing a temperature of the DUT by the first probe.

Abstract: An elastic probe element, an elastic probe assembly, and a testing device are provided. The testing device includes a substrate, a guiding member, and multiple ones of the elastic probe elements. The guiding member has a plurality of through holes for the multiple ones of the elastic probe elements correspondingly passing through. The elastic probe element includes a main body, a first contact segment, and a second contact segment that are integrally formed. The main body has a plurality of needle structures, and any two adjacent needle structures have a gap arranged therebetween. The needle structures are connected to each other through a first connection part and a second connection part arranged at a first end and a second end of the elastic probe element, respectively. The first contact segment is arranged at the first end. The second contact segment is arranged at the second end.

Abstract: A testing device and probe elements thereof are provided. The testing device includes a circuit substrate, a plurality of probe elements, a first housing and a second housing. The plurality of probe elements are independent of each other and arranged at fixed intervals. Each probe element comprises a body, a first contact section and a second contact section. The body is provided with a plurality of strip-shaped perforations, and the body includes a first lateral side and a second lateral side opposite to each other. The first contact section is connected to the first lateral side, and the second contact section is connected to the second lateral side. The extension direction of the first contact section relative to the body and the extension direction of the second contact section relative to the body are distinct from each other.

Abstract: A probe card device including a probe structure is provided. Probes respectively pass through multiple through holes on at least two guide plates that are stacked and separated from each other, and each of the probes includes a main body, a contacting portion, a head portion, and a neck portion. The contacting portion is exposed under a lowermost guide plate. The head portion is exposed above an uppermost guide plate. The neck portion is connected between the main body and the head portion, and a part of the neck portion protrudes opposite thereof to form a protrusion portion. The protrusion portion and the main body form an included angle, the protrusion portion abuts against an upper surface of the uppermost guide plate, and a spacing between any two of the probes that are adjacent to each other is less than twice the thickness of the protrusion portion.

Abstract: A probing system includes a chuck configured to support a device under test (DUT); and a manipulator disposed above the chuck and including a first probe protruding from the manipulator toward the chuck, wherein the first probe includes a temperature-sensing device for sensing a temperature adjacent to a front surface of the DUT. A probing device includes a chuck; a DUT disposed over the chuck; a manipulator disposed above the DUT, wherein the manipulator includes a first probe protruding from the manipulator toward the DUT and including a temperature-sensing device for sensing a temperature, the DUT is moved toward the manipulator for sensing a temperature of the DUT by the first probe.

Abstract: The present disclosure provides a probing apparatus for semiconductor devices using pressurized fluid to control the testing conditions. The probing apparatus includes a housing configured to define a testing chamber; a device holder positioned on the housing and configured to hold and support at least one device under test; a platen positioned on the housing and configured to retain at least one probe; a card holder positioned on the platen and configured to hold a probe card including the probe; and at least one flow line positioned in the card holder. The flow line is configured to flow a fluid therein to adjust the temperature of the device under test.

Abstract: A test probe module is provided. The test probe module includes a circuit substrate, an interposer and a probe assembly. The interposer is coupled to the circuit substrate, and includes a plurality of through holes. The probe assembly is coupled to the interposer. The probe assembly includes a plurality of probes. A first terminal of each of the probes passes through a corresponding through hole and is electrically connected to the circuit substrate. A second terminal of each of the probes is in contact with a test object. The interposer has the same material properties as the test object.

Abstract: A probe card device is provided. The probe card device includes a circuit substrate, an interposer, an adapter board and a probe assembly. The interposer is coupled to the circuit substrate, and the adapter board is coupled to the interposer. The probe assembly is coupled to the adapter board, and the probe assembly is electrically connected to the circuit substrate through the interposer and the adapter board. One terminal of each of the probes is electrically connected to the circuit substrate. Another terminal of each of the probes is in contact with a test object. The interposer, the adapter board and the test object have the same material properties.

Abstract: A high speed signal transmitting and receiving detection device is provided. The high speed signal transmitting and receiving detection device includes a substrate unit and a plurality of probe units. The plurality of probe units pass through the substrate unit. The substrate unit includes a conducting space, a plurality of fillers and a plurality of barriers. Each of the fillers is arranged in the conducting space and between two of the probe units that are adjacent to each other. Each of the barriers is arranged in the conducting space and between the two of the probe units that are adjacent to each other. A capacitance effect between the two of the probe units that are adjacent to each other is formed through the filler and the barrier that correspond to the two of the probe units that are adjacent to each other.

Abstract: The present disclosure provides a switching matrix system and an operating method thereof for semiconductor characteristic measurement. The switching matrix system is configured to: detect an assembly of at least one switching matrix module inserted into a plurality of slots of the switching matrix system; determine a user interface according to the assembly of the at least one switching matrix module inserted into the slots, wherein the user interface includes an operable object corresponding to the assembly; and provide the user interface.

Abstract: A semiconductor structure includes a die including a circuitry disposed over a surface of the die or within the die and having specific functions for the die; a heat dissipation member attached to the die by an adhesive disposed between the surface of the die and the heat dissipation member; and a nanostructure disposed between the adhesive and the die, configured to conduct heat from the die to the heat dissipation member, protruding from the adhesive towards the surface of the die and contacting the surface of the die.

Abstract: A probe device includes a substrate, a holder, a plurality of test probes and a plurality of insulative skin layers. The substrate is provided with a conductive trace and the holder is disposed on the substrate. The test probes are oriented at an angle relative to the substrate, penetrating through the holder and electrically connected to the conductive trace. The insulative skin layer radially surrounds the test probe and contacts the test probe.

Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.

Abstract: A probing device includes a chuck configured to support a device under test (DUT); and a manipulator or probe card disposed above the chuck and including a plurality of probes protruding from the manipulator towards the chuck, wherein the chuck includes a roughened surface and vacuum suction holes for placement of wafer.

Abstract: A probing system includes a chuck configured to support a device under test (DUT); a probe card disposed above the chuck and including a plurality of probes protruding from the probe card toward the chuck; and a platen disposed between the chuck and the probe card and configured to support the probe card, wherein the chuck includes a shielding member disposed between the platen and the chuck.

Abstract: A method for testing and analyzing a display panel, comprising: providing a display panel including a circuitry and a pixel connected to the circuitry, wherein the pixel includes a capacitor, a transistor and an electrode electrically connected to the capacitor and the transistor; measuring a first parameter of the display panel; disabling the pixel; measuring a second parameter of the display panel; and deriving a third parameter of the pixel by subtracting the second parameter from the first parameter.

Abstract: The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.