Patents by Inventor Choon-Leong Lou

Choon-Leong Lou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210311111
    Abstract: A probing system includes a chuck configured to support a device under test (DUT); a probe card disposed above the chuck and including a plurality of probes protruding from the probe card toward the chuck; and a platen disposed between the chuck and the probe card and configured to support the probe card, wherein the chuck includes a shielding member disposed between the platen and the chuck.
    Type: Application
    Filed: May 1, 2020
    Publication date: October 7, 2021
    Inventor: CHOON LEONG LOU
  • Publication number: 20210313408
    Abstract: A method for testing and analyzing a display panel, comprising: providing a display panel including a circuitry and a pixel connected to the circuitry, wherein the pixel includes a capacitor, a transistor and an electrode electrically connected to the capacitor and the transistor; measuring a first parameter of the display panel; disabling the pixel; measuring a second parameter of the display panel; and deriving a third parameter of the pixel by subtracting the second parameter from the first parameter.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 7, 2021
    Inventor: Choon Leong LOU
  • Publication number: 20210208182
    Abstract: A probe card includes a frame; a supporting member disposed on and protruding from the frame; an opening extending through the frame and into the supporting member; an optical fiber disposed along and protruding from the supporting member; and a plurality of probes protruding from the frame and disposed adjacent to the optical fiber.
    Type: Application
    Filed: February 6, 2020
    Publication date: July 8, 2021
    Inventor: CHOON LEONG LOU
  • Patent number: 11054465
    Abstract: A method of operating a probing apparatus is disclosed. The method includes providing a chuck configured to support a DUT, a probe card disposed above the DUT and having a probe, and an inspection module configured to determine positions of the DUT and the probe. The method further includes determining a first position of a DUT by an inspection module; moving a probe card to align a first position of a probe with the first position of the DUT; moving a chuck toward the probe; adjusting a temperature of the probe to a predetermined temperature by a temperature-controlling device; determining a second position of the probe by the inspection module after the adjustment of the temperature of the probe; moving the probe card to align the probe with the position of the DUT based on the determination of the second position of the probe; and probing the DUT.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: July 6, 2021
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Yi Ming Lau
  • Publication number: 20210199711
    Abstract: A probing device includes a chuck configured to support a device under test (DUT); and a manipulator or probe card disposed above the chuck and including a plurality of probes protruding from the manipulator towards the chuck, wherein the chuck includes a roughened surface and vacuum suction holes for placement of wafer.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 1, 2021
    Inventor: CHOON LEONG LOU
  • Patent number: 11047880
    Abstract: A probing device includes a chuck configured to support a device under test (DUT), and includes a probe card disposed above the chuck. The probe card includes an inlet configured to convey a gas into the probe card, and an outlet configured to blow the gas at a predetermined temperature from the probe card toward the chuck. A method includes providing a chuck, a DUT disposed on the chuck and a probe card disposed above the DUT, and blowing a gas at a predetermined temperature from the probe card toward the DUT.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: June 29, 2021
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen
  • Publication number: 20210173003
    Abstract: The present disclosure provides a probe apparatus, including a circuit board, a flexible interconnect substrate, at least one probe, and a supporting element. The circuit board includes tester contacts. The flexible interconnect substrate has a first surface and an opposing second surface. The flexible interconnect substrate is electrically coupled to the circuit board. The probe is disposed in the first surface of the flexible interconnect substrate. The probe is electrically coupled to the flexible interconnect substrate, and the probe is configured to electrically contact a device under test. The supporting element is adhered to the second surface of the flexible interconnect substrate. The supporting element is disposed between the flexible interconnect substrate and the circuit board.
    Type: Application
    Filed: December 30, 2019
    Publication date: June 10, 2021
    Inventors: CHANG-MING LIN, Choon Leong LOU
  • Publication number: 20210116496
    Abstract: A method of operating a probing apparatus is disclosed. The method includes providing a chuck configured to support a DUT, a probe card disposed above the DUT and having a probe, and an inspection module configured to determine positions of the DUT and the probe. The method further includes determining a first position of a DUT by an inspection module; moving a probe card to align a first position of a probe with the first position of the DUT; moving a chuck toward the probe; adjusting a temperature of the probe to a predetermined temperature by a temperature-controlling device; determining a second position of the probe by the inspection module after the adjustment of the temperature of the probe; moving the probe card to align the probe with the position of the DUT based on the determination of the second position of the probe; and probing the DUT.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 22, 2021
    Applicant: STAR TECHNOLOGIES, INC.
    Inventors: CHOON LEONG LOU, YI MING LAU
  • Publication number: 20210088581
    Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.
    Type: Application
    Filed: September 24, 2019
    Publication date: March 25, 2021
    Inventors: CHOON LEONG LOU, YI MING LAU
  • Patent number: 10890614
    Abstract: The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: January 12, 2021
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Yi Ming Lau
  • Publication number: 20200326366
    Abstract: The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 15, 2020
    Inventors: CHOON LEONG LOU, YI MING LAU
  • Publication number: 20200225266
    Abstract: A probing device includes a chuck configured to support a device under test (DUT), and includes a probe card disposed above the chuck. The probe card includes an inlet configured to convey a gas into the probe card, and an outlet configured to blow the gas at a predetermined temperature from the probe card toward the chuck. A method includes providing a chuck, a DUT disposed on the chuck and a probe card disposed above the DUT, and blowing a gas at a predetermined temperature from the probe card toward the DUT.
    Type: Application
    Filed: July 16, 2019
    Publication date: July 16, 2020
    Inventors: CHOON LEONG LOU, HO YEH CHEN
  • Patent number: 10184957
    Abstract: The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 22, 2019
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen, Li Min Wang, Hsiao Ting Tseng
  • Patent number: 10088502
    Abstract: A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: October 2, 2018
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Ho Yeh Chen, Choon Leong Lou
  • Patent number: 9885746
    Abstract: A switching matrix includes a plurality of input ports, a plurality of output ports, a plurality of switching devices configured to open and close, an electrical connection between the input ports and the output ports, and an electrical sensor configured to generate a signal by measuring a predetermined electrical property of the electrical connection, the open and close of switching devices is pre-determined by status read from the electrical sensor.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: February 6, 2018
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Li Min Wang
  • Publication number: 20170370966
    Abstract: The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.
    Type: Application
    Filed: September 1, 2016
    Publication date: December 28, 2017
    Inventors: CHOON LEONG LOU, HO YEH CHEN, LI MIN WANG, HSIAO TING TSENG
  • Patent number: 9739830
    Abstract: A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: August 22, 2017
    Assignee: STAr TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Hsiao Ting Tseng, Ho Yeh Chen, Li Min Wang
  • Patent number: 9535114
    Abstract: A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: January 3, 2017
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen, Hsiao Ting Tseng
  • Publication number: 20160252548
    Abstract: A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface.
    Type: Application
    Filed: February 23, 2016
    Publication date: September 1, 2016
    Inventors: Ho Yeh CHEN, Choon Leong LOU
  • Patent number: 9329205
    Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: May 3, 2016
    Assignee: STAR TECHNOLOGIES INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen, Hsiao Ting Tseng