Patents by Inventor Choon-Leong Lou
Choon-Leong Lou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8035405Abstract: A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.Type: GrantFiled: March 11, 2009Date of Patent: October 11, 2011Assignee: Star Technologies Inc.Inventor: Choon Leong Lou
-
Publication number: 20110156244Abstract: An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width smaller than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuits package.Type: ApplicationFiled: December 31, 2009Publication date: June 30, 2011Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Patent number: 7928749Abstract: A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.Type: GrantFiled: March 15, 2010Date of Patent: April 19, 2011Assignee: Star Technologies Inc.Inventor: Choon Leong Lou
-
Publication number: 20110062317Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
-
Publication number: 20110063608Abstract: A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
-
Publication number: 20100301890Abstract: A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.Type: ApplicationFiled: September 1, 2009Publication date: December 2, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20100231254Abstract: A method for configuring a combinational switching matrix comprises the steps of setting a first switching module and a second switching module, coupling at least one of the output ports of the first switching module with at least one of the input ports of the second switching module to form the combinational switching matrix, building a connection mapping table based on the coupling relationship between the output port of the first switching module and the input port of the second switching module, and displaying a channel switching interface showing the input terminals, the output terminals, and the on/off states of the virtual switching devices of the combinational switching matrix.Type: ApplicationFiled: August 13, 2009Publication date: September 16, 2010Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong LOU, Hsiao Hui HSIEH
-
Patent number: 7791363Abstract: A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage.Type: GrantFiled: March 11, 2009Date of Patent: September 7, 2010Assignee: Star Technologies Inc.Inventor: Choon Leong Lou
-
Publication number: 20100182013Abstract: A probing apparatus for testing semiconductor devices comprises an upper guiding plate having a plurality of upper guiding holes, a bottom guiding plate having a plurality of bottom guiding holes, a plurality of vertical probes disposed between the upper guiding holes of the upper guiding plate and the bottom guiding holes of the bottom guiding plate, and a temperature-adjusting module including at least one flow line configured to direct a fluid into a space between the upper guiding plate and the bottom guiding plate.Type: ApplicationFiled: April 3, 2009Publication date: July 22, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20100171519Abstract: A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.Type: ApplicationFiled: March 15, 2010Publication date: July 8, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20100134130Abstract: A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.Type: ApplicationFiled: February 1, 2010Publication date: June 3, 2010Applicant: STAR TECHNOLOGIES INC.Inventors: CHOON LEONG LOU, LI MIN WANG
-
Publication number: 20100118297Abstract: A microscope includes an object splitter configured to split the object image into a first optical path and a second optical path, a first imaging module positioned on the first path and a second imaging module positioned on the second path. The object splitter includes a first beam splitter configured to direct an illumination light to an object, an objective lens configured to collect the reflected light from the object and couple the reflected light on the first beam splitter, and a second beam splitter configured to split the reflected light into the first optical path and the second optical path, wherein the distance between the object and the objective lens is constant.Type: ApplicationFiled: January 19, 2010Publication date: May 13, 2010Applicant: STAR TECHNOLOGIES INC.Inventors: YONG YU LIU, CHOON LEONG LOU
-
Patent number: 7675307Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: GrantFiled: March 18, 2008Date of Patent: March 9, 2010Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
-
Publication number: 20100052716Abstract: An enclosed probe station comprises a chuck assembly, a supporting member and an enclosure. The chuck assembly is configured to support a device under test. The supporting member is configured to secure a probe used to contact the device under test. The enclosure forms an interior space in which the chuck assembly and the supporting member are disposed.Type: ApplicationFiled: September 1, 2009Publication date: March 4, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20100052720Abstract: A probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.Type: ApplicationFiled: March 11, 2009Publication date: March 4, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20100052717Abstract: A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage.Type: ApplicationFiled: March 11, 2009Publication date: March 4, 2010Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Publication number: 20090315578Abstract: A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.Type: ApplicationFiled: September 25, 2008Publication date: December 24, 2009Applicant: STAR TECHNOLOGIES INC.Inventor: CHOON LEONG LOU
-
Patent number: 7616018Abstract: A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.Type: GrantFiled: March 12, 2008Date of Patent: November 10, 2009Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang
-
Publication number: 20090237102Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: ApplicationFiled: March 18, 2008Publication date: September 24, 2009Applicant: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
-
Patent number: 7576553Abstract: A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.Type: GrantFiled: December 12, 2006Date of Patent: August 18, 2009Assignee: Star Technologies Inc.Inventors: Choon-Leong Lou, Li Min Wang