Abstract: A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 ?m to 100 ?m. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.

Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Abstract: A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 ?m to 100 ?m. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.

Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: A method for manufacturing a device may include providing an ultra-high voltage (UHV) component that includes a source region and a drain region, and forming an oxide layer on a top surface of the UHV component. The method may include connecting a low voltage terminal to the source region of the UHV component, and connecting a high voltage terminal to the drain region of the UHV component. The method may include forming a shielding structure on a surface of the oxide layer provided above the drain region of the UHV component, forming a high voltage interconnection that connects to the shielding structure and to the high voltage terminal, and forming a metal routing that connects the shielding structure and the low voltage terminal.

Abstract: A burner of a gas stove includes a burner body, a partition member, and at least one flame cover. The burner body includes a gas conduit and a base. The gas conduit has at least one gas input passage for injecting gas and air, and the base has at least one mixture passage for mixing the gas and the air. The at least one mixture passage communicates with the at least one gas input passage. The partition member has a plurality of through holes and covers the at least one mixture passage. The at least one flame cover provided with a plurality of flame holes covers the partition member. Whereby, the size of the burner of the gas stove is reduced significantly, and the gas can mix with the air effectively and uniformly.

Abstract: A coffee bean roaster includes a machine body, a roasting drum, a heating device, and a fan module. The machine body includes a casing, a receiving trough, a container, and a partition assembly disposed inside the casing and partitioning an inside of the casing into a first chamber, a second chamber, and a third chamber. The receiving trough is disposed outside the casing and communicates with the first chamber. The container disposed in the receiving trough has mesh holes communicating with the receiving trough. The roasting drum is rotatably disposed inside the second chamber of the casing. One side of the roasting drum has through holes communicating with the third chamber. The heating device is disposed inside the second chamber for heating the roasting drum. The fan module is attached to the casing for pumping air to the outside of the casing through the first chamber and the third chamber.

Abstract: A slide structure of an exercise machine comprises a slide seat, configured to be movable along an axial direction relative to a slide rail; a roller, rotatably coupled to the slide seat; a dry-running limit slider, having a bushing seat and a dry-running bushing, the dry-running bushing embracing the slide rail on a vertical plane perpendicular to the axial direction. The slide seat moves on the slide rail along the axial direction through the roller to roll along the axial direction, the dry-running limit slider to slide along the axial direction, and the dry-running limit slider to limit the displacement of the slide seat on the vertical plane.

Abstract: The present disclosure generally relates to methods for processing of substrates, and more particularly relates to methods for forming a metal gapfill. In one implementation, the method includes forming a metal gapfill in an opening using a multi-step process. The multi-step process includes forming a first portion of the metal gapfill, performing a sputter process to form one or more layers on one or more side walls, and growing a second portion of the metal gapfill to fill the opening with the metal gapfill. The metal gapfill formed by the multi-step process is seamless, and the one or more layers formed on the one or more side walls seal any gaps or defects between the metal gapfill and the side walls. As a result, fluids utilized in subsequent processes do not diffuse through the metal gapfill.

Abstract: A burner of a gas stove includes a burner body, a partition member, and at least one flame cover. The burner body includes an inlet portion and a base. The inlet portion has at least one inlet passage for injecting gas and air, and the base has at least one mixture passage for mixing the gas and the air. The at least one mixture passage communicates with the at least one inlet passage. The partition member has a plurality of through holes and covers the at least one mixture passage. The at least one flame cover has a plurality of flame holes and covers the partition member. Whereby, the size of the burner of the gas stove could be reduced significantly, and the gas could mix with the air effectively and uniformly.

Abstract: A method for processing three-dimensional point cloud data includes a data creation step, a layering step, a gridding step, a data processing step and a two-dimensional image generation step, so that the three-dimensional point cloud data can be converted into a two-dimensional image, and the two-dimensional image can correspond to, identify and store the axial depth and information point features of the point cloud data in three axes.

Abstract: The invention discloses a pure end-to-end deep reinforcement learning for training car racing game AI bot that uses only the velocity information extracted from screen for both training and testing phases without using any internal state from game environment, such as the car facing angle. The learned AI bot can play better than the average performance of human players. In addition, the reward function is designed to consist only the velocity value, and use Ape-X distributed training framework combined with a variant of Deep Q Network to solve the sparse training signal problem caused by the reward function of an original design. Moreover, limit learner rate method is designed that improves the training efficiency and training performance. The AI bot trained in this way can achieve performance beyond the average human level and reach a level close to professional players.

Abstract: An electric magnetic resistance control structure for an exercise machine includes a base; a flywheel, pivotally connected to the base through a rotating shaft, the rotating shaft defining an axial direction, the flywheel, a non-magnetically sensitive layer being coupled to a circumference of the flywheel; a power unit, fixed to the base; a magnetic resistance unit, including a coupling portion corresponding to an arc of the non-magnetically sensitive layer, at least one magnetic member being provided on the coupling portion and kept at a distance from the non-magnetically sensitive layer to generate a magnetic resistance effect; a control unit, configured to control a current applied to the power unit to drive the magnetic resistance unit to move along the axial direction, thereby changing an overlapping area of the magnetic member and the non-magnetically sensitive layer in the axial direction, so as to adjust a magnetic resistance of the flywheel.

Abstract: An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.

Abstract: An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Abstract: Methods of forming electronic devices comprising tungsten film stacks are provided. Methods include forming a tungsten nucleation layer on the barrier layer using an atomic layer deposition (ALD) process including a tungsten precursor that is free of fluorine. Forming the nucleation layer comprises controlling process parameters and/or forming WSi pre-nucleation layer.

Abstract: Embodiments of the present disclosure generally relate chamber lids and methods of using such for gas-phase particle reduction. In an embodiment is provided a chamber lid that includes a top wall, a bottom wall, a plurality of vertical sidewalls, and an interior volume within the chamber lid defined by the top wall, the bottom wall, and the plurality of vertical sidewalls. The chamber lid further includes a plurality of air flow apertures, wherein the plurality of air flow apertures is configured to fluidly communicate air into the interior volume and out of the interior volume, and a mesh disposed on a face of at least one of the air flow apertures of the plurality of air flow apertures. In another embodiment is provided a method of processing a substrate in a substrate processing chamber, the substrate processing chamber comprising a chamber lid as described herein.

Abstract: The invention discloses a pure end-to-end deep reinforcement learning for training car racing game AI bot that uses only the velocity information extracted from screen for both training and testing phases without using any internal state from game environment, such as the car facing angle. The learned AI bot can play better than the average performance of human players. In addition, the reward function is designed to consist only the velocity value, and use Ape-X distributed training framework combined with a variant of Deep Q Network to solve the sparse training signal problem caused by the reward function of an original design. Moreover, limit learner rate method is designed that improves the training efficiency and training performance. The AI bot trained in this way can achieve performance beyond the average human level and reach a level close to professional players.

Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.