Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: A combustion device includes at least one burner, a supporting assembly, and an infrared ray generation assembly. The at least one burner includes a flame outlet; the front cover of the supporting assembly includes a flat cover plate which has a plurality of holes; the infrared ray generation mesh which is disposed on the supporting assembly is corresponding to the flame outlet; the flames generated by the flame outlet heat the infrared ray generation mesh and the cover plate. The intensity of heating can be effectively increased by generating open fire and infrared rays and uniformly heating could be realized as well.

Abstract: The present disclosure relates to a method for forming a p-metal work function nitride film having a desired p-work function on a substrate, including: adjusting one or more of a temperature of a substrate, a duration of one or more temporally separated vapor phase pulses, a ratio of a tungsten precursor to a titanium precursor, or a pressure of a reaction to tune a work function of a p-metal work function nitride film to a desired p-work function, and contacting the substrate with temporally separated vapor phase pulses of the tungsten precursor, the titanium precursor, and a reactive gas to form a p-metal work function nitride film thereon having the desired p-work function.

Abstract: Metal gate stacks and integrated methods of forming metal gate stacks are disclosed. Some embodiment comprise MoN as a PMOS work function material. Some embodiments comprise TiSiN as a high-? capping layer. Some embodiments provide improved PMOS bandedge performance. Some embodiments provide improved PMOS bandedge performance with reduced EOT penalty.

Abstract: A 360-degree Field-Of-View LiDAR is capable of delivering light to a target and detecting a fraction of the light reflected from the target to determine the distance from the light source/detector to the target placed at any point of a 360-degree panoramic field of view across various vertical elevation angles depending on the azimuthal angles. The LiDAR implementation allows the built-in array laser light source and an array of detectors to be scanned across the entire azimuthal angular range. The LiDAR implementation has the unique arrangement of the array of laser light sources, and the array of detectors affixed to a rigid base while the rotating periscope scanner contains a motor and mirror which can rotate in-plane to project the light source to its surroundings and receive light from surroundings. The system delivers a high frame rate, a high spatial (VGA-like) resolution, and a low power consumption system.

Abstract: An ultra-thin package structure for an integrated circuit having sensing functions is disclosed. It includes: a first substrate layer, having a first top side and a first bottom side, wherein a plurality of conductive traces are formed on the first top side and the first bottom side; an integrated circuit, having at least one gold-plated die pad on the top side thereof, wherein the at least one gold-plated die pad is connected to the corresponding conductive trace on the first bottom side of the first substrate layer by SMT; a second substrate layer, having a second top side and a second bottom side, wherein a plurality of conductive traces are formed on the second bottom side, and some portions of the conductive traces are covered by solder mask while other portions are exposed externally; and a filling material layer, formed between the first and the second substrate layer with the integrated circuit therebetween.

Abstract: The present disclosure, in some embodiments, relates to a high voltage resistor device. The device includes a buried well region disposed within a substrate and having a first doping type. A drift region is disposed within the substrate and contacts the buried well region. The drift region has the first doping type. A body region is disposed within the substrate and has a second doping type. The body region laterally contacts the drift region and vertically contacts the buried well region. An isolation structure is over the drift region and a resistor structure is over the isolation structure.

Abstract: A biometric security device for digital key storing is disclosed. The biometric security device includes a biometric information fetching module and a processing module. The processing module has a nonvolatile storage unit and a processing unit. The nonvolatile storage unit includes a secure storage unit and a general storage unit. The biometric security device with a secure electronic key designed for storing secret data utilizes both TrustZone™ technology (or similar technology) and biometric authentication. Thus, it can provide the flexibility for multiple users or applications to use the biometric security device or any equipment the biometric security device mounted in without compromising the safeguard of the data stored therein.

Abstract: An insole design method and an insole design system are provided, and the method includes: capturing an uncompressed free foot model by a depth camera and obtaining a free foot model three-dimensional image; capturing a pressed foot model stepped on a transparent pedal by the depth camera and obtaining a pressed foot model three-dimensional image; aligning the free foot model three-dimensional image with the pressed foot model three-dimensional image; calculating and obtaining a plantar deformation quantity according to the aligned free foot model three-dimensional image and the aligned pressed foot model three-dimensional image; and completing the designed insole according to a sole projection plane or a three-dimensional profile of the specific sole and the plantar deformation quantity.

Abstract: A burner of a gas stove includes a burner body, a partition member, and at least one flame cover. The burner body includes an inlet portion and a base. The inlet portion has at least one inlet passage for injecting gas and air, and the base has at least one mixture passage for mixing the gas and the air. The at least one mixture passage communicates with the at least one inlet passage. The partition member has a plurality of through holes and covers the at least one mixture passage. The at least one flame cover has a plurality of flame holes and covers the partition member. Whereby, the size of the burner of the gas stove could be reduced significantly, and the gas could mix with the air effectively and uniformly.

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: An electrical connector assembly includes a plug connector and a receptacle connector each equipped with a grounding bar. The plug connector includes an insulative plug housing with a mating tongue, and a plurality of stationary plug contacts retained in the plug housing. The plug contacts include a plurality of signal contacts and a plurality of grounding contacts. The grounding bar forms a set of first fingers, a set of second fingers and a set pf third fingers respectively located at different positions, to respectively contact the different three positions of the respective grounding contacts.

Abstract: A roasting drum and a manufacturing method thereof including a drum body and at least one agitator blade. The drum body includes a drum wall which provides with at least one fixing hole, the at least one fixing hole passing through an inner surface and an outer surface of the drum wall. The at least one agitator blade is disposed in the drum body and is provided with at least one fixing convex part which passes through the at least one fixing hole. The agitator blade can be positioned in the drum body and is not easily displaced when assembling.

Abstract: A coffee bean roaster includes a machine body, a roasting drum, a heating device and a fan module. The machine body includes a casing, a partition assembly, a receiving trough and a container. The partition assembly is disposed inside the casing and partitions the inside of the casing into a first chamber, a second chamber and a third chamber. The receiving trough is disposed outside casing and communicates with the first chamber, and the container is disposed in the receiving trough and has a plurality of mesh holes communicating with the receiving trough. The roasting drum is rotatably disposed inside the second chamber of the casing, wherein one side of the roasting drum has a plurality of through holes communicating with the third chamber. The heating device is disposed inside the second chamber for heating the roasting drum. The fan module is attached to the casing for pumping air to the outside of the casing through the first chamber and the third chamber.

Abstract: A roasting drum of a coffee bean roaster including a drum body, an end plate and a plurality of guide vanes. The end plate is coupled to an end of the drum body and has a plurality of through holes communicating with an inside and an outside of the drum body, each of the through holes is elongated and extends along a radial direction of the end plate. The guide vanes are connected to the end plate and disposed respectively at one side of the through holes. With the flow guiding of the guide vanes, the airflow inside the roasting drum of the coffee bean roaster is efficiently accelerated.

Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: Methods and apparatus for reducing and eliminating defects in tungsten film are disclosed herein. In the present disclosure, reducing or eliminating oxidation of a first surface of a tungsten film having a predetermined first thickness disposed upon a substrate and within a plurality of trenches is disclosed. The plurality of trenches include a predetermined depth, and a width of less than 20 nanometers. The predetermined first thickness of the tungsten film is substantially uniform throughout the plurality of trenches such that the predetermined first thickness of the tungsten film does not substantially change to a second thickness when the first surface is contacted with air or oxygen.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a bootstrap metal-oxide-semiconductor (MOS) device is integrated with a high voltage metal-oxide-semiconductor (HVMOS) device and a high voltage junction termination (HVJT) device. In some embodiments, a drift well is in the semiconductor substrate. The drift well has a first doping type and has a ring-shaped top layout. A first switching device is on the drift well. A second switching device is on the semiconductor substrate, at an indent in a sidewall the drift well. A peripheral well is in the semiconductor substrate and has a second doping type opposite the first doping type. The peripheral well surrounds the drift well, the first switching device, and the second switching device, and further separates the second switching device from the drift well and the first switching device.

Abstract: A smoke removal device, which can burn the particulates in the smoke efficiently, includes a tube body and a combustion unit. The combustion unit is provided in the tube body and includes a main body, a gas pipeline, and a lighter. The main body is located at a first end of the tube body. A smoke passage is formed between a periphery of the main body and an inner wall of the tube body, and the smoke enters the smoke removal device through the smoke passage. The main body has a central passage therethrough, where a fuel gas is ignited. The fuel gas is guided to the central passage through the gas pipeline and then ignited by the lighter to burn the smoke particulates passing through the smoke passage.

Abstract: An electrical connector includes an insulative housing defining a space. A connection module is received within the space. The connection module includes a pair of contact modules commonly sandwiching a grounding module therebetween in the transverse direction. Each contact module includes a plurality of contacts integrally formed within the corresponding insulative wafer via insert-molding. The grounding module includes a grounding plate embedded within an insulative wafer. The grounding plate forms a plurality of fingers respectively electrically and mechanically connecting to the corresponding grounding contacts of the contact modules. The wafer forms a plurality of transverse grooves to receive corresponding grounding bars each having a plurality of inward parts respectively mechanically and electrically connecting to the grounding plate, and a plurality of outward parts respectively mechanically and electrically connecting to the grounding contacts of the contact modules.