Abstract: A method of fabricating a semiconductor structure includes forming a GaN-based semiconductor layer on a substrate, forming a silicon-containing insulating layer on the GaN-based semiconductor layer, forming a recess in the silicon-containing insulating layer in a first etching step, wherein the first etching step is performed by using a fluorine-containing etchant and applying a first bias power, and enlarging the recess to extend into the GaN-based semiconductor layer in a second etching step, wherein the second etching step is performed by using the same fluorine-containing etchant as the first etching step and applying a second bias power that is greater than the first bias power. In addition, a method of fabricating a high electron mobility transistor is provided.

Abstract: A deposition apparatus including a chamber having a deposition area and a non-deposition area, a gas intake device communicated with the chamber, a gas annulus disposed in the chamber and surrounding the gas intake device, a carrier disposed in the deposition area and a retaining annulus disposed in chamber and surrounding the carrier. The gas intake device is disposed corresponding to the deposition area and configured to draw a process gas into the deposition area. The gas annulus is configured to generate an annular gas curtain in the deposition area. The carrier carries a deposited object, wherein the gas annulus is located between the gas intake device and the carrier. The deposited object is surrounded by the annular gas curtain. The retaining annulus has a plurality of through holes. The retaining annulus is located between the gas annulus and the carrier.

Abstract: A lens assembly driving module includes a holder, a metal yoke, a lens unit, a magnet set, a coil, at least one elastic element and at least one damper agent. The metal yoke is coupled with the holder and includes a through hole and at least one extending structure. The extending structure is disposed around the through hole and extends along a direction from the through hole to the holder. The lens unit is movably disposed in the metal yoke. The lens unit includes an optical axis and at least one notch structure. The notch structure is disposed in an outer peripheral area of the lens unit and is corresponding to the extending structure. The damper agent is disposed between the extending structure of the metal yoke and the notch structure of the lens unit. The damper agent is applied to damp a movement of the lens unit.

Abstract: An imaging lens assembly includes a dual molded optical element, a plurality of imaging lens elements and a light blocking element. The dual molded optical element has an object-side surface and an image-side surface and includes a light transmitting portion and a light absorbing portion. The light transmitting portion includes an optical effective section. The light absorbing portion is located on at least one of the object-side surface and the image-side surface of the dual molded optical element, and a plastic material of the light absorbing portion and a plastic material of the light transmitting portion are different colors. The imaging lens elements are disposed in the inner space of the imaging lens assembly. The light blocking element is disposed adjacent to the light transmitting portion of the dual molded optical element.

Abstract: A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.

Abstract: The present disclosure relates generally to certain compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of a Retroviridae viral infection, including an infection caused by the HIV virus.

Abstract: A semiconductor structure includes a source/drain (S/D) feature disposed in a semiconductor layer, a metal gate stack (MG) disposed in a first interlayer dielectric (ILD) layer and adjacent to the S/D feature, a second ILD layer disposed over the MG, and an S/D contact disposed over the S/D feature. The semiconductor structure further includes an air gap disposed between a sidewall of a bottom portion of the S/D contact and the first ILD layer, where a sidewall of a top portion of the S/D contact is in direct contact with the second ILD layer.

Abstract: A method for forming a chip package structure is provided. The method includes disposing a chip over a redistribution structure. The method includes forming a molding layer over the redistribution structure and adjacent to the chip. The method includes partially removing the molding layer to form a trench in the molding layer, and the trench is spaced apart from the chip.

Abstract: An imaging lens module has an optical axis, an object side and an image side. The imaging lens module includes a plastic barrel, an optical lens assembly, an image-side assembled element and a light blocking element assembly. The plastic barrel includes a first contacting surface, which is close to an image-side end of the plastic barrel. The image-side assembled element is disposed close to the image-side end of the plastic barrel. The image-side assembled element is in a tube shape and extends from the object side to the image side. The image-side assembled element includes a second contacting surface and an inner protruding portion, and the second contacting surface is disposed close to an object-side end of the image-side assembled element and correspondingly to the first contacting surface. The plastic barrel and the image-side assembled element contact each other via the first contacting surface and the second contacting surface.

Abstract: A voltage measurement device for pulse-width modulation (PWM) signals is provided, which includes a conversion circuit and a processing circuit. The conversion circuit receives a first PWM signal and a second PWM signal from a motor driving device, and converts the first PWM signal and the second PWM signal into the absolute value signal and the polarity signal of the line-to-line voltage signal between the first PWM signal and the second PWM signal. The processing circuit converts the polarity signal and the absolute value signal into a first integral signal and a second integral signal, and reconstructs the line-to-line voltage signal according to the first integral signal and the second integral signal so as to obtain the reconstructed voltage signal of the line-to-line voltage signal.

Abstract: The present invention relates to a method for improving the diagnostic accuracy of an artificial intelligence (AI) to diagnose osteoarthritis (OA). The method involves all or some steps of: generating a plurality of feature values from at least one input skeletal image, generating a quantitative Kellgren-Lawrence (KL) grade based on the plurality of feature values, and generating an explanation plot showing the contributions of each feature. The present invention also relates to a method of constructing a non-transitory computer-readable medium to perform the above tasks.

Abstract: A sensor calibration system periodically receives scene data from a detector in a calibration scene. The calibration scene includes calibration targets. The sensor calibration system generates a calibration map based on the scene data. The calibration map is a virtual representation of the calibration scene and includes features of the calibration targets that can be used as ground truth features for calibrating AV sensors. The sensor calibration system can periodically update the calibration map. For instance, the sensor calibration system receives the scene data at a predetermined frequency and updates the calibration map every time it receives new scene data. The predetermined frequency may be a frequency of the detector completing a full scan of the calibration scene. The sensor calibration system provides a latest version of the calibration map for being used by an AV to calibrate a sensor on the AV 110.

Abstract: The present invention relates to an LC medium comprising two or more polymerizable compounds, at least one of which contains a substituent comprising a tertiary OH group, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in LC displays of the PSA (polymer sustained alignment) or SA (self-aligning) mode, to an LC display of the PSA or SA mode comprising the LC medium, and to a process of manufacturing the LC display using the LC medium, especially an energy-saving LC display and energy-saving LC display production process.

Abstract: A sensor calibration system periodically receives scene data from a detector in a calibration scene. The calibration scene includes calibration targets. The sensor calibration system generates a calibration map based on the scene data. The calibration map is a virtual representation of the calibration scene and includes features of the calibration targets that can be used as ground truth features for calibrating AV sensors. The sensor calibration system can periodically update the calibration map. For instance, the sensor calibration system receives the scene data at a predetermined frequency and updates the calibration map every time it receives new scene data. The predetermined frequency may be a frequency of the detector completing a full scan of the calibration scene. The sensor calibration system provides a latest version of the calibration map for being used by an AV to calibrate a sensor on the AV 110.

Abstract: Systems and methods of predicting documentation associated with an encounter between attendees are provided. For instance, attendee data indicative of one or more previous visit notes associated with a first attendee can be obtained. The attendee data can be inputted into a machine-learned note prediction model that includes a neural network. The neural network can generate one or more context vectors descriptive of the attendee data. Data indicative of a predicted visit note can be received as output of the machine-learned note prediction model based at least in part on the context vectors. The predicted visit note can include a set of predicted information expected to be included in a subsequently generated visit note associated with the first attendee.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.

Abstract: A display panel has a plurality of pixel areas and a peripheral area surrounding the pixel areas, and includes a substrate, at least two planarization layers, a plurality of pads, a first dummy pattern, and a plurality of light-emitting devices. The substrate has a first substrate edge extending in a first direction. The at least two planarization layers are disposed on the substrate. The pads are disposed on the at least two planarization layers, and are located in the pixel areas. The pads include at least one first edge pad closest to the first substrate edge. The first dummy pattern is disposed on the at least two planarization layers, and extends in the peripheral area between the at least one first edge pad and the first substrate edge. The light-emitting devices are electrically connected to the pads.

Abstract: A cleaning apparatus includes a stage, first annular closed-loop pipelines and first nozzles. The first annular closed-loop pipelines are located above the stage and have different outer diameters. A top-view pattern of the first annular closed-loop pipeline with a larger outer diameter surrounds a top-view pattern of the first annular closed-loop pipeline with a smaller outer diameter. The first nozzles are disposed on each of the first annular closed-loop pipelines.

Abstract: An audio system is proposed, dynamically playing optimized audio signals based on user position. A sensor circuits dynamically senses a target space to generate field context information. First speaker and second speaker are arranged for audio playback. A host device recognizes a user from the field context information, determines the user position corresponding to the target space, and adaptively assigns the user position as a target listening spot. A sensor circuit contains a camera capturing an ambient image out of the target space. A recognizer circuit analyzes the ambient image to obtain from the target space, the location, size, and acoustic attribute information of an ambient object, allowing the control circuit to accordingly perform a channel-based compensation operation on the target listening spot to generate optimized first channel audio signal and second channel audio signal.

Abstract: A titanium catalyst and a synthesizing method of polyester resins are provided in the present disclosure. The titanium catalyst has a chemical structure represented by Formula (I), Formula (II) or Formula (III). The symbols shown in the Formula (I), the Formula (II) or the Formula (III) are defined in the description. The synthesizing method of polyester resins includes providing the titanium catalyst, performing a feeding step, performing a heating and pressurizing step and performing a heating and vacuuming step. The titanium catalyst and a heat stabilizer are added into an autoclave before the feeding step or before the heating and vacuuming step.