Patents by Inventor Chou

Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12057504
    Abstract: A method and apparatus for minimizing silicon germanium facets in planar metal oxide semiconductor structures is disclosed. For example, a device fabricated according to the method may include a semiconductor substrate, a plurality of gate stacks formed on the substrate, a plurality of source/drain regions formed from silicon germanium, and a shallow trench isolation region positioned between two source/drain regions of the plurality of source/drain regions. Each source/drain region of the plurality of source/drain regions is positioned adjacent to at least one gate stack of the plurality of gate stacks. Moreover, the shallow trench isolation region forms a trench in the substrate without intersecting the two source/drain regions.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Sin Wang, Shan-Yun Cheng, Ching-Hung Kao, Jing-Jyu Chou, Yi-Ting Chen
  • Patent number: 12053663
    Abstract: A transmission structure of a climbing machine for an operator to operate in a standing position is disclosed. The transmission structure of the climbing machine includes a base, a support frame, a first slide rail, a second slide rail, a first transmission unit, a second transmission unit, a first handle slider, a first pedal slider, a second handle slider, a second pedal slider, and a resistance unit. The climbing machine is used to train the synchronized and coordinated movements of hands and feet for simulating rock climbing and mountaineering. The support frame, the first slide rail, the second slide rail, the first transmission unit and the second transmission unit are all located at the center line position of the upright trunk of the operator. The volume of the climbing machine can be reduced greatly to save the space occupied.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: August 6, 2024
    Inventor: Tsung-Chou Lin
  • Patent number: 12058693
    Abstract: A UE and a method for SDT are provided. The method includes initiating a RA procedure with a BS while the UE is in an RRC_INACTIVE state; transmitting a preamble; receiving a RAR scheduled by first DCI with CRC bits scrambled by a RA-RNTI on a first search space; transmitting first UL data on a first UL resource, being not from a CCCH, scheduled by the RAR; monitoring the first search space for receiving first DL data scheduled by second DCI with CRC bits scrambled by a TC-RNTI indicated by the RAR; applying the TC-RNTI as a C-RNTI while receiving the first DL data; monitoring the second search space for a second UL resource scheduled by third DCI with first CRC bits scrambled by the C-RNTI if the first DL data indicates the search space configuration; otherwise, monitoring the first search space for the second UL resource.
    Type: Grant
    Filed: November 25, 2021
    Date of Patent: August 6, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Chia-Hung Wei, Hai-Han Wang, Chie-Ming Chou, Hung-Chen Chen
  • Patent number: 12057385
    Abstract: Semiconductor devices and methods are provided. A method according to the present disclosure includes receiving a substrate that includes a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer; forming a plurality of fins over the third semiconductor layer; forming a trench between two of the plurality of fins; depositing a dummy material in the trench; forming a gate structure over channel regions of the plurality of the fins; forming source/drain features over source/drain regions of the plurality of the fins; bonding the substrate on a carrier wafer; removing the first and second semiconductor layers to expose the dummy material; removing the dummy material in the trench; depositing a conductive material in the trench; and bonding the substrate to a silicon substrate such that the conductive material is in contact with the silicon substrate. The trench extends through the third semiconductor layer and has a bottom surface on the second semiconductor layer.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Wen-Ting Lan, Chih-Hao Wang
  • Patent number: 12053258
    Abstract: Provided are a localization system and method useful in the acquisition and analysis of cardiac information. The localization system and method can be used with systems that perform cardiac mapping, diagnosis and treatment of cardiac abnormalities, as examples, and in the retrieval, processing, and interpretation of such types of information. The localization system and method use high impedance inputs, improved isolation, and relatively high drive currents for pairs of electrodes used to establish a multi-axis coordinate system. The axes can be rotated and scaled to improve localization.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: August 6, 2024
    Assignee: ACUTUS MEDICAL, INC.
    Inventors: Daniel J. Welsh, Marcus F. Julian, Graydon E. Beatty, Xinwei Shi, Derrick R. Chou, Randell L. Werneth, J. Christopher Flaherty, Mark MacGregor
  • Patent number: 12058604
    Abstract: A method for a system information (SI) request procedure performed by a user equipment (UE) is provided. The method includes: receiving a system information block type 1 (SIB1) from a cell; transmitting, to the cell, a first message including a common control channel (CCCH) service data unit (SDU) that includes a radio resource control (RRC) SI request message; receiving, from the cell, a medium access control (MAC) control element (CE) including a UE contention resolution identity; and indicating, by a MAC entity of the UE, reception of an acknowledgment for the RRC SI request message to an RRC entity of the UE after determining that the UE contention resolution identity matches multiple consecutive bits, starting from the most significant bit (MSB), of the CCCH SDU. The SIB1 does not include information related to a Random Access (RA) resource specific to SI requested by the RRC SI request message.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: August 6, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Mei-Ju Shih, Chie-Ming Chou, Hung-Chen Chen, Yung-Lan Tseng
  • Patent number: 12055727
    Abstract: An imaging lens assembly includes a plastic barrel and an imaging lens set. The plastic barrel includes an object-side aperture and a first annular surface. The imaging lens set includes a plurality of optical elements, wherein at least one of the optical elements is a plastic lens element, and the plastic lens element includes an effective optical portion, a peripheral portion, a second annular surface, and an object-side connecting surface. The peripheral portion is formed around the effective optical portion. The second annular surface is formed on an object-side surface of the plastic lens element and surrounds the effective optical portion. The object-side connecting surface is formed on the object-side surface of the plastic lens element and surrounds the effective optical portion, and the object-side connecting surface is connected with one of the optical elements disposed on an object side of the plastic lens element.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: August 6, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Hsiang-Chi Tang, Cheng-Chen Lin, Ming-Ta Chou
  • Patent number: 12053639
    Abstract: The present disclosure provides a magnetic therapy device. The therapy device includes a body having a holding portion and a mounting portion. The holding portion is adapted to be held by a user for maneuvering the therapy device to access a treatment area on a skin of the user and the mounting portion is attached the holding portion. Further, the therapy device has at least one hollow pin mounted to the mounting portion. The at least one hollow pin encloses at least one magnet, with the magnetic field of the magnet extending outside of the hollow pin to impart magnetic flux onto a treatment area of a patient.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: August 6, 2024
    Assignee: Selfkaire, Inc.
    Inventor: Kathy Chou
  • Publication number: 20240254118
    Abstract: The present disclosure relates generally to compounds that inhibit PRMT5. The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through inhibiting PRMT5. The disclosure further relates to the use of the compounds for the treatment of a disease or condition associated with chromosome 9p21 deletion or MTAP null. The disclosure further relates to the use of the compounds for the treatment of cancers.
    Type: Application
    Filed: December 20, 2023
    Publication date: August 1, 2024
    Inventors: Megan K. Armstrong, Elbert Chin, Chienhung Chou, Laurent P. Debien, Joshua D. Farr, Pancham Lal Gupta, Chao-I Hung, Michael L. Mitchell, Prasenjit K. Mukherjee, Shaina V. Nguyen, Gregory T. Notte, Daniel Roa, Adam J. Schrier, Zheng-Yu Yang
  • Publication number: 20240255836
    Abstract: A projection apparatus includes an illumination system, an optical engine module, a lens module, and a heat-dissipation module. The illumination system includes a light source configured to provide an illumination light beam. The optical engine module is disposed on a transmission path of the illumination light beam, and configured to convert the illumination light beam into an image light beam. The lens module is disposed on a transmission path of the image light beam, and configured to project the image light beam out of the projection apparatus. The lens module has an optical axis. The lens module is adapted to move between a first position and a second position along the optical axis. The heat-dissipation module includes a light source heat-dissipation fin connected to the light source. When the lens module moves, the light source, the light source heat-dissipation fin, and the optical engine move with the lens module.
    Type: Application
    Filed: January 26, 2024
    Publication date: August 1, 2024
    Applicant: Coretronic Corporation
    Inventors: Wen-Yen Chung, Tung-Chou Hu, Fan-Chieh Chang
  • Publication number: 20240253055
    Abstract: An integrated magnetic microbead processing apparatus includes a microplate having magnetic microbeads in microwells. A bottom of the microplate includes cavities between the microwells. A heating/cooling plate supports a base of the microplate and has a plurality of holes. A vertically movable magnet support plate includes a plurality of magnetic pins, each of which can protrude through one hole in the plurality of holes of the heating plate and into the cavity of the microplate. The magnetic pins are height adjustable. A shaker is operably connected to the microplate and is configured to shake the microplate, the heating/cooling plate, the magnetic support plate.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 1, 2024
    Inventors: Winston Z. Ho, Dennis Chou, Carlos Aldana, Marc Macon
  • Publication number: 20240258229
    Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.
    Type: Application
    Filed: April 9, 2024
    Publication date: August 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yi Chun CHOU
  • Publication number: 20240253049
    Abstract: The present invention, among other things, provides the devices and methods in manipulate a sample for the purpose of assaying.
    Type: Application
    Filed: December 13, 2023
    Publication date: August 1, 2024
    Applicant: Essenlix Corporation
    Inventors: Stephen Y. CHOU, Wei DING, Ji QI, Yufan ZHANG
  • Publication number: 20240260245
    Abstract: Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.
    Type: Application
    Filed: September 13, 2023
    Publication date: August 1, 2024
    Inventors: Shraddha Patel, Charlie LaColla, Thai Dinh, Vivian Chou
  • Publication number: 20240259779
    Abstract: A user equipment (UE) device performs fast network camping when multiple SIMs of the UE device are out of service. A first software stack begins scanning for available networks and finds an available network at a frequency X. The first software stack decodes system information received from the available network at frequency X and determines that the available network is mapped to the SIM associated with a second software stack of the UE device. The first software stack signals the second software stack that an available network is mapped to the SIM associated with the second software stack at frequency X. In response to receiving the signal, the second software stack sends an attach request to the available network and completes a network attach procedure.
    Type: Application
    Filed: December 20, 2022
    Publication date: August 1, 2024
    Inventors: Edison Chen, Shih-Che Chou, Chih-Cheng Wang, Hsueh-Feng Hsieh
  • Publication number: 20240254137
    Abstract: The present disclosure relates generally to modulators of Cot (cancer Osaka thyroid) and methods of use and manufacture thereof.
    Type: Application
    Filed: December 11, 2023
    Publication date: August 1, 2024
    Inventors: Elizabeth M. Bacon, Gayatri Balan, Chien-Hung Chou, Christopher T. Clark, Jeromy J. Cottell, Musong Kim, Thorsten A. Kirschberg, John O. Link, Gary Phillips, Scott D. Schroeder, Neil H. Squires, Kirk L. Stevens, James G. Taylor, William J. Watkins, Nathan E. Wright, Sheila M. Zipfel
  • Publication number: 20240257870
    Abstract: The disclosed invention presents a self-tracking reference circuit that compensates for IR drops and achieves the target resistance state at different temperatures after write operations. The disclosed self-tracking reference circuit includes a replica access path, a configurable resistor network, a replica selector mini-array and a step current generator that track PVT variations to provide a PVT tracking level for RRAM verify operation.
    Type: Application
    Filed: April 9, 2024
    Publication date: August 1, 2024
    Inventors: Zheng-Jun Lin, Chung-Cheng Chou, Yu-Der Chih, Pei-Ling Tseng
  • Publication number: 20240258072
    Abstract: A radio frequency (RF) match assembly for a chemical vapor deposition processing chamber. The assembly includes a top electrically insulating column and a bottom electrically insulating column. The assembly further includes a one-piece RF match strap that has a head, a main body and a body extension. The main body of the one-piece RF match strap is configured to extend through the top electrically insulating column and the bottom electrically insulating column. A flexible chamber lid strap connects the processing chamber to the top of the one-piece RF match strap.
    Type: Application
    Filed: March 11, 2024
    Publication date: August 1, 2024
    Inventors: Ming-Sze Chen, Yuan-Hsin Chi, Yin-Tun Chou, Yu Li Wang, Sheng-Yuan Lin
  • Publication number: 20240255837
    Abstract: A projection apparatus includes an illumination system; an optical engine module; a lens module; and a heat-dissipation module. The illumination system includes a light source, and is configured to provide an illumination light beam. The optical engine module includes a light valve. The light valve is disposed on a transmission path of the illumination light beam, and configured to convert the illumination light beam into an image light beam. The lens module is disposed on a transmission path of the image light beam, and configured to project the image light beam out of the projection apparatus. The lens module has an optical axis. The lens module is adapted to move between a first position and a second position along the optical axis. The heat-dissipation module includes a heat dissipating device, a first liquid-cooling plate, a second liquid-cooling plate, and a plurality of pipes. The first liquid-cooling plate is connected to the light source.
    Type: Application
    Filed: January 30, 2024
    Publication date: August 1, 2024
    Applicant: Coretronic Corporation
    Inventors: Wen-Yen Chung, Tung-Chou Hu, Fan-Chieh Chang
  • Publication number: 20240258231
    Abstract: A semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, and a second dielectric layer disposed over the first dielectric layer. The semiconductor device structure also includes a first conductive plug disposed in the first dielectric layer. A top surface of the first conductive plug is greater than a bottom surface of the first conductive plug. The semiconductor device structure further includes a second conductive plug disposed in the second dielectric layer and directly over the first conductive plug.
    Type: Application
    Filed: April 15, 2024
    Publication date: August 1, 2024
    Inventor: YI-HSIEN CHOU