Abstract: A semiconductor wafer cleaning solution may include at least a first agent, a second agent, and water. The first agent is configured to chelate residual metals on the semiconductor wafer. The second agent has a solubility of 35 g/100 ml to 45 g/100 ml in water with a pH-value greater than 6 and less than 7 at 20° C., and has an acid dissociation constant between 7 and 8 at 20° C. The pH-value of the cleaning solution is maintained in the range of 6.5 to 8.8 at 20° C. to 70° C. In the cleaning solution, the metal chelating ability of the first agent is greater than that of the second agent.

Abstract: A three dimensional Integrated Circuit (IC) Power Grid (PG) may be provided. The three dimensional IC PG may comprise a first IC die, a second IC die, an interface, and a power distribution structure. The interface may be disposed between the first IC die and the second IC die. The power distribution structure may be connected to the interface. The power distribution structure may comprise at least one Through-Silicon Vias (TSV) and a ladder structure connected to at least one TSV.

Abstract: A quartz crystal resonator including a quartz crystal obtained from a quartz bar is provided. The quartz bar has a light axis, an electrical axis along a length of the quartz bar, and a mechanical axis that are perpendicular to one another. The quartz crystal has a major face cut from the quartz bar along a cutting plane. The cutting plane has a first angle of about 35° to about 36° with the light axis and has a second angle with the electric axis. The first angle is obtained by rotation about the electric axis, and the second angle is obtained by rotation about the light axis, such that the quartz crystal has a vibration frequency deviation inflection point in a range from about 30° C. to about 45° C. Methods for making the quartz crystal are also provided.

Abstract: An automatic objects labeling method includes: capturing M consecutive image frames at one station of an assembly line. Performing an object detection step which includes selecting a detection image frame that displays an operation using a work piece against a target object from the M consecutive image frames; and calibrating the position range of the target object in the detection image frame; retracing from the detection image frame to select an Nth retraced image frame from the M consecutive image frames; obtaining a labeled image of the target object from the Nth retraced image frame according to the position range; comparing the labeled image with images of the M consecutive image frames to find at least one other labeled image similar to the target object; and storing both the labeled image and the at least one other labeled image as the same labeled data set.

Abstract: A variable aperture module includes a blade assembly, a positioning element, a driving part and pressing structures. The blade assembly includes movable blades disposed around an optical axis to form a light passable hole with an adjustable size. Each movable blade has a positioning hole and a movement hole adjacent thereto. The positioning element includes positioning structures disposed respectively corresponding to the positioning holes. The driving part includes a rotation element disposed corresponding to the movement holes and is rotatable with respect to the positioning element. The pressing structures are disposed respectively corresponding to the movable blades. Each pressing structure is at least disposed into at least one of the positioning hole and the movement hole of the corresponding movable blade. Each pressing structure at least presses against at least one of the corresponding one positioning structure and the rotation element.

Abstract: The present invention relates to a long-chain dibasic acid with low content of long-chain dibasic acid impurity of shorter carbon chain, to the preparation of a long-chain dibasic acid producing strain by directed evolution of POX gene and homologous recombination, and to the production of a long-chain dibasic acid with low content of long-chain dibasic acid impurity of shorter carbon chain by using the strain. The present invention also relates to a strain containing a mutated promoter, wherein, when a long-chain dibasic acid is produced by fermentation of this strain, the content of the acid impurity of shorter carbon chain in the fermentation product is significantly reduced.

Abstract: The present disclosure provides a semiconductor structure with a single side capacitor. The semiconductor structure includes a substrate having a first landing pad therein, and a first capacitor disposed over the substrate. The first capacitor includes: a first electrode, disposed over and extending vertically away from the first landing pad; a first dielectric layer, at least partially surrounding the first electrode, wherein the first electrode is shorter than the first dielectric layer; and a second electrode, surrounding the first dielectric layer and the first electrode.

Abstract: A cigarette lighter plug of an automobile tire repairing device, the tire repairing device contains: a box for receiving an air pump. The cigarette lighter plug is inserted into a power supply. The cigarette lighter plug includes a first housing, a second housing, and a power cord. The power cord includes a positive-electrode power part and a negative-electrode power part, the second housing includes a post, a first accommodation chamber, a column, a second accommodation chamber, a semi-arch flexible element. The second housing further includes a wing, a third accommodation chamber defined between the wing and the column, and a fourth accommodation chamber defined between a conductive foot of the semi-arch flexible element and the column so as to receive the power cord. The first housing is engaged with the second housing, and the power cord is not winded or is bent in an S shape.

Abstract: A micro light emitting diode including an epitaxy layer, a first pad, a second pad, a first ohmic contact metal, a second ohmic contact metal and at least one etch protection conductive layer is provided. The first pad and the second pad are electrically connected to a first type semiconductor layer and a second type semiconductor layer of the epitaxy layer, respectively. The first ohmic contact metal is disposed between the first type semiconductor layer and the first pad. The second ohmic contact metal is disposed between the second type semiconductor layer and the second pad. The at least one etch protection conductive layer is disposed between the first ohmic contact metal and the first pad and/or between the second ohmic contact metal and the second pad. A display panel is also provided.

Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure disposed over the gate dielectric layer and contacting the gate dielectric layer; and a pair of source/drain regions on opposing sides of the gate dielectric layer.

Abstract: An ionomer may include a neutralized blend of an ethylene acid copolymer and an aliphatic, mono-functional organic acid. The ethylene acid copolymer may be the polymerized reaction product of: ethylene, alkyl acrylate; optionally monocarboxylic acid monomer; and unsaturated dicarboxylic acid monomer. Another ionomer may include a neutralized blend of a first ethylene acid copolymer, a second ethylene acid copolymer, and an aliphatic, mono-functional organic acid. The first ethylene acid copolymer may be the polymerized reaction product of ethylene; monocarboxylic acid monomer; and optionally alkyl acrylate. The second ethylene acid copolymer may be the polymerized reaction product of: ethylene; alkyl acrylate; and unsaturated dicarboxylic acid monomer. Either blend may comprise from 5 to 40 wt. % of the aliphatic, mono-functional organic acid. At least 30 mole percent of total acid units of either blend may be neutralized with a magnesium cation of the magnesium neutralizing salt.

Abstract: A touch electronic device is provided, which includes: a substrate; a plurality of data fan-out lines disposed on the substrate; a plurality of first data pads disposed on the substrate; a plurality of touch fan-out lines disposed on the substrate; and a plurality of first touch pads disposed on the substrate, wherein one of the plurality of data fan-out lines is electrically connected to one of the plurality of first data pads, one of the plurality of touch fan-out lines is electrically connected to one of the plurality of first touch pads, and any of the plurality of data fan-out lines and any of the touch fan-out lines are not overlapped in a top view direction of the substrate.

Abstract: A method of forming a wafer-bonding structure includes a wafer-bonding step, a through silicon via (TSV) forming step, and a forming bonding pad step. In the wafer-bonding step, at least two wafers are corresponding to and bonded to each other by bonding surfaces thereof. In the TSV forming step, a TSV structure is formed on at least one side of a seal ring structure of one of the wafers, a conductive filler is disposed in the TSV structure, and the TSV structure is overlapped the side of one of the seal ring structure of one of the wafers and a portion of a seal ring structure of another one of the wafers. In the forming bonding pad step, a bonding pad is formed on an outer surface which is relative to the bonding surface of the wafer with the TSV structure, so as to form the wafer-bonding structure.

Abstract: A deposition tool includes a power cable pedestal including a pedestal body with a first surface and a second surface and a guide hole that extends through the pedestal body from the first surface to the second surface, where at least a portion of a sidewall of the guide hole has a slanted surface, and where the pedestal body is formed from a first material with a melting point that is higher than a melting point of Polyoxymethylene (POM). The deposition tool includes a bushing arranged over the guide hole, where the bushing is formed from a second material with a melting point that is higher than the melting point of POM.

Abstract: A flexible touch panel includes a flexible touch substrate, an overcoat layer, a device layer, and a waterproof layer. The overcoat layer is disposed over and directly contacting the flexible touch substrate. An adhesive force of the overcoat layer obtained according to an ASTM D3359 cross-cut test is greater than 4B. The device layer is disposed over the overcoat layer. The waterproof layer is interposed between the overcoat layer and the device layer.

Abstract: A carrier tray and a carrier tray assembly using the same are described. The carrier tray includes a carrying portion, a surrounding wall and at least one recessed structure. The carrying portion has a top surface and a bottom surface opposite to the top surface. The surrounding wall is disposed around the carrying portion. The recessed structure is recessed into the carrying portion. The recessed structure has an opening and a recessed space, and the recessed space is communicated with the outside through the opening. There is a first distance defined by the recessed space along a first direction, and there is a second distance defined by the opening along the first direction. The first distance is greater than the second distance.

Abstract: The embodiments of the disclosure provide a method for operating a mirrored content under a mirror mode and a computer readable storage medium. The method includes: enabling a touch capturing function on the smart device, wherein the touch capturing function intercepts a touch event inputted to the smart device; in response to determining that a raw touch event is intercepted by the smart device, translating the raw touch event to a first touch event and sending the first touch event to a host, wherein a display screen of the smart device is mirrored to a visual content shown by the host, and the first touch event triggers the host to report a second touch event happened in the visual content; disabling the touch capturing function and receiving the second touch event from the host; and performing a first operation in response to the second touch event and enabling the touch capturing function on the smart device.

Abstract: A camera module includes an imaging lens assembly and an image sensor, wherein the image sensor is located on an image side of the imaging lens assembly. The imaging lens assembly has an optical axis and includes a plastic lens barrel and a plurality of plastic lens elements, wherein the plastic lens elements are disposed in the plastic lens barrel. The plastic lens barrel includes an object-side outer surface, a lens barrel minimum opening, an object-side outer inclined surface and a reversing inclined surface. The object-side outer surface is a surface of the plastic lens barrel facing towards an object side being closest to the object side and is annular. The reversing inclined surface expands from the lens barrel minimum opening to the image side, wherein a connecting position of the reversing inclined surface and the object-side outer inclined surface forms the lens barrel minimum opening.

Abstract: Systems and methods are disclosed herein for caching structural elements of electronic documents. A plurality of indices is stored in a data store. The plurality of indices corresponds to locations within an electronic document of portions of a stylized sub-element. A mutation to the electronic document is received and it is determined that the mutation pertains to a style of the stylized sub-element. Based on the mutation and the plurality of indices, the stylized sub-element is updated, and the portions of the updated stylized sub-element are caused to be displayed at a user device using a different style.

Abstract: In an example method, a management service (MnS) producer sends a first request to establish a connection for streaming performance data regarding a wireless communications network to a MnS consumer. The MnS producer receives a first response from the MnS consumer confirming establishment of the connection, and streams one or more units of performance data to the MnS consumer sequentially using the connection. The one or more units include one or more performance metrics regarding the wireless communications network. The MnS producer sends a second request to the MnS consumer to terminate the connection, and receives a second response from the MnS consumer confirming termination of the connection.