Patents by Inventor Chris Mack

Chris Mack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7075639
    Abstract: A method of inspecting a phase shift mask is disclosed. The method includes receiving a mask having an alternating phase shift pattern. The method also includes forming the alternating phase shift pattern on a wafer. The method further includes analyzing the alternating phase shift pattern on the wafer to determine the phase difference of the alternating phase shift pattern.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: July 11, 2006
    Assignee: KLA-Tencor Technologies Corporation
    Inventors: Michael Adel, Mark Ghinovker, Chris A. Mack
  • Publication number: 20060089741
    Abstract: A computer-implemented method and a carrier medium adapted to improve lithographic processes are provided. In some embodiments, the computer-implemented method and carrier medium may be used for identifying potential causes of lithography process failure or drift. In addition or alternatively, the computer-implemented method and carrier medium may be adapted to generate a set of process parameter values for a lithography process based upon both critical dimension and overlay effect analyses of process parameter value variations. In some cases, the set of process parameter values may be selected to collectively minimize the number critical dimension and overlay variation errors produced within an image fabricated from the lithography process.
    Type: Application
    Filed: October 7, 2005
    Publication date: April 27, 2006
    Inventors: Chris Mack, Robert Jones, Jeffrey Byers
  • Patent number: 6968253
    Abstract: A computer-implemented method and a carrier medium adapted to generate a set of process parameter values for a lithography process based upon both critical dimension and overlay effect analyses of process parameter value variations is provided. In some cases, the computer-implemented method and a carrier medium may be configured to select a set of process parameter values to collectively minimize the number critical dimension and overlay variation errors produced within an image fabricated from the lithography process.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: November 22, 2005
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Chris Mack, Robert Jones, Jeffrey Byers
  • Publication number: 20040229736
    Abstract: A swing trainer composed of a handle, pulley, and cord connected to the handle and passing through the pulley permits a user to freely move the handle in any direction as well as rotate about its longitudinal axis so that he or she can engage in movement specific resistance training in a muscle memory fashion. The swing trainer preferably includes all or portion of a golf club (e.g., golf grip), tennis racket, baseball bat, hockey stick, or other piece of sporting equipment which the user will be training on. Because the handle is connected to the cord, the user can turn, rotate, and swing the handle in the same manner as he or she will when engaged in a sport, and the cord will slide on the pulley during this motion.
    Type: Application
    Filed: February 26, 2004
    Publication date: November 18, 2004
    Inventors: David W. Dise, Chris Mack
  • Publication number: 20040225401
    Abstract: A computer-implemented method and a carrier medium adapted to improve lithographic processes are provided. In some embodiments, the computer-implemented method and carrier medium may be used for identifying potential causes of lithography process failure or drift. In addition or alternatively, the computer-implemented method and carrier medium may be adapted to generate a set of process parameter values for a lithography process based upon both critical dimension and overlay effect analyses of process parameter value variations. In some cases, the set of process parameter values may be selected to collectively minimize the number critical dimension and overlay variation errors produced within an image fabricated from the lithography process.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 11, 2004
    Inventors: Chris Mack, Robert Jones, Jeffrey Byers
  • Publication number: 20040212796
    Abstract: A method of inspecting a phase shift mask is disclosed. The method includes receiving a mask having an alternating phase shift pattern. The method also includes forming the alternating phase shift pattern on a wafer. The method further includes analyzing the alternating phase shift pattern on the wafer to determine the phase difference of the alternating phase shift pattern.
    Type: Application
    Filed: April 25, 2003
    Publication date: October 28, 2004
    Inventors: Michael Adel, Mark Ghinovker, Chris A. Mack
  • Publication number: 20040190008
    Abstract: A method for determining one or more process parameter settings of a photolithographic system is disclosed.
    Type: Application
    Filed: January 17, 2004
    Publication date: September 30, 2004
    Applicant: KLA-Tencor Corporation
    Inventors: Walter D. Mieher, Chris A. Mack, Matt Hankinson
  • Publication number: 20030223630
    Abstract: An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.
    Type: Application
    Filed: February 13, 2003
    Publication date: December 4, 2003
    Applicant: KLA-Tencor Corporation
    Inventors: Michael Adel, Mark Ghinovker, Elyakim Kassel, Boris Golovanevsky, John C. Robinson, Chris A. Mack, Jorge Poplawski, Pavel Izikson, Moshe Preil
  • Publication number: 20030048458
    Abstract: A method for determining one or more process parameter settings of a photolithographic system is disclosed.
    Type: Application
    Filed: June 26, 2002
    Publication date: March 13, 2003
    Inventors: Walter Mieher, Thaddeus G. Dziura, Ady Levy, Chris A. Mack
  • Patent number: 5363171
    Abstract: An apparatus and method is provided for measuring photoresist parameters in situ is disclosed. Transmission and reflectivity detectors are used in a lithographic exposure tool to obtain in situ absorption parameters and reflectivity data. The absorption parameters and reflectivity data are used in a feedback control system that controls the exposure dose used in the lithographic tool.
    Type: Grant
    Filed: July 29, 1993
    Date of Patent: November 8, 1994
    Assignee: The United States of America as represented by The Director, National Security Agency
    Inventor: Chris A. Mack