Abstract: The invention relates to an electronic component with a semiconductor chip and a rewiring plate including a bond channel for bond connections between contact surfaces of the semiconductor chip and contact terminal pads on the rewiring plate. The contact surfaces extend in two parallel rows in a first portion and in one row in at least one other portion. A method for fabricating the inventive electronic component is also described.

Abstract: A method is described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.

Abstract: A method and an apparatus are described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.

Abstract: The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated.

Abstract: An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.

Abstract: A lead frame is configured with conductor leads, a dam bar and an extension between the conductor leads. The extension projects from the dam bar toward a central region of the lead frame. An electronic component is mounted on the lead frame and is brought into electrical contact with inner leads. The component and the lead frame are encased by injection molding. The extension is then isolated from the rest of the lead frame and is removed from the housing body. Thus a separating face is produced between the housing body and the extension. The separating face is used as a reference when positioning the component in a test socket.

Abstract: The invention relates to an electronic component with a semiconductor chip and a rewiring plate including a bond channel for bond connections between contact surfaces of the semiconductor chip and contact terminal pads on the rewiring plate. The contact surfaces extend in two parallel rows in a first portion and in one row in at least one other portion. A method for fabricating the inventive electronic component is also described.

Abstract: An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least two preformed, opposite edge regions which cover the edge regions of the bonding channel in an overlapping manner. Furthermore, the sheet strip has a preformed central region situated between the edge regions, which central region has a bulge and thickened portion and has two convexly curved contour lines in cross section.

Abstract: The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate substrate (2), which surrounds each semiconductor chip (5) in framelike fashion and which for packaging the plurality of semiconductor chips (5) with a plastic casting composition (7) between semiconductor chips (5) and the plastic grid (6).

Abstract: The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

Abstract: An IC chip is described that has a number of connecting devices, to which a specific predetermined pin assignment is respectively assigned and the pin assignment is provided more than once. The IC chip can be mounted optionally in a standard wiring, resulting from the pin assignment, or in a mirror-image wiring, mirror-inverted in relation to the standard wiring, likewise resulting from the pin assignment. To be able to produce such a chip at low cost and mount it in a simple manner, it is proposed that at least two groups of metallic bonding pads, which are disposed on the upper side or underside of the IC chip, are provided as the connecting devices and that the first group of bonding pads are assigned the standard wiring or standard pin assignment and at least a second group of bonding pads is assigned the corresponding mirror-image wiring or mirror-image pin assignment.

Abstract: An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least two preformed, opposite edge regions which cover the edge regions of the bonding channel in an overlapping manner. Furthermore, the sheet strip has a preformed central region situated between the edge regions, which central region has a bulge and thickened portion and has two convexly curved contour lines in cross section.

Abstract: A first casting mold region and a second casting mold region are brought together, with the result that a cavity, which is provided for receiving a leadframe and can be filled with a plastic molding compound, is formed. The first and second casting mold regions are brought together in such a way that at least a first contact region of the first casting mold region bears against a second contact region of the second casting mold region. The plastic package of the integrated circuit produced in this way has a smooth, burr-free surface, at least in the region of a centering portion. An integrated circuit having a lead frame and a plastic package and a test method for testing the integrated circuit are also provided.

Abstract: The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate substrate (2), which surrounds each semiconductor chip (5) in framelike fashion and which for packaging the plurality of semiconductor chips (5) with a plastic casting composition (7) between semiconductor chips (5) and the plastic grid (6).

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which there are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound composed of a first and a second layer. A method for manufacturing a semiconductor component includes applying the wiring foil to the first main side of the chip, producing the wire connection between the contact pads and the adjacent conductor track ends, applying the sealing compound to locations on the recess such that the wire connection is completely covered with the sealing compound, and only curing the surface of the sealing compound.

Abstract: A method and an apparatus are described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.