Carrier element for a semiconductor chip for integration into a chipcard
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Description
FIG. 1 is a top, perspective view of a carrier element for a semiconductor chip for integration into a chipcard showing our new design; and,
FIG. 2 is a top plan view thereof.
Referenced Cited
Patent History
Patent number: D405779
Type: Grant
Filed: Apr 25, 1997
Date of Patent: Feb 16, 1999
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Michael Huber (Nittendorf), Peter Stampka (Schwandorf-Klardorf), Erik Heinemann (Regensburg), Christian Hauser (Regensburg), Frank Pueschner (Kelheim)
Primary Examiner: Brian N. Vinson
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/70,054
Type: Grant
Filed: Apr 25, 1997
Date of Patent: Feb 16, 1999
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Michael Huber (Nittendorf), Peter Stampka (Schwandorf-Klardorf), Erik Heinemann (Regensburg), Christian Hauser (Regensburg), Frank Pueschner (Kelheim)
Primary Examiner: Brian N. Vinson
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/70,054
Classifications
Current U.S. Class:
D14/117
International Classification: 1402;
International Classification: 1402;
