Patents by Inventor Christine Frysz

Christine Frysz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190240482
    Abstract: A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20190217086
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10350421
    Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: July 16, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Jason Woods
  • Publication number: 20190192862
    Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization.
    Type: Application
    Filed: March 4, 2019
    Publication date: June 27, 2019
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel, Marc Gregory Martino
  • Patent number: 10272252
    Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: April 30, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel, Marc Gregory Martino
  • Patent number: 10272253
    Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 30, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel
  • Patent number: 10249415
    Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: April 2, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang, Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Jason Woods, Richard L. Brendel
  • Publication number: 20190097461
    Abstract: An electrical system incorporating a single structure multiple mode antenna is described. The antenna is preferably constructed having a first inductor coil that is electrically connected in series with a second inductor coil. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals is connected to the electrical connections that facilitate numerous electrical connections and enables the antenna to be selectively tuned to various frequencies and frequency bands.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Inventors: Vinit Singh, Alberto Peralta, Ajit Rajagopalan, Jason Luzinski, Jacob Babcock, Christine A. Frysz
  • Publication number: 20190088988
    Abstract: A lithium ion electrochemical cell is described in which the lithium comprising further comprises a lithiation agent. The lithiation agent, which comprises a lithium constituent, is designed to provide an excess source of lithium to minimize capacity loss of the lithium ion electrochemical cell. The anode of the lithium ion cell comprises a material matrix comprising carbon, graphene and an active element such as silicon or tin.
    Type: Application
    Filed: October 29, 2018
    Publication date: March 21, 2019
    Inventors: Cary Michael Hayner, Rachid Amine, Christine A. Frysz
  • Publication number: 20190009079
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Application
    Filed: August 21, 2018
    Publication date: January 10, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20190001123
    Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.
    Type: Application
    Filed: September 5, 2018
    Publication date: January 3, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Keith W. Seitz, Marc Gregory Martino
  • Publication number: 20180361164
    Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 20, 2018
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Christine A. Frysz, Dallas J. Rensel, Brian P. Hohl
  • Publication number: 20180326206
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Application
    Filed: July 25, 2018
    Publication date: November 15, 2018
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10124164
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: November 13, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10115998
    Abstract: A lithium ion electrochemical cell is described in which an electrode comprises a lithiation agent. The lithiation agent, which comprises a lithium constituent, is designed to provide an excess source of lithium to minimize capacity loss of the lithium ion electrochemical cell. The anode of the lithium ion cell comprises a material matrix comprising carbon, graphene and an active element such as silicon or tin.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: October 30, 2018
    Assignee: SINODE SYSTEMS, INC.
    Inventors: Cary Michael Hayner, Rachid Amine, Christine A. Frysz
  • Publication number: 20180304084
    Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor.
    Type: Application
    Filed: June 11, 2018
    Publication date: October 25, 2018
    Inventors: Robert A. Stevenson, Christine A. Frysz, Keith W. Seitz, Thomas Marzano, Marc Gregory Martino
  • Patent number: 10099051
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. There is also an active path electrically extending between the active end metallization of the chip capacitor and the lead wire.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 16, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10080889
    Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.
    Type: Grant
    Filed: February 23, 2014
    Date of Patent: September 25, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel
  • Patent number: 10063100
    Abstract: An electrical system incorporating a single structure multiple mode antenna is described. The antenna is preferably constructed having a first inductor coil that is electrically connected in series with a second inductor coil. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals is connected to the electrical connections that facilitate numerous electrical connections and enables the antenna to be selectively tuned to various frequencies and frequency bands.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: August 28, 2018
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Alberto Peralta, Ajit Rajagopalan, Jason Luzinski, Jacob Babcock, Christine A. Frysz
  • Publication number: 20180236244
    Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.
    Type: Application
    Filed: April 3, 2018
    Publication date: August 23, 2018
    Inventors: Robert A. Stevenson, Christine A. Frysz, Jason Woods