Abstract: Methods of producing low-halogen-containing polysilazane resins, which are used to make silicon carbide fibers and ceramic coatings, provide processes for removing halogens, including chlorine, from precursor polysilazane resins.

Abstract: Disclosed herein are methods of curing silicon carbide precursor polymer fibers, such as polysilazanes, using moisture and free radical generators, such as peroxides. Also disclosed are methods of forming, curing, and using silicon carbide precursor polymers that contain alkenyl groups and free radical generators, such as peroxides.

Abstract: The present disclosure generally relates to methods of using boron-containing additives for crosslinking polysilazane green fibers, which are precursors to silicon carbide fibers. These methods provide a controllable process for crosslinking silicon carbide fibers while providing a simple way for the introduction of boron as a sintering aid into the polymer structure.

Abstract: Disclosed herein are methods of curing silicon carbide precursor polymer fibers, such as polysilazanes, using moisture and free radical generators, such as peroxides. Also disclosed are methods of forming, curing, and using silicon carbide precursor polymers that contain alkenyl groups and free radical generators, such as peroxides.

Abstract: Embodiments of the invention are directed to a system, method, or computer program product for providing an information technology build service for building a platform in response to a service request. The invention receives a service request for the platform build from a requester, receives a plurality of platform parameters from the requester, determines whether the service request requires one or more physical machines or one or more virtual machines, and if the service request requires one or more virtual machines, initiates build of the one or more virtual machines. The invention also provisions physical and virtual storage based on received parameters, provisions physical and virtual processing power based on received parameters, and manages power of resources during the build, the managing comprising managing power ups, power downs, standbys, idles and reboots of one or more physical components being used for the build.

Abstract: The present disclosure generally relates to methods of using boron-containing additives for crosslinking polysilazane green fibers, which are precursors to silicon carbide fibers. These methods provide a controllable process for crosslinking silicon carbide fibers while providing a simple way for the introduction of boron as a sintering aid into the polymer structure.

Abstract: Embodiments of the invention are directed to a system, method, or computer program product for providing an information technology build service for building a platform in response to a service request. The invention receives a service request for the platform build from a requester, receives a plurality of platform parameters from the requester, determines whether the service request requires one or more physical machines or one or more virtual machines, and if the service request requires one or more virtual machines, initiates build of the one or more virtual machines. The invention also provisions physical and virtual storage based on received parameters, provisions physical and virtual processing power based on received parameters, and manages power of resources during the build, the managing comprising managing power ups, power downs, standbys, idles and reboots of one or more physical components being used for the build.

Abstract: Disclosed are blister package apparatuses and methods for use with tablets such as soft or breakable tablets that cannot be forced through a push-through layer. Specifically, a package for soft tablets can include a pair of blister strips, each blister strip having a plastic sheet, a plurality of recesses formed in the plastic sheet, and a peel-away backing layer for covering the recesses. A plurality of support posts can secure the blister strips together, and a spacer element can extend from one of the blister strips towards the other blister strip, the spacer element extending between two or more of the recesses for maintaining the blister strips in a spaced-apart configuration. The plurality of recesses formed in each blister strip can be offset with respect to the recesses formed in the other blister strip such that the recesses of one blister strip can nest between the recesses of the other.

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract: Disclosed are blister package apparatuses and methods for use with tablets such as soft or breakable tablets that cannot be forced through a push-through layer. Specifically, a package for soft tablets can include a pair of blister strips, each blister strip having a plastic sheet, a plurality of recesses formed in the plastic sheet, and a peel-away backing layer for covering the recesses. A plurality of support posts can secure the blister strips together, and a spacer element can extend from one of the blister strips towards the other blister strip, the spacer element extending between two or more of the recesses for maintaining the blister strips in a spaced-apart configuration. The plurality of recesses formed in each blister strip can be offset with respect to the recesses formed in the other blister strip such that the recesses of one blister strip can nest between the recesses of the other.

Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.

Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer releases the base insulative layer from the electronic device at a sufficiently low temperature.

Abstract: A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

Abstract: A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer is capable of releasing the base insulative layer from the electronic device. The removal may be done without damage to a predetermined part of the electronic component.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.

Abstract: A syneretic composition is provided. The syneretic composition includes a first curable material comprising an alcohol and an anhydride, and a second curable material. At a first temperature (T1) the first curable material cures to form a polymeric matrix, and the second curable material has a degree of conversion that is less than 50 percent. The second curable material is liquid and capable of exuding from the polymeric matrix at a syneresis temperature (Tsyn). A method and an article are provided also.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.

Abstract: A composition including a first curable and a second curable material is provided. The first curable material may include an alcohol and an anhydride. At a first temperature (T1) the first curable material may cures and the second curable material may not cure. An associated method is provided.

Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.