Abstract: A server manages power and performance. The server comprises a plurality of processor and associated storage and input/output interface components, arranged into a plurality of independent compute cells. One or more performance metrics descriptive of performance of the independent compute cell plurality are selected and an optimization evaluation of the one or more performance metrics is performed. The independent compute cell plurality is tuned based on the optimization evaluation.

Abstract: An electronics cooling fan comprises at least one collapsible fan blade driven by centrifugal force to extend radially as the fan spins and driven by elastic force to retract as spinning slows or stops.

Abstract: A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal.

Abstract: A system and method for making measurements using and RFID system includes a transceiver, a transponder and a sensor configured within the transponder. The transceiver is configured to send and receive radio frequency signals. The transponder is configured to receive radio frequency signals from the transceiver and to send radio frequency signals to the transceiver. The transponder includes a sensor. The transceiver is configured to send an activation signal to the transponder thereby enabling the first transponder sensor to make a vibration measurement and to hold the measurement.

Abstract: A measurement system includes a transceiver and a transponder. The transceiver is configured to send and receive radio frequency signals. The transponder is configured to receive radio frequency signals from the transceiver and to send radio frequency signals to the transceiver. The transponder includes a sensor. The transceiver is configured to send an activation signal to the transponder thereby enabling the first transponder sensor to make a measurement and to hold the measurement.

Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Abstract: A system for remote detection using and RFID system including a transceiver, a transponder and a fuse configured within the transponder. The transceiver is configured to send and receive radio frequency signals. The transponder is configured to receive radio frequency signals from the transceiver and to send radio frequency signals to the transceiver. The transceiver is configured to send radio frequency to the transponder thereby preventing the fuse from blowing while the radio frequency signal is received.

Abstract: A planar backplane is arranged in a horizontal orientation in a server configured for rack mounting. The planar backplane is configured to accept and mount a plurality of disk drives in a vertical orientation in a dense server arrangement.

Abstract: A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability.

Abstract: A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.

Abstract: A cooling system for an electronic system having at least one heat-generating component includes at least one fan and an operation level setting mechanism. The at least one fan is configured to blow air through the electronic system to thereby dissipate heat generated by the heat-generating component. The operation level setting mechanism is configured to set maximum operation level of the at least one fan, wherein the maximum operation level is based on one or more characteristics of the at least one heat-generating component.

Abstract: A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.

Abstract: An airflow distribution control system for usage in a raised-floor data center comprises an under-floor partition with a controllable flow resistance and a sensor. The partition is capable of selective positioning in a plenum beneath the raised-floor. The sensor is communicatively coupled to the partition and detects a parameter indicative of airflow distribution and controls the flow resistance based on the parameter.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

Abstract: A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the package lid and at a second attachment point to the circuit board. Isolation material is provided at the attachment point of the support frame to the substrate or package lid, or at the second attachment point of the support frame to the circuit board.

Abstract: A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.

Abstract: A printed circuit board connector engagement apparatus includes a four-bar linkage capable of coupling to an electronics system housing and is configured to accept and enable a printed circuit board to travel in a first direction until a connector on the printed circuit board and a corresponding connector coupled to the housing are aligned. The four-bar linkage further enables the printed circuit board to travel essentially orthogonal to the first direction to engage the printed circuit board and housing connectors.

Abstract: A method for monitoring a fan comprises measuring power usage of the fan, determining a derivative of the measured fan power usage, tracking the derivative over time, and predicting impending fan failure based on the tracked fan power usage derivative.

Abstract: A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.

Abstract: A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan.