Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

Abstract: A fan rotor system for cooling an electronic system includes a rotor body configured to be rotated by a fan motor and at least one collapsible fan blade mounted on the rotor body for moving cooling air through the electronic system. The at least one collapsible fan blade has a first air driving position, wherein the fan blade moves cooling air in a desired direction for cooling the electronic system, and a second air passage position, wherein the at least one collapsible fan blade is collapsed to allow cooling air to pass the at least one collapsible fan blade with less drag than when the at least one collapsible fan blade is in the first air driving position. The at least one collapsible fan blade is movable between the first air driving position when the rotor body is rotating and the second air passage position when the rotor body is not rotating.

Abstract: A computer fan efficiency feedback system and method are presented. In one embodiment, an indication electronic components are operating is received. A cooling system is directed to provide air flow to the electronic components. In one exemplary implementation the cooling system includes a fan. The fan speed is modulated in accordance with a fan speed efficiency control plan. For example, the fan speed efficiency control plan includes directions for changing or modulating the fan speed to a value that maximizes an efficiency ratio of flow work to input power supplied to the fan.

Abstract: A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

Abstract: In a liquid loop cooling device, a heat exchanger includes a tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments. The heat exchanger further includes a plurality of fins coupled to the tube segments. The fins for adjacent tube segments are separated by a gap.

Abstract: A cylindrical tubing hinge extends around and couples two segments of rigid or semi-rigid tubing and enables rotational motion of one segment relative to the other.

Abstract: A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus is comprised of a heat sink device having a plurality of cooling fins coupled to the heat sink device. The heat sink device is adapted to be thermally coupled to a heat source. The plurality of cooling fins are adapted to dissipate heat generated by the heat source. An air duct is coupled with the heat sink device. The air duct is for directing an airflow to the cooling fins to increase dissipation of the heat.

Abstract: An airflow management apparatus is used in an electronic system and includes a flexible air baffle that mounts on a chassis of an electronic device in an arrangement and obstructs air flow between an air inlet vent and an air exhaust vent of the electronic device. The flexible air baffle has a thickness that extends across a gap to contact an adjacent vertically-stacked electronic device.

Abstract: A divider for separating integrated circuit cards in a card cage comprises a planar member, at least one engagement edge disposed on the planar member and capable of engaging a slot in the card cage, and at least one aperture formed in and extending fully through the planar member. The at least one aperture facilitates airflow through the card cage.

Abstract: A heat sink includes at least one heat pipe attached to a base having a substantially flat region for interfacing with an electronic component. Additionally, the heat sink comprises fins attached to the base and at least one heat pipe. The fins and the base may be integral with or attached to each other. Such a heat sink can dissipate heat from one or more electronic components more efficiently as the heat pipe coupled with the fins attached to the base provide alternate heat transfer paths for heat generated by electronic components.

Abstract: A low profile actuator assembly for controlling PCI card removal from the chassis bay of a hot pluggable computer. The assembly includes a housing, a switch and a latch body. The housing is adapted for mounting to the bay and is defined by a top, bottom, and a front. The switch is coupled to the housing bottom and is operable in a first state and a second state. In this regard, the first state is indicative of a power-on condition, whereas the second state is indicative of a power-off condition. The latch body is connected to the housing and is operatively associated with the switch. More particularly, the latch body is linearly slidably between a retention position and a release position. In the retention position, the latch body is extended relative to the housing front and causes the switch to operate in the first state. Conversely, in the released position, the latch body is retracted relative to the housing front and causes the switch to operate in the second state.

Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: A divider for separating integrated circuit cards in a card cage comprises a planar member, at least one engagement edge disposed on the planar member and capable of engaging a slot in the card cage, and at least one aperture formed in and extending fully through the planar member. The at least one aperture facilitates airflow through the card cage.

Abstract: A dual-purpose computer according to the invention has a gravity-actuated switch mounted therein or thereon. The gravity-actuated switch is used to control the speed of a cooling fan for the computer. When the computer is operated in a horizontal orientation such as a typical rack-mounted server would be, the gravity actuated switch assumes a first state. When the computer is operated in a vertical orientation such as a typical desk side workstation would be, the gravity actuated switch assumes a second state. When the switch is in the first state, fan speed controller circuitry runs the fan at a first speed. When the switch is in the second state, fan speed controller circuitry runs the fan at a second speed. In one embodiment, the first speed is a higher speed intended to optimize reliability, and the second speed is a lower speed intended to minimize noise.

Abstract: A dual-purpose computer according to the invention has a gravity-actuated switch mounted therein or thereon. The gravity-actuated switch is used to control the speed of a cooling fan for the computer. When the computer is operated in a horizontal orientation such as a typical rack-mounted server would be, the gravity actuated switch assumes a first state. When the computer is operated in a vertical orientation such as a typical desk side workstation would be, the gravity actuated switch assumes a second state. When the switch is in the first state, fan speed controller circuitry runs the fan at a first speed. When the switch is in the second state, fan speed controller circuitry runs the fan at a second speed. In one embodiment, the first speed is a higher speed intended to optimize reliability, and the second speed is a lower speed intended to minimize noise.

Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.

Abstract: A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.

Abstract: A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.

Abstract: A heat sink includes at least one heat pipe attached to a base having a substantially flat region for interfacing with an electronic component. Additionally, the heat sink comprises fins attached to the base and at least one heat pipe. The fins and the base may be integral with or attached to each other. Such a heat sink can dissipate heat from one or more electronic components more efficiently as the heat pipe coupled with the fins attached to the base provide alternate heat transfer paths for heat generated by electronic components.

Abstract: In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.