Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus is comprised of a heat sink device having a plurality of cooling fins coupled to the heat sink device. The heat sink device is adapted to be thermally coupled to a heat source. The plurality of cooling fins are adapted to dissipate heat generated by the heat source. An air duct is coupled with the heat sink device. The air duct is for directing an airflow to the cooling fins to increase dissipation of the heat.

Abstract: In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.

Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.

Abstract: A low profile actuator assembly for controlling PCI card removal from the chassis bay of a hot pluggable computer. The assembly includes a housing, a switch and a latch body. The housing is adapted for mounting to the bay and is defined by a top, bottom, and a front. The switch is coupled to the housing bottom and is operable in a first state and a second state. In this regard, the first state is indicative of a power-on condition, whereas the second state is indicative of a power-off condition. The latch body is connected to the housing and is operatively associated with the switch. More particularly, the latch body is linearly slidably between a retention position and a release position. In the retention position, the latch body is extended relative to the housing front and causes the switch to operate in the first state. Conversely, in the released position, the latch body is retracted relative to the housing front and causes the switch to operate in the second state.

Abstract: A bulkhead plate member for providing an attenuating barrier for electromagnetic interference (EMI) noise in a computer system housing. The bulkhead plate member includes a rectangular shaped main portion having a material thickness. The main portion has a plurality of edge walls defining an opening for receiving a peripheral component connector affixed to a printed circuit board (PCB). The edge walls are adapted to contact side walls of the peripheral component connector to provide contact regions substantially perpendicular to the main portion and greater than the material thickness of the main portion, such that EMI noise is conducted through the bulkhead plate member, at the edge walls of the opening, to a bulkhead wall of the computer system housing thereby suppressing the EMI noise. The edge walls of the opening provides increased surface area contact between the bulkhead plate member and the peripheral component connector to maximize the attenuation of EMI noise around the connector.

Abstract: A mounting assembly for providing bus termination of a signal line on a printed circuit board (PCB). The mounting assembly includes a connector arrangement, a bus termination device, pressure plate and a clamping mechanism. The bus termination device is received by the connector arrangement, such that electrical interface elements of the bus termination device engage electrical interface elements of the connector arrangement to provide electrical communication between the connector arrangement and the signal line of the PCB. The clamping mechanism is engageable with the bus termination device for maintaining electrical contact between the electrical interface elements for securing the connector arrangement and bus termination device to the PCB. The pressure plate member is interposed between the clamping mechanism and the bus termination board.

Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.

Abstract: A mechanism for use in insertion and extraction of a first printed circuit board (PCB) to and from a second PCB so as to engage and disengage an electrical connector of the first PCB to and from a corresponding electrical connector of the second PCB. The insertion and extraction mechanism includes a stiffener bar and a mounting block. The stiffener bar is affixed to the first PCB immediately adjacent to the electrical connector for stiffening the first PCB in the vicinity of the electrical connector. The mounting block is affixed to the second PCB immediately adjacent to the corresponding electrical connector. A threaded fastener is carried by the stiffener bar and is engageable with the mounting block. Rotation of the fastener in a first direction causes the first PCB to be inserted to the second PCB which causes the electrical connector to be engaged with the corresponding electrical connector.