Patents by Inventor Christopher P. Hussell

Christopher P. Hussell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting devices
    Patent number: 8624271
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Cree, Inc.
    Inventors: Jesse Colin Reiherzer, Christopher P. Hussell, Peter Scott Andrews, David T. Emerson
  • LIGHT EMITTING DEVICES AND METHODS
    Publication number: 20130334548
    Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
    Type: Application
    Filed: June 3, 2013
    Publication date: December 19, 2013
    Inventors: Erin R. F. Welch, Christopher P. Hussell, Jesse Colin Reiherzer, Joseph G. Clark
  • Light emitting diode (LED) packages, systems, devices and related methods
    Patent number: 8610140
    Abstract: Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: December 17, 2013
    Assignee: Cree, Inc.
    Inventors: Sung Chul Joo, Christopher P. Hussell
  • LIGHT EMITTING DEVICES AND SUBSTRATES WITH IMPROVED PLATING
    Publication number: 20130328070
    Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.
    Type: Application
    Filed: March 14, 2013
    Publication date: December 12, 2013
    Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Erin Welch
  • Light emitting device packages with improved heat transfer
    Patent number: 8598602
    Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: December 3, 2013
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Robert S. Pyles
  • LED lamp
    Patent number: 8591062
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: November 26, 2013
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • GAS COOLED LED LAMP
    Publication number: 20130301252
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 14, 2013
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez, Ed Adams
  • LED LAMP
    Publication number: 20130294092
    Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez, Ed Adams
  • SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS
    Publication number: 20130292708
    Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.
    Type: Application
    Filed: March 14, 2013
    Publication date: November 7, 2013
    Applicant: CREE, INC.
    Inventors: Jesse Colin Reiherzer, Christopher P. Hussell, Erin Welch
  • Light emitting devices for light emitting diodes (LEDs)
    Patent number: 8575639
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 5, 2013
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • LED LAMP
    Publication number: 20130279175
    Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp that extends from the base to the free end of the enclosure. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly includes LEDs operable to emit light when energized through an electrical path from the base. The LED assembly is arranged such that the plurality of LEDs face perpendicularly to the longitudinal axis of the lamp. The emission profile of the LEDs being at least 120 degrees FWHM.
    Type: Application
    Filed: May 2, 2013
    Publication date: October 24, 2013
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Light emitting devices for light emitting diodes (LEDs)
    Patent number: 8564000
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: October 22, 2013
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • LED LAMP
    Publication number: 20130271981
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Application
    Filed: February 22, 2013
    Publication date: October 17, 2013
    Applicant: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • GAS COOLED LED LAMP
    Publication number: 20130271972
    Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In some embodiments, the LEDs can be mounted on or fixed to a light transmissive submount. In some embodiments, LEDs can be disposed on both sides of a two-sided submount, or on thee or more sides if the submount structure includes three or more mounting surfaces. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the gas is at a pressure of from about 0.5 to about 10 atmospheres and has a thermal conductivity of at least about 60 mW/m-K.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 17, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley
  • LED LAMP
    Publication number: 20130271991
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Application
    Filed: March 1, 2013
    Publication date: October 17, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • GAS COOLED LED LAMP
    Publication number: 20130271989
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
    Type: Application
    Filed: February 22, 2013
    Publication date: October 17, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • GAS COOLED LED LAMP
    Publication number: 20130271990
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
    Type: Application
    Filed: March 1, 2013
    Publication date: October 17, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • GAS COOLED LED LAMP
    Publication number: 20130271987
    Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.
    Type: Application
    Filed: May 9, 2012
    Publication date: October 17, 2013
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye
  • WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)
    Publication number: 20130264589
    Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
    Type: Application
    Filed: September 10, 2012
    Publication date: October 10, 2013
    Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
  • LIGHT EMITTING DIODES (LEDS), DEVICES, AND METHODS FOR PROVIDING FAILURE MITIGATION IN LED ARRAYS
    Publication number: 20130264591
    Abstract: Light emitting diodes (LEDs), devices, and methods for providing failure mitigation in LED arrays are disclosed. In one aspect, an LED can include a body with an anode and a cathode in the form of electrically conductive bond pads. The anode and cathode can be configured to electrically communicate with more than two electrical components via electrical connectors.
    Type: Application
    Filed: March 11, 2013
    Publication date: October 10, 2013
    Inventor: Christopher P. Hussell