Patents by Inventor Christopher P. Hussell

Christopher P. Hussell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED package with efficient, isolated thermal path
    Patent number: 8878217
    Abstract: Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 4, 2014
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • Submount based light emitter components and methods
    Patent number: 8878204
    Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 4, 2014
    Assignee: Cree, Inc.
    Inventors: Jesse Colin Reiherzer, Christopher P. Hussell, Erin Welch
  • Solid state lighting device
    Patent number: 8866166
    Abstract: A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: October 21, 2014
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • Light emitting device packages, systems and methods
    Patent number: 8860043
    Abstract: Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: October 14, 2014
    Assignee: Cree, Inc.
    Inventors: David T. Emerson, Christopher P. Hussell, Sung Chul Joo
  • High efficacy semiconductor light emitting devices employing remote phosphor configurations
    Patent number: 8853712
    Abstract: A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 250 lumens per watt, and in some cases up to 270 lumens per watt.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: October 7, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Florin Tudorica, David Todd Emerson, Michael John Bergmann, Arthur Fong-Yuen Pun
  • CONNECTOR DEVICES, SYSTEMS, AND RELATED METHODS FOR LIGHT EMITTER COMPONENTS
    Publication number: 20140265809
    Abstract: Connector devices and systems for light emitter components and related methods are provided. In some aspects, a connector device includes a body, at least a first trace, and a second trace. In some aspects, connector device can include multiple traces. The first and second traces can be disposed over portions of the body. In some aspects, portions of each of the first and second traces can be electrically and/or physically connectable to each of a first and a second light emitter component via an attachment material.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventor: Christopher P. Hussell
  • LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS
    Publication number: 20140268728
    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
  • CERAMIC BASED LIGHT EMITTING DIODE (LED) DEVICES AND METHODS
    Publication number: 20140264397
    Abstract: Light emitter devices, such as light emitting diode (LED) devices and related methods are disclosed. A light emitter device includes a ceramic based substrate, at least one LED chip disposed on the substrate, and a filling material. The ceramic substrate can include one or more surface features. The filling material can be disposed over and/or within a portion of the one or more surface features. Surface features can include one or more pedestals, trenches, holes, indentions, depressions, waves, and/or convexly or concavely curved surfaces. Surface features can improve optics of the LED device, for example, improving brightness, reflection, and/or light extraction associated with the device. Related methods are disclosed.
    Type: Application
    Filed: March 17, 2014
    Publication date: September 18, 2014
    Inventors: Erin R. F. Welch, Harry A. Seibel, II, Christopher P. Hussell
  • HIGH VOLTAGE ARRAY LIGHT EMITTING DIODE (LED) DEVICES AND FIXTURES
    Publication number: 20140240974
    Abstract: High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 28, 2014
    Applicant: Cree, Inc.
    Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Jeffrey Carl Britt, Praneet Athalye, Peter Scott Andrews
  • GAS COOLED LED LAMP
    Publication number: 20140239794
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
    Type: Application
    Filed: May 2, 2014
    Publication date: August 28, 2014
    Applicant: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
    Patent number: 8809880
    Abstract: Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays are disclosed. In one aspect, an LED chip can include a body with an anode and a cathode in the form of electrically conductive bond pads. The anode and cathode can be configured to electrically communicate with more than two electrical components via electrical connectors.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: August 19, 2014
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • CHIP WITH INTEGRATED PHOSPHOR
    Publication number: 20140217443
    Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.
    Type: Application
    Filed: October 14, 2013
    Publication date: August 7, 2014
    Inventors: Sten Heikman, James Ibbetson, Zhimin Jamie Yao, Fan Zhang, Matthew Donofrio, Christopher P. Hussell, John A. Edmond
  • LIGHT EMITTING DEVICES AND METHODS
    Publication number: 20140217434
    Abstract: Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 7, 2014
    Applicant: Cree, Inc.
    Inventors: Christopher P. Hussell, David T. Emerson, Jeffrey Carl Britt
  • LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS
    Publication number: 20140217433
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Application
    Filed: January 30, 2014
    Publication date: August 7, 2014
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • SUBMOUNT-FREE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME
    Publication number: 20140217436
    Abstract: Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 7, 2014
    Applicant: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter S. Andrews, Jesse C. Reiherzer
  • LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS)
    Publication number: 20140183577
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 3, 2014
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • Encapsulant profile for light emitting diodes
    Patent number: 8766298
    Abstract: A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: July 1, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Michael J. Bergmann, Brian T. Collins, David T. Emerson
  • Gas cooled LED lamp
    Patent number: 8757839
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: June 24, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Anthony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Package for light emitting diode (LED) lighting
    Patent number: D708156
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: July 1, 2014
    Assignee: Cree, Inc.
    Inventors: Sung Chul Joo, Christopher P. Hussell
  • Light emitter device
    Patent number: D712850
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: September 9, 2014
    Assignee: Cree, Inc.
    Inventors: Erin R. F. Welch, Christopher P. Hussell