Patents by Inventor Christopher P. Hussell

Christopher P. Hussell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9123874
    Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: September 1, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Sung Chul Joo
  • Patent number: 9111778
    Abstract: Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: August 18, 2015
    Assignee: Cree, Inc.
    Inventors: David T. Emerson, Michael J. Bergmann, Christopher P. Hussell
  • Publication number: 20150207040
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.
    Type: Application
    Filed: March 30, 2015
    Publication date: July 23, 2015
    Inventor: Christopher P. Hussell
  • Patent number: 9052416
    Abstract: A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that comprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: June 9, 2015
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Christopher P. Hussell
  • Patent number: 9053958
    Abstract: An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: June 9, 2015
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, Christopher P. Hussell, John Adam Edmond
  • Patent number: 9046248
    Abstract: A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that includes an elongated wavelength conversion tube wall having wavelength conversion material, such as phosphor, dispersed therein. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein. The elongated hollow wavelength conversion tube may have an open end, a crimped end, a reflective end, and/or other configurations. Multiples tubes and/or multiple semiconductor light emitting devices may also be used in various configurations. Related assembling methods are also described.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: June 2, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond
  • Patent number: 9048392
    Abstract: Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: June 2, 2015
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • Patent number: 9041285
    Abstract: A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, David T. Emerson
  • Patent number: 9000470
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 7, 2015
    Assignee: Cree, Inc.
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Patent number: 8994057
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: March 31, 2015
    Assignee: Cree, Inc.
    Inventor: Christopher P. Hussell
  • Publication number: 20150062915
    Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Erin R. F. Welch, Florin A. Tudorica
  • Publication number: 20150034978
    Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips, and can include providing a substrate and a plurality of LED chips over the substrate. The devices and methods described herein can further include providing a plurality of integral lenses over the LED chips, where at least some of the lenses can be distorted. In some aspects, the distorted lenses can be compressed towards each other along one or more directions.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 5, 2015
    Inventor: Christopher P. Hussell
  • Patent number: 8921869
    Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: December 30, 2014
    Assignee: Cree, Inc.
    Inventors: Erin R. F. Welch, Christopher P. Hussell, Jesse Colin Reiherzer, Joseph G. Clark
  • Patent number: 8922108
    Abstract: Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: December 30, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Florin A. Tudorica, David T. Emerson
  • Patent number: 8911105
    Abstract: A lamp comprises an optically transmissive enclosure. A plurality of LEDs for emitting light are located to emit light toward the enclosure. The enclosure has at least one reflective area disposed on the enclosure to reflect a portion of the light into the enclosure to create a desired luminous intensity distribution.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: December 16, 2014
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Christopher P. Hussell
  • Patent number: 8895998
    Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Florin A. Tudorica, Erin R. F. Welch
  • Patent number: D718258
    Type: Grant
    Filed: September 2, 2012
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Theodore Lowes, Eric J. Tarsa, Sten Heikman, Bernd Keller, John A. Edmond, Jesse Reiherzer, Hormoz Benjamin, Christopher P. Hussell
  • Patent number: D721339
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: January 20, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Erin Welch
  • Patent number: D736725
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: August 18, 2015
    Assignee: Cree, Inc.
    Inventors: Kurt S. Wilcox, Christopher P. Hussell, Jesse Colin Reiherzer
  • Patent number: D738542
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: September 8, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Erin R. F. Welch