Patents by Inventor Chuan Lee

Chuan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031391
    Abstract: A method includes following steps. A semiconductor substrate is etched to form semiconductor fins. A dielectric material is deposited into a trench between the semiconductor fins. The semiconductor fins are etched such that top ends of the semiconductor fins are lower than a top surface of the dielectric material. After etching the semiconductor fins, epitaxially growing epitaxial fins on the semiconductor fins, respectively. A chemical mechanical polish (CMP) process is performed on the epitaxial fins, followed by cleaning the epitaxial fins using a non-contact-type cleaning device. The dielectric material is then such that the top surface of the dielectric material is lower than top ends of the epitaxial fins. A gate structure is formed across the epitaxial fins.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: June 8, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shen-Nan Lee, Kuo-Yin Lin, Pin-Chuan Su, Teng-Chun Tsai
  • Publication number: 20210149043
    Abstract: A vehicle radar device includes a radar control unit, a first antenna array, a second antenna array, a first circuit board and a second circuit board. The first antenna array is communicatively connected to the radar control unit. The first antenna array includes a plurality of first transmitting elements and a plurality of first receiving elements. The second antenna array is communicatively connected to the radar control unit. The second antenna array includes a plurality of second transmitting elements and a plurality of second receiving elements. The first antenna array is a plurality of circuit board antennas and disposed on the first circuit board. The second antenna array is a plurality of circuit board antennas and disposed on the second circuit board.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Inventors: San-Chuan YU, Yuan-Tung HUNG, Kou-Ting LEE
  • Publication number: 20210144884
    Abstract: A heat-dissipating component for a mobile device includes a case body, a micro pump, and a heat dissipation tube plate. The case body has a vent hole and a positioning accommodation trough. The bottom of the positioning accommodation trough is in communication with the vent hole. The micro pump is disposed in the positioning accommodation trough and corresponds to the vent hole The heat dissipation tube plate has cooling fluid inside. One end of the heat dissipation tube plate is fixed on the positioning accommodation trough and contacts a heating element of the mobile device. The gas transmitted by the micro pump forms gas flow so as to perform heat exchange with heat absorbed by the heat dissipation tube plate, and the gas flow is discharged out through the vent hole.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 13, 2021
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Chin-Chuan Wu, Chih-Kai Chen, Yung-Lung Han, Chi-Feng Huang, Wei-Ming Lee
  • Publication number: 20210141284
    Abstract: A nonlinear optical crystal (NLO) with a phase matching angle that is corrected with a source laser beam for harmonic conversion. The source laser only has to be within a wavelength range depending on the dispersion of the crystal while the crystal is tilted to the calculated expected conversion angle of the source laser as reference. The angle correction is accomplished with a parallel kinematic motion device to which a nonlinear crystal is mounted on a platform, to determine the wavelength- and temperature-specific angle with active laser alignment and subsequent precision resurfacing. The invented phase matching angle correction is applicable to any uniaxial and biaxial NLO crystals in a wide range of wavelengths, e.g., from far ultraviolet to visible to far infrared. It is of most value for NLO crystals of large walk-off and is applicable to any prior art frequency converting architectures.
    Type: Application
    Filed: November 7, 2019
    Publication date: May 13, 2021
    Applicant: Onyx Optics, Inc.
    Inventors: Helmuth Ernst Meissner, Huai-Chuan Lee, David J, Meissner, Da Li
  • Publication number: 20210129343
    Abstract: A method for determining coordinates of a mechanical arm includes taking a first picture of a marker on a target object on a first jig, obtaining first position coordinates of the marker, calculating reference position coordinates, controlling the mechanical arm to move to the reference position coordinates, moving the mechanical arm from the reference position coordinates to an intermediate position, setting current position coordinates as intermediate position coordinates, moving the mechanical arm from the intermediate position to a target position, setting current position coordinates as target position coordinates, moving the target object onto a second jig, taking a second picture of the marker to obtain second position coordinates, calculating reference position coordinates based on the second position coordinates, controlling the mechanical arm to move to the reference position coordinates, calculating intermediate position coordinates corresponding to the second jig, and calculating target position c
    Type: Application
    Filed: November 6, 2020
    Publication date: May 6, 2021
    Inventors: CHUNG-WEI WU, TUNG-CHUN HSIEH, CHIH-WEI LI, SUNG-CHUAN LEE, TZE-CHIN LO
  • Patent number: 10998360
    Abstract: The present disclosure relates to a method of forming an integrated chip. The method may be performed by selectively etching a substrate to define a trench. One or more dielectric materials are formed within the trench. A part of the one or more dielectric materials are removed from within the trench to expose a sidewall of the substrate defining the trench. A doped epitaxial material is formed along the sidewall of the substrate.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: May 4, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh-Chuan Lee, Chia-Chan Chen
  • Patent number: 10998359
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a photodetector region arranged within a semiconductor substrate. One or more dielectric materials are disposed within a trench defined by one or more interior surfaces of the semiconductor substrate. A doped epitaxial material is arranged within the trench and is laterally between the one or more dielectric materials and the photodetector region. A dielectric protection layer is arranged over the one or more dielectric materials within the trench. The dielectric protection layer laterally contacts a sidewall of the doped epitaxial material.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: May 4, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh-Chuan Lee, Chia-Chan Chen
  • Publication number: 20210124257
    Abstract: A method for forming a mask substrate is provided. The method includes providing a first base and providing a mask layer on the first base. The method also includes patterning the mask layer to form a pattern, wherein the first base and the pattern form a patterned substrate and providing a first substrate. The method further includes providing an optical layer on the first substrate or on the patterned substrate and assembling the first substrate and the patterned substrate to form the mask substrate.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 29, 2021
    Inventors: Chien-Hsing LEE, Chin-Lung TING, Jung-Chuan WANG, Hong-Sheng HSIEH
  • Patent number: 10991595
    Abstract: A dry etching process for manufacturing a trench structure of a semiconductor apparatus, including the steps of: step 1, providing a semiconductor substrate, wherein the semiconductor substrate is provided with a patterned photoresist layer and placed in a reaction chamber; step 2, introducing a first etching gas into the reaction chamber to perform a first etching process to form a trench, wherein the first etching gas includes sulfur hexafluoride, oxygen, helium, nitrogen trifluoride, and a first organic silicide; step 3, introducing a second etching gas into the reaction chamber to perform a second etching process to further etch the trench, wherein the second etching gas includes sulfur hexafluoride, oxygen, helium, and a second organic silicide; and step 4, introducing a third etching gas into the reaction chamber to perform a third etching process, wherein the third etching gas includes hydrobromic acid, oxygen, and helium.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: April 27, 2021
    Assignee: TAIWAN CARBON NANO TECHNOLOGY CORPORATION
    Inventors: Kuang-Jui Chang, Yu-Hsuan Liao, Chun-Hsien Tsai, Ting-Chuan Lee, Chun-Jung Tsai
  • Patent number: 10991442
    Abstract: A memory device includes a memory circuit and a fuse protection circuit. The memory circuit includes a program line and a fuse. The program line is configured to receive a program voltage for programming the fuse. The fuse protection circuit is coupled to the memory circuit and is configured to prevent unintentional programming of the fuse.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: April 27, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Der Chih, Chen-Ming Hung, Jen-Chou Tseng, Jam-Wem Lee, Ming-Hsiang Song, Shu-Chuan Lee, Shao-Yu Chou, Yu-Ti Su
  • Patent number: 10976674
    Abstract: An extreme ultraviolet (EUV) lithography system includes an extreme ultraviolet (EUV) radiation source to emit EUV radiation, a collector for collecting the EUV radiation and focusing the EUV radiation, a reticle stage for supporting a reticle including a pellicle for exposure to the EUV radiation, and at least one sensor configured to detect particles generated due to breakage of the pellicle.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Tsung Shih, Bo-Tsun Liu, Tsung Chuan Lee
  • Publication number: 20210031947
    Abstract: An unmanned vehicle module can include, in some aspects, a landing platform including a landing area for receiving an unmanned vehicle, wherein the landing area includes a predetermined charging region; a first charging plate; a second charging plate, wherein the first charging plate and the second charging plate are positioned in the predetermined charging region; an electrical energy storage device for connecting electrically with the first charging plate and with the second charging plate; and an unmanned vehicle alignment mechanism configured to move the unmanned vehicle into the predetermined charging region; wherein the unmanned vehicle alignment mechanism includes a first beam, a second beam, a third beam, a fourth beam, and an actuation device for actuating at least two of the first beam, the second beam, the third beam, and the fourth beam to push the unmanned vehicle into the charging region.
    Type: Application
    Filed: January 31, 2019
    Publication date: February 4, 2021
    Inventors: Taras Wankewycz, Mehmet Kesmez, Cher Chuan Lee, Bo Han, Harshavardhan Thakar
  • Patent number: 10908699
    Abstract: An electronic apparatus, a wireless input device and a control method thereof are provided. The wireless input device includes a wireless signal receiver, a control chip, and a wireless signal transmitter. The wireless signal receiver receives a radio frequency signal. The control chip is activated according to the radio frequency signal and generates operation power according to the radio frequency signal. The control chip generates input information by detecting an input operation on an input interface based on the operation power. The wireless signal transmitter transmits the input information to an external electronic apparatus based on the operation power.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 2, 2021
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventor: Mu-Chuan Lee
  • Patent number: 10900664
    Abstract: A fuel gas nozzle used in a microturbine includes a first chamber, a second chamber connected to the first chamber, a pilot fuel gas pipe, a main fuel gas pipe and an intake pipe. An intake zone and a mixing zone are respectively formed in the first chamber and the second chamber and are communicated with each other. The pilot fuel gas pipe is for introducing a first fuel gas into a downstream of the second chamber. The main fuel gas pipe is for introducing a second fuel gas into the mixing zone via the intake zone. The intake pipe is for introducing an air into the mixing zone. A centerline of the intake pipe is not intersected with a centerline of the second chamber, so as to induce a vortex flow field of the air flowing into the mixing zone for mixing the air and the second fuel gas.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 26, 2021
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Yung-Mao Tsuei, Chih-Chuan Lee, Chi-Fang Chiu
  • Patent number: 10879123
    Abstract: A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh-Chuan Lee, Chia-Chan Chen, Ching-Heng Liu
  • Publication number: 20200400156
    Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.
    Type: Application
    Filed: July 3, 2020
    Publication date: December 24, 2020
    Inventors: Sung-Wei Sun, Chu-Hsien Chou, Yi-Chih Lin, Pei-Chuan Lee, Wen-Hao Liu
  • Publication number: 20200402599
    Abstract: A memory device includes a memory circuit and a fuse protection circuit. The memory circuit includes a program line and a fuse. The program line is configured to receive a program voltage for programming the fuse. The fuse protection circuit is coupled to the memory circuit and is configured to prevent unintentional programming of the fuse.
    Type: Application
    Filed: September 8, 2020
    Publication date: December 24, 2020
    Inventors: Yu-Der Chih, Chen-Ming Hung, Jen-Chou Tseng, Jam-Wem Lee, Ming-Hsiang Song, Shu-Chuan Lee, Shao-Yu Chou, Yu-Ti Su
  • Publication number: 20200366782
    Abstract: The present invention provides a wireless communication device and a subscriber identity module card in a wireless communication device. The subscriber identity module card comprises a flat plate carrier, a subscriber identity module circuit and a gas sensing chip. The flat plate carrier comprises a first surface where the subscriber identity module circuit is disposed, a second surface where the gas sensing chip is disposed, a through hole, and an electrical contact portion passing through the through hole and extending to reach the first surface and the second surface. The electrical contact portion is electrically connected to the subscriber identity module circuit and the gas sensing chip. The gas sensing chip is disposed on a portion of the subscriber identity module card where not occupied by the subscriber identity module circuit. Thus, the wireless communication device provides gas sensing function without additionally equipping with an external gas sensing element.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 19, 2020
    Inventors: Yu-Hsuan Liao, Chia-Pin Huang, Chun-Hsien Tsai, Ting-Chuan Lee, Chun-Jung Tsai
  • Publication number: 20200357762
    Abstract: Some embodiments relate to a bond pad structure of an integrated circuit (IC). The bond structure includes a bond pad and an intervening metal layer positioned below the bond pad. The intervening metal layer has a first face and a second face. A first via layer is in contact with the first face of intervening metal layer. The first via layer has a first via pattern including a single via. The bond structure also includes a second via layer in contact with the second face of the intervening metal layer. The second via layer has a second via pattern that is different than first via pattern. The second via pattern includes a first via surrounding a second via. The first and second vias are concentric with one another about a central point of the second via layer.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 12, 2020
    Inventors: Chia-Chan Chen, Yueh-Chuan Lee
  • Patent number: 10826521
    Abstract: A successive approximation register (SAR) analog to digital converter (ADC) and a method of detecting an offset of a comparator are introduced. The SAR ADC includes a switch circuit, a comparator and a calibration circuit. The switch circuit is configured to perform a swapping operation on a first intermediate analog signal and a second intermediate analog signal to generate a first swapped analog signal and a second swapped analog signal. The comparator is coupled to the switching circuit and is configured to compare the first intermediate analog signal and the second intermediate analog signal before the swapping operation to generate a least-significant-bit value. The comparator is further configured to compare the first swapped analog signal and the second swapped analog signal after the swapping operation to generate a calibration bit value. The calibration circuit is configured to determine whether the comparator has an offset according to the least-significant-bit value and the calibration bit value.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: November 3, 2020
    Assignee: Novatek Microelectronics Corp.
    Inventors: Chun-Po Huang, Liang-Ting Kuo, Yi-Shen Cheng, Chia-Chuan Lee, Soon-Jyh Chang