Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a photodetector region provided in a substrate. A dielectric material is disposed within a trench defined by one or more interior surfaces of the substrate. The trench has a depth that extends from an upper surface of the substrate to within the substrate. A doped silicon material is disposed within the trench and has a sidewall facing away from the doped silicon material. The sidewall contacts a sidewall of the dielectric material along an interface extending along the depth of the trench.

Abstract: The present invention provides a wireless communication device and a subscriber identity module card in a wireless communication device. The subscriber identity module card comprises a flat plate carrier, a subscriber identity module circuit and a gas sensing chip. The flat plate carrier comprises a first surface where the subscriber identity module circuit is disposed, a second surface where the gas sensing chip is disposed, a through hole, and an electrical contact portion passing through the through hole and extending to reach the first surface and the second surface. The electrical contact portion is electrically connected to the subscriber identity module circuit and the gas sensing chip. The gas sensing chip is disposed on a portion of the subscriber identity module card where not occupied by the subscriber identity module circuit. Thus, the wireless communication device provides gas sensing function without additionally equipping with an external gas sensing element.

Abstract: A connector structure includes a first connector and a second connector configured to rotatably connect the first connector. The first connector includes an insulating support, a first conductor and a second conductor. The first and second conductors respectively include first and second convex curved surfaces. The second connector includes first and second insulating housings and first and second conductive layers. The first and second insulating housings are configured to cover at least a portion of the first conductor and at least a portion of the second conductor, respectively. The first conductive layer includes a first concave curved surface matching the first convex curved surface, and is configured to be in contact with the first conductor. The second conductive layer includes a second concave curved surface matching the second convex curved surface, and is configured to be in contact with the second conductor.

Abstract: In accordance with some embodiments, a method for processing a semiconductor wafer is provided. The method includes transporting a carrier along with a reticle supported by the carrier in a lithography exposure apparatus. The method also includes regulating particles in the carrier through a magnetic field. In addition, the method includes removing the reticle from the carrier. The method further includes performing, using the reticle, a lithography exposure process to the semiconductor wafer in the lithography exposure apparatus.

Abstract: A microturbine including a combustor, an igniter disposed adjacent to the combustor, and a plurality of fuel nozzles disposed adjacent to the combustor. The combustor includes a plurality of laser holes located merely in a region of the combustor.

Abstract: A nonlinear optical crystal (NLO) with a phase matching angle that is corrected with a source laser beam for harmonic conversion. The source laser only has to be within a wavelength range depending on the dispersion of the crystal while the crystal is tilted to the calculated expected conversion angle of the source laser as reference. The angle correction is accomplished with a parallel kinematic motion device to which a nonlinear crystal is mounted on a platform, to determine the wavelength- and temperature-specific angle with active laser alignment and subsequent precision resurfacing. The invented phase matching angle correction is applicable to any uniaxial and biaxial NLO crystals in a wide range of wavelengths, e.g., from far ultraviolet to visible to far infrared. It is of most value for NLO crystals of large walk-off and is applicable to any prior art frequency converting architectures.

Abstract: A method for determining coordinates of a mechanical arm includes taking a first picture of a marker on a target object on a first jig, obtaining first position coordinates of the marker, calculating reference position coordinates, controlling the mechanical arm to move to the reference position coordinates, moving the mechanical arm from the reference position coordinates to an intermediate position, setting current position coordinates as intermediate position coordinates, moving the mechanical arm from the intermediate position to a target position, setting current position coordinates as target position coordinates, moving the target object onto a second jig, taking a second picture of the marker to obtain second position coordinates, calculating reference position coordinates based on the second position coordinates, controlling the mechanical arm to move to the reference position coordinates, calculating intermediate position coordinates corresponding to the second jig, and calculating target position c

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a photodetector region arranged within a semiconductor substrate. One or more dielectric materials are disposed within a trench defined by one or more interior surfaces of the semiconductor substrate. A doped epitaxial material is arranged within the trench and is laterally between the one or more dielectric materials and the photodetector region. A dielectric protection layer is arranged over the one or more dielectric materials within the trench. The dielectric protection layer laterally contacts a sidewall of the doped epitaxial material.

Abstract: The present disclosure relates to a method of forming an integrated chip. The method may be performed by selectively etching a substrate to define a trench. One or more dielectric materials are formed within the trench. A part of the one or more dielectric materials are removed from within the trench to expose a sidewall of the substrate defining the trench. A doped epitaxial material is formed along the sidewall of the substrate.

Abstract: A memory device includes a memory circuit and a fuse protection circuit. The memory circuit includes a program line and a fuse. The program line is configured to receive a program voltage for programming the fuse. The fuse protection circuit is coupled to the memory circuit and is configured to prevent unintentional programming of the fuse.

Abstract: A dry etching process for manufacturing a trench structure of a semiconductor apparatus, including the steps of: step 1, providing a semiconductor substrate, wherein the semiconductor substrate is provided with a patterned photoresist layer and placed in a reaction chamber; step 2, introducing a first etching gas into the reaction chamber to perform a first etching process to form a trench, wherein the first etching gas includes sulfur hexafluoride, oxygen, helium, nitrogen trifluoride, and a first organic silicide; step 3, introducing a second etching gas into the reaction chamber to perform a second etching process to further etch the trench, wherein the second etching gas includes sulfur hexafluoride, oxygen, helium, and a second organic silicide; and step 4, introducing a third etching gas into the reaction chamber to perform a third etching process, wherein the third etching gas includes hydrobromic acid, oxygen, and helium.

Abstract: An extreme ultraviolet (EUV) lithography system includes an extreme ultraviolet (EUV) radiation source to emit EUV radiation, a collector for collecting the EUV radiation and focusing the EUV radiation, a reticle stage for supporting a reticle including a pellicle for exposure to the EUV radiation, and at least one sensor configured to detect particles generated due to breakage of the pellicle.

Abstract: An unmanned vehicle module can include, in some aspects, a landing platform including a landing area for receiving an unmanned vehicle, wherein the landing area includes a predetermined charging region; a first charging plate; a second charging plate, wherein the first charging plate and the second charging plate are positioned in the predetermined charging region; an electrical energy storage device for connecting electrically with the first charging plate and with the second charging plate; and an unmanned vehicle alignment mechanism configured to move the unmanned vehicle into the predetermined charging region; wherein the unmanned vehicle alignment mechanism includes a first beam, a second beam, a third beam, a fourth beam, and an actuation device for actuating at least two of the first beam, the second beam, the third beam, and the fourth beam to push the unmanned vehicle into the charging region.

Abstract: An electronic apparatus, a wireless input device and a control method thereof are provided. The wireless input device includes a wireless signal receiver, a control chip, and a wireless signal transmitter. The wireless signal receiver receives a radio frequency signal. The control chip is activated according to the radio frequency signal and generates operation power according to the radio frequency signal. The control chip generates input information by detecting an input operation on an input interface based on the operation power. The wireless signal transmitter transmits the input information to an external electronic apparatus based on the operation power.

Abstract: A fuel gas nozzle used in a microturbine includes a first chamber, a second chamber connected to the first chamber, a pilot fuel gas pipe, a main fuel gas pipe and an intake pipe. An intake zone and a mixing zone are respectively formed in the first chamber and the second chamber and are communicated with each other. The pilot fuel gas pipe is for introducing a first fuel gas into a downstream of the second chamber. The main fuel gas pipe is for introducing a second fuel gas into the mixing zone via the intake zone. The intake pipe is for introducing an air into the mixing zone. A centerline of the intake pipe is not intersected with a centerline of the second chamber, so as to induce a vortex flow field of the air flowing into the mixing zone for mixing the air and the second fuel gas.

Abstract: A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.

Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.

Abstract: A memory device includes a memory circuit and a fuse protection circuit. The memory circuit includes a program line and a fuse. The program line is configured to receive a program voltage for programming the fuse. The fuse protection circuit is coupled to the memory circuit and is configured to prevent unintentional programming of the fuse.

Abstract: The present invention provides a wireless communication device and a subscriber identity module card in a wireless communication device. The subscriber identity module card comprises a flat plate carrier, a subscriber identity module circuit and a gas sensing chip. The flat plate carrier comprises a first surface where the subscriber identity module circuit is disposed, a second surface where the gas sensing chip is disposed, a through hole, and an electrical contact portion passing through the through hole and extending to reach the first surface and the second surface. The electrical contact portion is electrically connected to the subscriber identity module circuit and the gas sensing chip. The gas sensing chip is disposed on a portion of the subscriber identity module card where not occupied by the subscriber identity module circuit. Thus, the wireless communication device provides gas sensing function without additionally equipping with an external gas sensing element.

Abstract: Some embodiments relate to a bond pad structure of an integrated circuit (IC). The bond structure includes a bond pad and an intervening metal layer positioned below the bond pad. The intervening metal layer has a first face and a second face. A first via layer is in contact with the first face of intervening metal layer. The first via layer has a first via pattern including a single via. The bond structure also includes a second via layer in contact with the second face of the intervening metal layer. The second via layer has a second via pattern that is different than first via pattern. The second via pattern includes a first via surrounding a second via. The first and second vias are concentric with one another about a central point of the second via layer.