Abstract: A shielded shell (1) for interconnecting a camera module to a printed circuit board via a flexible printed circuit board comprises a base wall and a frond wall, a back wall, a left wall and a right wall cooperatively defining a receiving space. A plurality of spring fingers is integrally formed on one of the bottom wall and sidewalls. Therefore, the procedure is simply and a better electrical path is provided between the camera module and the printed circuit board.

Abstract: A shielded connector (1) for electrically connecting a camera module to a printed circuit board at least comprises a metal housing (10) configured by a base and four sidewalls and a spring (20) against with the base of the housing. And one of the sidewall includes a fixed portion and a flexible portion. Said flexible portion defines a latchable portion against with the camera module, which extends from an adjacent sidewall to said sidewall towards the opposite sidewall to said adjacent sidewall. Therefore, the elastic of the flexible portion is improved and a better electrical connection is provided between the camera module and a circuit board.

Abstract: An electrical card connector for receiving a card comprises an insulating housing with a plurality of contacts, a cover, and a pivoting mechanism moveably connecting the cover and the housing. A pair pivoting portions is disposed on the opposite sides of a rear end of the cover, and a pair of mounting portions is disposed on an end of the housing corresponding to the pivoting portions. The connector further comprises an enforcing member having a pair of pivoting wings mounted to the mounting portions of the housing, and each pivoting wing has a pivoting hole for moveably connecting the pivoting portion of the cover. The pivoting wing of the enforcing member and the pivoting portion of the cover together form the pivoting mechanism.

Abstract: An electrical connector for connecting a flexible printed circuit, comprising: a housing comprising a base portion and a mating portion extending forwardly from the base portion; a plurality of electrical contacts received in the housing; and an actuator pivotally mounted to the housing for rotating movement between an opened position and a closed position, the actuator comprising a flat member, a pair of supporting mechanism each integrally formed on opposite ends of the flat member, and an arrangement provided adjacent to the supporting mechanism limiting pivotal movement of the actuator when the actuator in the opened position.

Abstract: A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.

Abstract: An immersion lithography system is disclosed to comprise a fluid containing feature for providing an immersion fluid for performing immersion lithography on a wafer, and a seal ring covering a predetermined portion of a wafer edge for preventing the immersion fluid from leaking through the covered portion of the wafer edge while the fluid is used for the immersion lithography.

Abstract: A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.

Abstract: A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate.

Abstract: A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate.

Abstract: A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate.