Patents by Inventor Chun-An Lin

Chun-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136463
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Applicant: EPISTAR CORPORATION
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Publication number: 20240137875
    Abstract: A method for adjusting time-averaged (TA) parameters of a transmitting (TX) power of a radio module includes: obtaining at least one message of the at least one other radio module or at least one message of the radio module; determining a scenario of the TX power of the radio module according to the at least one message of the at least one other radio module or the at least one message of the radio module; determining whether the scenario is different from a predetermined scenario of the TX power of the radio module; and in response to the scenario being different from the predetermined scenario, adjusting the TA parameters according to the scenario.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yi-Ying Huang, Yi-Hsuan Lin, Han-Chun Chang
  • Publication number: 20240132887
    Abstract: Disclosed herein are, inter alia, inhibitors of protein arginine methyltransferase 9 and pharmaceutical compositions thereof, and methods comprising the use of protein arginine methyltransferase 9 inhibitors for the treatment of a protein arginine methyltransferase 9-modulated disease or disorder, such as a hematological cancer.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 25, 2024
    Applicants: City of Hope, Western University of Health Sciences
    Inventors: Ling Li, Haojie Dong, Lei Zhang, Xin He, Yun Lyna Luo, Yi-Chun Lin
  • Patent number: 11967596
    Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
  • Patent number: 11967532
    Abstract: A method of forming a semiconductor structure includes forming a semiconductor fin over a substrate, forming a dummy gate stack over the semiconductor fin, depositing a dielectric layer over the dummy gate stack, and selectively etching the dielectric layer, such that a top portion and a bottom portion of the dielectric layer form a step profile. The method further includes removing portions of the dielectric layer to form a gate spacer and subsequently forming a source/drain feature in the semiconductor fin adjacent to the gate spacer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ta-Chun Lin, Kuo-Hua Pan, Chih-Yung Lin, Jhon Jhy Liaw
  • Patent number: 11967772
    Abstract: An antenna rotation structure includes a rotating shaft member rotatably disposed through a perforated groove of a housing, an annular member, and an elastic member. The rotating shaft member has a holding portion located in an accommodating space of the housing, a connecting portion connected to the holding portion and with an annular groove, and a gripping portion with one end connected to the connecting portion and the other end protruded from the housing. The annular member is disposed in the annular groove and abuts the perforated groove. The elastic member is sleeved on the one end of the gripping portion. The connecting portion and the one end of the gripping portion are disposed in the perforated groove. The gripping portion is turned to drive the rotating shaft member to rotate, thereby adjusting an angle of the antenna.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: April 23, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Chih-Feng Yang, Chao-Chun Lin, Shih Fong Huang
  • Patent number: 11967558
    Abstract: A wafer stack structure includes an interlayer, a first wafer, and a second wafer. The interlayer has a first surface and a second surface opposite to the first surface. The intermediate layer includes a dielectric material layer and a redistribution layer embedded in the dielectric material layer. The first wafer is disposed on the first surface of the interlayer. The second wafer is disposed on the second surface of the interlayer. The second wafer is electrically connected to the first wafer through the redistribution layer of the interlayer.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 23, 2024
    Assignees: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shou-Zen Chang, Chun-Lin Lu, Jium-Ming Lin
  • Patent number: 11965069
    Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 23, 2024
    Assignee: FAR EASTERN NEW CENTURY CORPORATION
    Inventors: Li-Ling Chang, Yow-An Leu, Ting-Yu Lin, Ching-Chun Tsai, Wen-Yi Chang
  • Patent number: 11967601
    Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: April 23, 2024
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Chao-Wen Wu, Chun-Bin Wen, Chien-Lin Lai, Hsing-Ying Lee
  • Publication number: 20240123151
    Abstract: An insertion device includes an upper casing, an insertion module and a lower casing. The insertion module is disposed in the upper casing, and includes a main body assembly, an insertion seat, a first elastic member, a retraction seat and a second elastic member. When the upper casing is depressed, the insertion seat is driven by the first elastic member to perform an automatic-insertion operation, such that limiting structure between the insertion seat and the retraction seat collapses upon the collapse of another limiting structure between the insertion seat and the main body assembly, and that the retraction seat is driven by the second elastic member to perform an automatic-retraction operation.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen, Chen-Hao Lee, Kuan-Lin Chang
  • Publication number: 20240130080
    Abstract: An immersion cooling system is provided. It includes a pressure seal tank, an electronic module, a blower, and a distributor plate. The pressure seal tank contains a cooling liquid, and a gas outlet is disposed on the top or a sidewall of the pressure seal tank, a gas inlet is disposed on the bottom of the pressure seal tank. The gas outlet is higher than the liquid level of the cooling liquid. The electronic module is disposed in the pressure seal tank and immersed in the cooling liquid. The blower is communicated with the pressure seal tank and configured to extract the gas from the gas outlet and inject the gas into the pressure seal tank via the gas inlet. The distributor plate is disposed in the pressure seal tank and located between the electronic module and the gas inlet.
    Type: Application
    Filed: July 12, 2023
    Publication date: April 18, 2024
    Inventors: Ren-Chun CHANG, Wei-Chih LIN, Zih-Yang FAN
  • Publication number: 20240128987
    Abstract: A decoding method, a memory storage device and a memory control circuit unit are disclosed. The method includes: activating a decoding circuit which supports a plurality of decoding modes each corresponding to a threshold value, wherein a distribution of the threshold value corresponds to error correction abilities of the decoding modes; reading first data from a rewritable non-volatile memory module; performing, by the decoding circuit, a first decoding operation on the first data; obtaining a decoding parameter according to an execution result of the first decoding operation; and performing, by the decoding circuit, a second decoding operation on the first data based on a first decoding mode among the decoding modes according to a relative numerical relationship between the decoding parameter and the threshold value.
    Type: Application
    Filed: November 28, 2022
    Publication date: April 18, 2024
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Shih-Jia Zeng, Yi-Fang Chang, Chun-Wei Tsao, Chen-An Hsu, Wei Lin
  • Publication number: 20240128992
    Abstract: A programmable filter for electronic signals. The filter includes an input that splits power of the input signal along two paths, a first and second path that is phase shifted by ninety degrees in respect of the first path. The first and second path are each modulated to the optical domain, and provided as input to respective filter chains. The in-phase signal can be filtered by IIR or FIR optical filters with configurable operation, as well the shifted signal can be filtered by a second chain of IIR and FIR optical filters with configurable operation. Resulting output from each filter chain is recombined and demodulated from the optical domain. In this manner, the electronic filter can adopt any suitable impulse response, including impulse responses described with complex coefficients. Real parts can be configured by operation of the first filter chain and imaginary parts by operation of the second filter chain.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 18, 2024
    Inventors: Farzad Mokhtari-Koushyar, Thien-An Nguyen, Che-Chun Lin
  • Publication number: 20240128178
    Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.
    Type: Application
    Filed: February 8, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Hung LIN, Wei-Ming WANG, Su-Chun YANG, Jih-Churng TWU, Shih-Peng TAI, Kuo-Chung YEE
  • Publication number: 20240130088
    Abstract: A fluid cooling system for computer cabinets includes a frame, a fluid circulation device, a chassis distributor, at least one mainboard end module, a cold fluid channel and a hot fluid channel. The frame is installed in the accommodation space in a movable pulling manner; the chassis distributor is installed on an outer side of the frame and connected to the fluid circulation device; the cold fluid channel and the hot fluid channel are provided for connecting the chassis distributor to the mainboard end module; and the chassis distributor includes a chassis cold exhaust pipe and a chassis heat pipe, such that a working fluid flowing through the mainboard end module can have a hot and cold separation, and finally return to the fluid circulation device to form a circulating flow.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventor: CHUN-LIN CHENG
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20240124868
    Abstract: Disclosed is an expression vector comprising a polynucleotide encoding for a glutamine synthetase with reduced activity compared to a wild type glutamine synthetase. Also disclosed are host cells, methods for preparing stable cell line, methods of producing polypeptide of interest, and kits thereof.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 18, 2024
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Pao Chun Lin, Zhiwei Song
  • Patent number: 11962328
    Abstract: A decoding method, a memory storage device and a memory control circuit unit are disclosed. The method includes: activating a decoding circuit which supports a plurality of decoding modes each corresponding to a threshold value, wherein a distribution of the threshold value corresponds to error correction abilities of the decoding modes; reading first data from a rewritable non-volatile memory module; performing, by the decoding circuit, a first decoding operation on the first data; obtaining a decoding parameter according to an execution result of the first decoding operation; and performing, by the decoding circuit, a second decoding operation on the first data based on a first decoding mode among the decoding modes according to a relative numerical relationship between the decoding parameter and the threshold value.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: April 16, 2024
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Shih-Jia Zeng, Yi-Fang Chang, Chun-Wei Tsao, Chen-An Hsu, Wei Lin
  • Patent number: 11961912
    Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-An Lin, Wei-Yuan Lu, Feng-Cheng Yang, Tzu-Ching Lin, Li-Li Su
  • Patent number: 11961546
    Abstract: A reference circuit for generating a reference current includes a plurality of resistive elements including at least one magnetic tunnel junction (MTJ). A control circuit is coupled to a first terminal of the at least one MTJ and is configured to selectively flow current through the at least one MTJ in the forward and inverse direction to generate a reference current.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Fu Lee, Hon-Jarn Lin, Po-Hao Lee, Ku-Feng Lin, Yi-Chun Shih, Yu-Der Chih